Heat shielded memory unit for an aircraft flight data recorder

• US 4,694,119 A
• Filed: 12/31/1984
• Issued: 09/15/1987
• Est. Priority Date: 09/07/1983
• Status: Expired due to Term

• Current Assignee: Alliedsignal Inc. (Honeywell International Inc.)
• Original Assignee: Sundstrand Data Control, Inc. (Rtx Corporation)
• Inventors: Groenewegen, Johannes B.
• Primary Examiner(s): Grimley, Arthur T.
• Assistant Examiner(s): Tone, D. A.
• Application Number:
  US06/687,910
• Time in Patent Office: 988 Days
• Field of Search: 174/52 R, 174/52 PE, 220/88 R, 169/48, 109/82, 109/84
• US Class Current: 174/521
• CPC Class Codes: G11B 33/142 by air cooling
• CPC Class Codes: H05K 5/021 specially adapted for data recorders, e.g. for flight recorders
• CPC Class Codes: H05K 5/0213 Venting apertures; Constructional details thereof
• CPC Class Codes: H05K 7/005 arrangements of circuit components without supporting structure

Abstract

Solid state memory devices employed in crash survivable flight data recorders must be thermally insulated to prevent loss of stored data if the aircraft burns. To provide adequate thermal isolation at minimal size, the solid state electronic memory devices (26) are encapsulated in a synthetic organic wax or pentaerythritol (28) that exhibits a phase transition at a temperature: (a) above the normal operating temperature of the memory unit (10); and below the maximum acceptable peak temperature for the memory devices (26). The synthetic organic wax of pentaerythritol (28) is surrounded by a thermal liner (18) constructed of solid thermal insulating material. A metal enclosure (12) houses and protects the thermal liner (18), the synthetic organic was or pentaerythritol (28) and the memory devices (26).

Claims

1. An enclosure for thermally protecting one or more heat sensitive items from a high temperature environment, said enclosure comprising:

a metal outer housing including an interior cavity for containing said one or more heat sensitive items;

a first thermal insulator configured as a thermal liner that extends about the surface of said first interior cavity, said thermal liner defining a second interior cavity with said one or more heat sensitive items being spaced apart from the walls of said second interior cavity said first thermal insulator being a solid material and remaining solid when said enclosure is exposed to a high temperature environment; and

an amide wax, said wax occupying at least a portion of said interior cavity and encapsulating said one or more heat sensitive items said amide wax exhibiting a phase transition at a predetermined temperature, said predetermined temperature being selected to maintain said amide wax in a solid phase when said enclosure is not exposed to said high temperature environment and being selected to allow conversion of said amide wax to a liquid phase when said enclosure is exposed to said high temperature environment.

2. The enclosure of claim 1 wherein each of said one or more heat sensitive items is a solid state electronic memory device for storing data which is to be recovered from each of said solid state electronic memory device following exposure of said enclosure to said high temperature environment.

3. The enclosure of claim 1 wherein said amide wax is chemically defined as N,N'"'"'ethylenebisstearamide and N,N'"'"'distearoylethlenediamine.

4. The enclosure of claim 3 wherein each of said one or more heat sensitive items is a solid state electronic memory device for storing data which is to be recovered from each of said solid state electronic memory device following exposure of said enclosure to said high temperature environment.