Pattern forming method

• US 4,690,880 A
• Filed: 05/05/1986
• Issued: 09/01/1987
• Est. Priority Date: 07/20/1984
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Morimoto, Kenji, Suzuki, Hideyuki, Masaki, Yuichi, Terada, Katsunori
• Primary Examiner(s): Kittle, John E.
• Assistant Examiner(s): Ryan, Patrick J.
• Application Number:
  US06/860,698
• Time in Patent Office: 484 Days
• Field of Search: 430/22, 430/313, 430/323, 430/329, 430/394
• US Class Current: 430/313
• CPC Class Codes: G03F 7/2002 with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
• CPC Class Codes: G03F 9/00 Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically G03F7/22 takes precedence; preparation of photographic masks G03F1/00; within photographic printing apparatus for making copies G03B27/00

Abstract

A method of forming a pattern on a surface of a workpiece. The workpiece surface is coated with photoresist. Part of the coated workpiece surface is exposed and developed to form an alignment mark. An unexposed portion of the photoresist coated workpiece surface is then exposed, developed and etched.

Claims

1. A method of forming a pattern on a surface of a workpiece, comprising the steps of coating the workpiece surface with photoresist, imagewise exposing, developing and etching the coated workpiece surface, said further particularly method including the steps of coating the workpiece surface with photoresist, first imagewise exposing part of the photoresist coated surface, developing the just exposed part, then imagewise exposing the unexposed portion of the coated photoresist, developing the just exposed photoresist portion and etching the workpiece.

3. A method according to claim 1, wherein part of the photoresist coated workpiece surface to be first exposed and developed involves an alignment mark.

5. A method according to claim 1, further comprising the step of cleansing the workpiece before coating the workpiece surface with photoresist, wherein said cleansing step is performed only once.

7. A method according to claim 1, wherein said first exposing step comprises the step of exposing part of the photoresist coated surface with radiation through an alignment mark pattern to produce an alignment mark on said surface, wherein said unexposed portion exposing step comprises the steps of:

exposing a portion of said unexposed portion from said alignment mark to one end of said surface and then exposing the portion of said unexposed portion from said alignment mark to the other end of said surface.

8. A method according to claim 7, wherein said unexposed portion exposing step further comprises the step of displacing said workpiece after said step of exposing a portion of said unexposed portion from said alignment mark to one end of said surface and before said step of exposing the portion of said unexposed portion from said alignment mark to the other end of said surface.

11. A method according to claim 1, wherein said coating step is performed only once.

2. A method of forming a pattern on a surface of a workpiece, comprising the steps of coating the workpiece surface with photoresist, imagewise exposing, developing and etching the coated workpiece surface, said method further particularly including the steps of coating the workpiece surface with photoresist, first imagewise exposing part of the photoresist coated surface, developing the just exposed part, etching the just developed part, then imagewise exposing an unexposed portion of the coated photoresist, developing the just exposed unexposed portion, and etching the just etched part.

4. A method according to claim 2 wherein part of the photresist coated workpiece surface to be first exposed and developed involves an alignment mark.

6. A method according to claim 2, further comprising the step of cleansing the workpiece before coating the workpiece surface with photoresist, wherein said cleansing step is performed only once.

9. A method according to claim 2, wherein said first exposing step comprises the step of exposing part of the photoresist coated surface with radiation through an alignment mark pattern to produce an alignment mark on said surface, wherein said unexposed portion exposing step comprises the steps of:

exposing a portion of said unexposed portion from said alignment mark to one end of said surface and then exposing the portion of said unexposed portion from said alignment mark to the other end of said surface.

10. A method according to claim 9, wherein said unexposed portion exposing step further comprises the step of displacing said workpiece after said step of exposing a portion of said unexposed portion from said alignment mark to one end of said surface and before said step of exposing the portion of said unexposed portion from said alighment mark to the other end of said surface.

12. A method according to claim 2, wherein said coating step is performed only once.

13. A method according to calim 1, wherein said etching step is performed only once.