Method and apparatus for inspecting articles

• US 4,688,939 A
• Filed: 12/27/1985
• Issued: 08/25/1987
• Est. Priority Date: 12/27/1985
• Status: Expired due to Term

• Current Assignee: Agere Systems Incorporated (Broadcom, Inc.)
• Original Assignee: AT&T Teleholdings Incorporated (AT&T, Inc.)
• Inventors: Ray, Rajarshi
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Koren, Matthew W.
• Application Number:
  US06/813,747
• Time in Patent Office: 606 Days
• Field of Search: 356/237, 250/562, 250/572, 358/106
• US Class Current: 356/237.5
• CPC Class Codes: G01N 2021/8887 based on image processing techniques
• CPC Class Codes: G01N 2021/95646 Soldering
• CPC Class Codes: G01N 21/95684 Patterns showing highly reflecting parts, e.g. metallic elements
• CPC Class Codes: G01N 2201/102 Video camera

Abstract

Automated inspection of solder bumps (18--18) on a major surface (14) of a chip carrier (10) is accomplished by placing the chip carrier on a platform (22) beneath a ring light (28) which is in registration with a television camera (30). Light from the ring light, which is directed at an angle towards all sides (12--12) of the chip carrier, is only reflected upwardly into the television camera by the solder bumps. The output signal of the television camera, which varies with the intensity of the light reflected from the solder bumps, is processed by a vision system (32) to obtain a one-dimensional plot of the light intensity. The one-dimensional intensity plot is analyzed automatically by the vision system to detect for missing, bridged or excessive solder bumps on the chip carrier.

Claims

1. A method for inspecting an article having at least one light-reflective topographical feature on a planar surface thereof comprising the steps of:

illuminating the planar surface of the substrate with light;

sensing the intensity of the light reflected upwardly from the article;

establishing a profile of the cumulative intensity of the upwardly reflected light along an inspection axis on the planar surface of the article by summing the magnitudes of the intensities along an axis orthogonal to said inspection axis; and

analyzing said intensity profile to determine the existence and condition of each said topographical feature.

2. The method according to claim 1 wherein the planar surface of the article is illuminated by directing the light downwardly towards the surface from all sides thereof so that the light is at an acute angle with the surface.

3. The method according to claim 2 wherein the light is directed downwardly towards the surface from all side thereof by positioning the article below a ring lamp.

4. The method according to claim 1 wherein the intensity profile is analyzed for defects by examining the intensity profile for the presence of peaks and evaluating the characteristics thereof.

5. The method according to claim 1 wherein only the intensity of the light reflected vertically upwardly from predetermined regions of interest on the article is sensed.

6. A method of inspecting a chip carrier for the presence of light-reflective solder bumps on a major surface thereof comprising the steps of:

illuminating the major surface of the chip carrier by directing light thereat at an acute angle therewith from all sides thereof so that only the light striking a light reflective solder bump on the major surface of the chip carrier is reflected upwardly;

sensing the intensity of the upwardly reflected light;

establishing a profile of the cumulative intensity of the upwardly reflected light along an inspection axis on the major surface of the chip carrier by summing the magnitudes of the intensities along an axis orthogonal to said inspection axis; and

analyzing said intensity profile by examining for the presence of peaks therein and evaluating the characteristics thereof to determine the existence and condition of the solder bumps on the chip carrier.

7. The method according to claim 6 wherein the major surface on said chip carrier is illuminated by positioning the chip carrier within a ring lamp.

8. The method according to claim 6 wherein only the intensity of the beams reflected vertically upwardly from predetermined regions of interest on the major surface of the chip carrier is sensed.

9. An apparatus for inspecting an article having at least one light-reflective topographical feature on a planar surface thereof comprising:

means for illuminating the planar surface of the article with light;

means for sensing the intensity of the light reflected upwardly from the article;

means, coupled to said sensing means, for establishing a profile of the cumulative intensity of the upwardly reflected light along an inspection axis on the planar surface of the article by summing the magnitudes of the intensities along an axis orthogonal to said inspection axis; and

means, coupled to said establishing means, for analyzing the intensity profile to detect the existence and condition of each said topographical feature.

10. The invention according to claim 9 wherein said illuminating means comprises a ring lamp.

11. The invention according to claim 9 wherein said sensing means comprises a television camera.

12. The invention according to claim 9 wherein said establishing means and said analyzing means comprise a vision system.

13. Apparatus for inspecting a major surface of a chip carrier for the presence of light-reflective solder bumps thereon comprising:

a platform for supporting a chip carrier so that the major surface thereof is face-up;

a ring lamp supported by said platform a distance above said chip carrier for directing beams of light downwardly towards the surface of the chip carrier from all sides thereof, with each beam at an acute angle with the said surface of said chip carrier so that only the solder bumps on said surface reflect the beams of light upwardly;

a television camera supported by said platform above, and in registration with, said ring lamp for sensing the intensity of the upwardly reflected beams of light and for producing an output signal which varies accordingly; and

a vision system coupled to said television camera and responsive to the output signal thereof for establishing a profile of the cumulative intensity of the upwardly reflected light along an inspection axis on said surface of said chip carrier by summing the magnitude of the intensities along an axis orthogonal to said inspection axis and for analyzing said intensity profile to determine the existence and condition of said solder bumps by examining for the presence of peaks in the intensity profile and evaluating the characteristics thereof.