Apparatus for producing semiconductor devices

• US 4,693,777 A
• Filed: 11/27/1985
• Issued: 09/15/1987
• Est. Priority Date: 11/30/1984
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Shibaura Seisakusho
• Original Assignee: Kabushiki Kaisha Tokiwaseisakusho, Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwami, Munenori, Suzuki, Noboru, Shibagaki, Masahiro, Hazano, Shigeki, Sensui, Reiichiro, Jyo, Hidetaka
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/802,468
• Time in Patent Office: 657 Days
• Field of Search: 156/345, 156/643, 156/646, 156/651, 156/656, 156/659.1, 156/665, 134/1, 134/102, 134/105, 134/201, 204/192 EC, 204/192 E, 204/298, 118/50, 118/50.1, 118/728-730, 118/620
• US Class Current: 156/345.31
• CPC Class Codes: B25J 9/107 of the froglegs type
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 21/324 Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering H01L21/20 - H01L21/288 and H01L21/302 - H01L21/322 take precedence
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67161 characterized by the layout of the process chambers
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

An apparatus for producing semiconductor devices in which a plurality of treatment chambers such as a load chamber, an etching chamber, a sputtering chamber, an ion implantation chamber, a CVD chamber, an unload chamber, a transfer chamber, a heat-treatment chamber, a rinsing chamber and the like, are connected in series preferably in the form of U for effecting various treatments of semiconductor wafers. Wafer conveyor and transfer means are provided to move a wafer through the treatment chambers in which the wafer is normally sequentially processed and these conveyor and transfer means are reversible so that a wafer which has been moved into a predetermined treatment chamber can be returned to the inlet of the apparatus, whereby the quantity of dust attached to the wafer in each treatment chamber can be easily and positively detected. In the heat-treatment chamber, the hot air is discharged against the upper surface of the wafer on the belt conveyor while a vertically movable heating plate is brought into contact with the undersurface of the wafer so that the uniform heat-treatment can be accomplished within a short period of time. Furthermore, the inner surfaces of the etching chamber or the like are lined with detachable linings made of, for instance, aluminum so that maintenance is facilitated.

Claims

1. An apparatus for producing semiconductor devices comprising:

a dry etching unit for dry etching a material to be treated, said dry etching unit having an etching chamber in which said material to be treated is etched, an electrode for applying RF power to said material to be treated which is securely held in position, a gas introduction means for introducing etching gases into said etching chamber, a loading chamber communicating with said etching chamber for transferring the material to be treated into said etching chamber, and an unloading chamber communicating with said etching chamber for transferring the material to be treated from said etching chamber into said unloading chamber;

a heat-treatment unit for heat treating said material dry-etched, said heat-treatment unit having a transfer chamber communicating with said unloading chamber of said dry etching unit for transferring the material to be treated from said unloading chamber, a heat-treatment chamber communicating with said transfer chamber, and heating means disposed in said heat-treatment chamber for heating the material to be treated; and

a water cleaning unit with a chuck for cleaning said material heat-treated with water while said chuck holds in position and rotates said material.

2. An apparatus as set forth in claim 1, further comprising:

a load cassette disposed at the inlet side of said loading chamber for holding a plurality of materials to be treated;

a first conveyor belt for transferring said material to be treated from said load cassette into said loading chamber;

a second conveyor belt disposed at the outlet side of said water cleaning unit for transporting said treated materials one at a time; and

an unload cassette for holding the treated materials transported by said second conveyor belt.

3. An apparatus as set forth in claim 1, wherein

one side wall of said loading chamber is directly connected to one side wall of said etching chamber;

one side wall of said unloading chamber is connected to the side wall adjacent to said one side wall of said etching chamber;

one side wall of said transfer chamber is connected to the side wall opposite to said one side wall of said unloading chamber;

one side wall of said heat-treatment chamber is connected to the side wall opposite to said one side wall of said transfer chamber; and

said water cleaning unit is connected to the side wall adjacent to said one side wall of said heattreatment chamber.

4. An apparatus as set forth in claim 2, wherein

one side wall of said etching chamber is connected to the side wall opposite to the inlet side wall of said loading chamber;

one side wall of said unloading chamber is connected to the side wall adjacent to said one side wall of said etching chamber;

one side wall of said transfer chamber is connected to the side wall opposite to said one side wall of said unloading chamber;

one side wall of said heat-treatment chamber is connected to the side wall opposite to said one side wall of said transfer chamber; and

the side wall opposite to said inlet side wall of said water cleaning unit is connected to the side wall adjacent to said one side wall of said heat-treatment chamber,

whereby said inlet side wall of said loading chamber and the outlet side wall of said water cleaning unit are directed in the same direction.

5. An apparatus for producing semiconductor devices comprising:

a dry etching unit for dry etching a material to be treated, said dry etching unit having an etching chamber in which said material to be treated is etched, an electrode for applying RF power to said material to be treated which is securely held in position and a gas introduction means for introducing etching gases into said etching chamber;

a heat-treatment unit having a contact heating means for making substantial contact with at least one surface of said material etched in said dry etching unit thereby to heat said material under atmospheric pressure; and

a transport means for transferring said material to be heated from said dry etching unit to said heat-treatment units, said transport means connected to said dry etching unit and said heat-treatment unit.

6. An apparatus as set forth in claim 5, further comprising a water cleaning unit with a chuck for cleaning said heat-treated material with water while said chuck holds in position and rotates said material.

7. An apparatus for producing semiconductor devices comprising:

a dry etching unit for dry etching a material to be treated, said dry etching unit having an etching chamber in which said material to be treated is etched, an electrode for applying RF power to said material to be treated which is securely held in position and a gas introduction means for introducing etching gases into said etching chamber;

a heat-treatment unit having a hot air blowing means for blowing hot air against at least one surface of said material etched in said dry etching unit thereby to heat said material under atmospheric pressure;

a transport means for transferring said material to be heated from said dry etching unit to said heat-treatment unit, said transport means connected to said dry etching unit and said heat-treatment unit.

8. An apparatus as set forth in claim 7, further comprising a water cleaning unit with a chuck for cleaning said heat-treated material with water while said chuck holds in position and rotates said material.

9. An apparatus for producing semiconductor devices comprising:

a plurality of treatment chambers for effecting a plurality of sequential treatments on a material to be treated, said plurality of treatment chambers being arranged in order of said sequential treatments; and

a conveyor means for transporting said material to be treated through said plurality of treatment chambers in one direction or in the opposite direction,

whereby said material to be treated which has been transported in one direction by said conveyor means through part of said plurality of treatment chambers can be transported in the opposite direction through said part of the plurality of treatment chambers, so that said material on which only part of said plurality of sequential treatments has been effected can be taken out from the inlet of said plurality of treatment chambers.

10. An apparatus as set forth in claim 9, further comprising:

a load cassette disposed at the inlet side of said plurality of treatment chambers for holding a plurality of materials to be treated;

a first conveyor belt for transferring said materials to be treated, which is held in said unload cassette, one at a time;

a second conveyor belt disposed at the outlet side of said plurality of treatment chambers for transferring one of said treated materials at a time; and

an unload cassette for holding the treated materials transferred by said second conveyor belt.

11. An apparatus as set forth in claim 9, wherein one of said plurality of treatment chambers is an etching chamber in which said material to be treated is etched.

12. An apparatus as set forth in claim 9, wherein at least one of said plurality of treatment chambers is a sputtering chamber in which said material to be treated is sputtered.

13. An apparatus as set forth in claim 9, wherein at least one of said plurality of treatment chambers is a CVD chamber in which a film is formed on said material to be treated by the gas-hase growth resulting from chemical reactions.

14. An apparatus as set forth in claim 9, wherein at least one of said plurality of treatment chamber is an ion implantation chamber in which impurity ions or dopants are implanted into said material to be treated.

15. An apparatus as set forth in claim 10, wherein at least one of said plurality of treatment chambers is an etching chamber in which said material to be treated is etched.

16. An apparatus as set forth in claim 10, wherein at least one of said plurality of treatment chambers is a sputtering chamber in which said material to be treated is sputtered.

17. An apparatus as set forth in claim 10, wherein at least one of said plurality of treatment chambers is a CVD chamber in which a film is formed on said material to be treated by the gas phase growth resulting from chemical reactions.

18. An apparatus as set forth in claim 10, wherein at least one of said plurality of treatment chambers is an ion implantation chamber in which impurity ions or dopants are implanted into said material to be treated.

30. An apparatus as set forth in claim 9,

said conveyor means having two carrying units, each of which comprises:

a first arm mounted on a supporting base and adapted to be rotatable about one end thereof by a rotary drive means;

a second arm rotatably attached to the other end of said first arm;

a stationary wheel disposed on said supporting base coaxially with a rotary shaft of said first arm;

a rotary wheel attached to a rotary shaft of said second arm connected to said first arm; and

a belt provided between said stationary wheel and said rotary wheel,

the two carrying units being symmetrically arranged, respective first arms being adapted to be symmetrically rotatable through a gear, respective second arms being interconnected at the ends thereof by a supporting plate.

31. An apparatus as set forth in claim 30, wherein said first arm and said second arm are made equal in length to each other;

and the ratio of the diameter of said stationary wheel to that of said rotary wheel is determined to be 2;

1.

32. An apparatus as set forth in claim 10, said conveyor means having two carrying units, each of which comprises:

a first arm mounted on a supporting base and adapted to be rotatable about one end thereof by a rotary drive means;

a second arm rotatably attached to the other end of said first arm;

a stationary wheel disposed on said supporting base coaxially with a rotary shaft of said first arm;

a rotary wheel attached to a rotary shaft of said second arm connected to said first arm; and

a belt provided between said stationary wheel and said rotary wheel,

the two carrying units being symmetrically arranged, respective first arms being adapted to be symmetrically rotatable through a gear, respective second arms being interconnected at the ends thereof by a supporting plate.

33. An apparatus as set forth in claim 32, wherein said first arm and said second arm are made equal in length to each other;

and the ratio of the diameter of said stationary wheel to that of said rotary wheel is determined to be 2;

1.

34. An apparatus as set forth in claim 30, wherein one of said plurality of treatment chambers is an etching chamber in which said material to be treated is etched.

35. An apparatus as set forth in claim 30, wherein at least one of said plurality of treatment chambers is a sputtering chamber in which said material to be treated is sputtered.

36. An apparatus as set forth in claim 30, wherein at least one of said plurality of treatment chambers is a CVD chamber in which a film is formed on said material to be treated by the gas-phase growth resulting from chemical reactions.

37. An apparatus as set forth in claim 30, wherein at least one of said plurality of treatment chambers is an ion implantation chamber in which impurity ions or dopants are implanted into said material to be treated.

38. An apparatus as set forth in claim 31, wherein one of said plurality of treatment chambers is an etching chamber in which said material to be treated is etched.

39. An apparatus as set forth in claim 31, wherein at least one of said plurality of treatment chambers is a sputtering chamber in which said material to be treated is sputtered.

40. An apparatus as set forth in claim 31, wherein at least one of said plurality of treatment chambers is a CVD chamber in which a film is formed on said material to be treated by the gas-phase growth resulting from chemical reactions.

41. An apparatus as set forth in claim 31, wherein at least one of said plurality of treatment chambers is an ion implantation chamber in which impurity ions or dopants are implanted into said material to be treated.

42. An apparatus as set forth in claim 32, wherein one of said plurality of treatment chambers is an etching chamber in which said material to be treated is etched.

43. An apparatus as set forth in claim 32, wherein at least one of said plurality of treatment chambers is a sputtering chamber in which said material to be treated is sputtered.

44. An apparatus as set forth in claim 32, wherein at least one of said plurality of treatment chambers is a CVD chamber in which a film is formed on said material to be treated by the gas-phase growth resulting from chemical reactions.

45. An apparatus as set forth in claim 32, wherein at least one of said plurality of treatment chambers is an ion implantation chamber in which impurity ions or dopants are implanted into said material to be treated.

46. An apparatus as set forth in claim 33, wherein one of said plurality of treatment chambers is an etching chamber in which said material to be treated is etched.

47. An apparatus as set forth in claim 33, wherein at least one of said plurality of treatment chambers is a sputtering chamber in which said material to be treated is sputtered.

48. An apparatus as set forth in claim 33, wherein at least one of said plurality of treatment chambers is a CVD chamber in which a film is formed on said material to be treated by the gas-phase growth resulting from chemical reactions.

49. An apparatus as set forth in claim 33, wherein at least one of said plurality of treatment chambers is an ion implantation chamber in which impurity ions or dopants are implanted into said material to be treated.

19. An apparatus for producing semiconductor devices comprising:

a dry etching unit for dry etching a material to be treated; and

a heat-treatment unit communicating with said dry etching unit, said heat-treatment unit having a case whose opposing side walls are formed with an inlet for said material to be treated and an outlet for said treated material, a transporting means for transporting said material to be treated from said inlet to said outlet of said case, and a heating means disposed adjacent to said transporting means for heating under atmospheric pressure said material which is transported by said transporting means, said heating means having a contact heating means for making substantial contact with at least one surface of the material.

20. An apparatus for producing semiconductor devices comprising:

a dry etching unit for dry etching a material to be treated; and

a heat-treatment unit communicating with said dry etching unit, said heat-treatment unit having a case whose opposing side walls are formed with an inlet for said material to be treated and an outlet for said treated material, a transporting means for transporting said material to be treated from said inlet to said outlet of said case, and a heating means disposed adjacent to said transporting means for heating under atmospheric pressure said material which is transported by said transporting means, said heating means having a hot air blowing means for blowing hot air against at least one surface of said material.

21. An apparatus for producing semiconductor devices comprising:

a dry etching unit for dry etching a material to be treated; and

a heat-treatment unit communicating with said dry etching unit, said heat-treatment unit having a case whose opposing side walls are formed with an inlet for said material to be treated and an outlet for said treated material, a transporting means for transporting said material to be treated from said inlet to said outlet of said case, and a heating means disposed adjacent to said transporting means for heating under atmospheric pressure said material which is transported by said transporting means, said heating means having a contact heating means for making substantial contact with at least one surface of said material and a hot air blowing means for blowing hot air against at least another surface of said material.

22. An apparatus for producing semiconductor devices comprising:

an etching unit for dry etching a material to be treated; and

a heat-treatment unit directly connected to said dry etching unit, said heat-treatment unit having a case whose opposing side walls are formed with an inlet for said material to be treated and an outlet for said treated material, respectively, a transportation means for transporting said material to be treated from said inlet to said outlet of said case, and a hot air blowing means which is disposed adjacent to said transportation means and which blows hot air against said material being transported by said transportation means to heat said material under atmospheric pressure.

23. An apparatus as set forth in claim 22, wherein said heat-treatment unit further includes shutter means which open or close said inlet and outlet of said case in response to the vertical movement of said contact heating means.

24. An apparatus for producing semiconductor devices comprising:

an etching unit for dry etching a material to be treated; and

a heat-treatment unit directly connected to said dry etching unit, said heat-treatment unit having a case whose opposite side walls are formed with an inlet for said material to be treated and an outlet for said treated material, respectively, a transportation means for transporting said material to be treated from said inlet to said outlet of said case, and a contact heating means which is disposed adjacent to said transportation means and which, in the case of heating, is raised to make substantial contact with at least one surface of said material being transported by said transportation means to heat said material under atmospheric pressure.

25. An apparatus as set forth in claim 24, wherein said heat-treatment unit further includes shutter means which open or close said inlet and outlet of said case in response to the vertical movement of said contact heating means.

26. An apparatus for producing semiconductor devices comprising:

an etching unit for dry etching a material to be treated; and

a heat-treatment unit directly connected to said dry etching unit, said heat-treatment unit having a case whose opposing side walls are formed with an inlet for said material to be treated and an outlet for said treated material, respectively, a transportation means for transporting said material to be treated from said inlet to said outlet of said case, a contact heating means which is disposed adjacent to said transportation means and which, in the case of heating, is raised to make substantial contact with at least one surface of said material being transported by said transportation means, and a hot air blowing means which is disposed adjacent to said transportation means and which blows hot air against said material whereby said contact heating means and said hot air blowing means heat said material under atmospheric pressure.

27. An apparatus as set forth in claim 26, wherein said heat-treatment unit further includes shutter means which open or close said inlet and outlet of said case in response to the vertical movement of said contact heating means.

28. An apparatus for producing semiconductor devices comprising:

a dry etching unit for dry etching a material to be treated, said dry etching unit having an etching chamber in which said material to be treated is etched, an electrode for applying RF power to said material to be treated which is securely held in position and a gas introduction means for introducing etching gases into said etching chamber;

a heat-treatment unit having a contact heating means for making substantial contact with at least one surface of said material etched in said dry etching unit and a hot air blowing means for blowing hot air against at least another surface of said material, whereby said material is heated under atmospheric pressure; and

a transport means for transferring said material to be heated from said dry etching unit to said heat-treatment unit, said transport means connected to said dry etching unit and said heat-treatment unit.

29. An apparatus as set forth in claim 28, further comprising a water cleaning unit with a chuck for cleaning said heat-treated material with water while said chuck holds in position and rotates said material.