Transducer device
First Claim
1. A transducer device comprising:
- a silicon microtransmitter chip, a housing for said chip comprising top and bottom transversely-displaced insulative closures having their front ends in registration at an interface between them in a transversely central region of said housing, and having respective acoustic cavities extending rearwardly thereinto from their front ends, said closures at their front ends having respective end surfaces facing towards each other and extending around the respective acoustic cavities formed in said closures and separated from each other by a discontinuity between them providing said interface between said closures, said top closure having a sound port formed in the top thereof to communicate with the cavity therein, chip-mounting means mounting said chip in said region in longitudinally and laterally centralized relation in said housing so that said chip is between said cavities, and closure coupling means comprising parts integral with, respectively, said top closure and bottom closure and snap-fittable together to lock said closures together in predetermined fixed relation and to cause said end surfaces to be in flush pressure engagement with each other at said interface when said closures are locked together by said closure coupling means.
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Accused Products
Abstract
A silicon micro-transmitter chip is housed within top and bottom closures snap-fitted together by legs and catches on the two closures. The chip is mounted between two acoustic cavities in the closures by a plate part of a configured metal sheet having other strip parts extending through grooves in the bottom closure to its outside where the strips are bent to provide arms for surface mounting the entire device on a printed wiring board. The sheet serves both as a continuous strap for effecting such surface mounting and as an electrode for connecting a terminal of the chip to ground. Other terminals of the chip are connectable to the board by flat leads passing through other grooves in the bottom closure to its outside where they are bent for surface mounting purposes. The housing formed by the two closures includes an adhesive impregnated gasket for providing an acoustic seal between the two cavities as to which the air pressures therein are equalized by a vent hole in the plate.
66 Citations
17 Claims
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1. A transducer device comprising:
- a silicon microtransmitter chip, a housing for said chip comprising top and bottom transversely-displaced insulative closures having their front ends in registration at an interface between them in a transversely central region of said housing, and having respective acoustic cavities extending rearwardly thereinto from their front ends, said closures at their front ends having respective end surfaces facing towards each other and extending around the respective acoustic cavities formed in said closures and separated from each other by a discontinuity between them providing said interface between said closures, said top closure having a sound port formed in the top thereof to communicate with the cavity therein, chip-mounting means mounting said chip in said region in longitudinally and laterally centralized relation in said housing so that said chip is between said cavities, and closure coupling means comprising parts integral with, respectively, said top closure and bottom closure and snap-fittable together to lock said closures together in predetermined fixed relation and to cause said end surfaces to be in flush pressure engagement with each other at said interface when said closures are locked together by said closure coupling means.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
- 12. A transducer device comprising, a silicon micro-transmitter chip, a housing having a hollow interior and a transversely displaced top and bottom and having at its top a sound port permitting sound waves to enter said interior, said housing having in a transversely central region thereof and on one longitudinal side thereof a passage therethrough from the inside to the outside of said housing, and metallic sheet means extending through said passage so as to have a part inside and a part outside said housing, such inside part mounting said chip in said interior to be disposed between and in acoustic communication with upper and lower acoustic cavities provided by said interior, and said outside part of said sheet means being bent so as to comprise a downwardly extending arm portion and an outwardly extending arm portion of which the latter is adapted to be bonded to metallic material on a printed wiring board so as both to surface mount said device on said board and to provide an electrical ground plane for said chip.
- 14. A surface mountable electronic component device comprising, an insulative housing for said device and having a top and a bottom, said housing have aperturing therein disposed intermediate its top and bottom and providing passage on longitudinally opposite sides of said housing between the inside and outside thereof, electronic means in said housing, and a longitudinally elongated metallic means extending through said aperturing to have a part thereof inside said housing and parts thereof disposed outside said housing on, respectively, one and the other of said longitudinally opposite sides of said housing, such outside parts being joined with said inside part in a continuous strap and being respectively shaped to be bondable to metallic material at respective longitudinally spaced locations on a printed wiring board to surface mount such device on such board.
- 16. An electronic component device comprising, a housing for said device comprising top and bottom transversely displaced insulative closures having their front ends in registration at an interface between them, said closures on longitudinally opposite sides of said housing being non-overlapping with each other in the transverse direction, electronic means in said housing, a plurality of electrical leads electrically connected to such means on the inside of said housing and passing therethrough on longitudinally opposite sides thereof to the outside thereof, and separate closure coupling means on laterally opposite sides of said housing and each comprising a set of cooperable parts integral with, respectively, said top closure and bottom closure, at least one part in each of such sets being outwardly resiliently deflectable relative to the one of said closures with which such part is integral so as to cause the parts in each of such sets to be snap-fittable together to lock said closures together in predetermined fixed translational and angular relation relative to each other.
Specification