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Press-packed semiconductor device

  • US 4,694,322 A
  • Filed: 09/13/1984
  • Issued: 09/15/1987
  • Est. Priority Date: 09/29/1983
  • Status: Expired due to Term
First Claim
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1. A press-packed semiconductor device, comprising:

  • a. a heat-discharging support member having a mounting surface;

    b. a lid disposed on said support member and defining a cavity therebetween;

    c. a press-packed semiconductor element disposed in said cavity and having first and second sides, a first electrode contact positioned on said first side, and second and third electrode contacts positioned on said second side, said semiconductor element being spaced-apart from said mounting surface of said support member with one of said sides facing said mounting surface;

    d. a first electrode plate including a first pressing portion disposed in said cavity and contacting said first side of said semiconductor element to form an electrical connection with said first electrode contact of said semiconductor element, said first electrode plate further including a lead portion extending from said first pressing portion through said lid and having an end positioned outside said cavity;

    e. a second electrode plate including a second pressing portion disposed in said cavity and spaced apart from said second side of said semiconductor element, said second electrode plate further including a lead portion extending from said second pressing portion through said lid and having an end positioned outside said cavity;

    f. a conducting plate disposed between said second side of said semiconductor element and said second pressing portion of said second electrode plate to form an electrical connection between said second electrode contact of said semiconductor element and said second electrode plate, said conducting plate including a through hole positioned at said third electrical contact of said semiconductor element;

    g. a lead wire extending through said through hole of said conducting plate and having an end portion contacting said third electrical contact of said semiconductor element to form an electrical connection between said lead wire and said third electrode contact;

    h. first pressing means for elastically pressing together said pressing portions of said first and second electrode plates to maintain said electrical connections between said first electrode contact of said semiconductor element and said first electrode plate and between said second electrode contact of said semiconductor element and said second electrode plate; and

    i. second pressing means for elastically pressing said end portion of said lead wire toward said third electrode contact of said semiconductor element to maintain said electrical connection between said lead wire and said third electrode contact.

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