Press-packed semiconductor device

• US 4,694,322 A
• Filed: 09/13/1984
• Issued: 09/15/1987
• Est. Priority Date: 09/29/1983
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Sakurai, Hiroshi, Iwasaki, Masami
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US06/650,107
• Time in Patent Office: 1,097 Days
• Field of Search: 357/74, 357/82, 357/75, 357/80, 357/79
• US Class Current: 257/785
• CPC Class Codes: H01L 2023/4025 Base discrete devices, e.g. presspack, disc-type transistors
• CPC Class Codes: H01L 2023/4081 Compliant clamping elements not primarily serving heat-conduction
• CPC Class Codes: H01L 23/40 Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/1301 Thyristor
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

A common insulation plate is provided on a heat-discharging support member, and a plurality of press-packed semiconductor elements is provided on the common insulation plate. These semiconductor elements are coupled to electrodes which form a common electrode by a plurality of spring mechanisms. An internal connection terminal is slidably provided at each of the electrodes and is bent perpendicular to a pressing surface. Each of the internal connection terminals faces the adjacent one. After the electrodes are pressed against the respective semiconductor elements with adjustment, the internal connection terminals are electrically coupled together.

Claims

1. A press-packed semiconductor device, comprising:

a. a heat-discharging support member having a mounting surface;

b. a lid disposed on said support member and defining a cavity therebetween;

c. a press-packed semiconductor element disposed in said cavity and having first and second sides, a first electrode contact positioned on said first side, and second and third electrode contacts positioned on said second side, said semiconductor element being spaced-apart from said mounting surface of said support member with one of said sides facing said mounting surface;

d. a first electrode plate including a first pressing portion disposed in said cavity and contacting said first side of said semiconductor element to form an electrical connection with said first electrode contact of said semiconductor element, said first electrode plate further including a lead portion extending from said first pressing portion through said lid and having an end positioned outside said cavity;

e. a second electrode plate including a second pressing portion disposed in said cavity and spaced apart from said second side of said semiconductor element, said second electrode plate further including a lead portion extending from said second pressing portion through said lid and having an end positioned outside said cavity;

f. a conducting plate disposed between said second side of said semiconductor element and said second pressing portion of said second electrode plate to form an electrical connection between said second electrode contact of said semiconductor element and said second electrode plate, said conducting plate including a through hole positioned at said third electrical contact of said semiconductor element;

g. a lead wire extending through said through hole of said conducting plate and having an end portion contacting said third electrical contact of said semiconductor element to form an electrical connection between said lead wire and said third electrode contact;

h. first pressing means for elastically pressing together said pressing portions of said first and second electrode plates to maintain said electrical connections between said first electrode contact of said semiconductor element and said first electrode plate and between said second electrode contact of said semiconductor element and said second electrode plate; and

i. second pressing means for elastically pressing said end portion of said lead wire toward said third electrode contact of said semiconductor element to maintain said electrical connection between said lead wire and said third electrode contact.

2. The press-packed semiconductor device according to claim 1, wherein said first pressing means includes:

an insulation member disposed on a side of said second pressing portion of said second electrode plate opposite said conducting plate;

an anchoring plate disposed on said insulation member;

means for fixing said anchoring plate to said support member; and

spring means for biasing said insulation member away from said anchoring plate and toward said second pressing portion of said second electrode plate.

3. The press-packed semiconductor device according to claim 2, wherein said fixing means includes a pair of bolts threadably connected to said support member.

4. The press-packed semiconductor device according to claim 2, wherein said spring means includes a cup spring disposed between said insulation member and said anchoring plate.

5. The press-packed semiconductor device according to claim 1, wherein said second pressing means includes:

means for electrically insulating said end portion of said lead wire from said conducting plate; and

spring means connected between said insulating means and said conducting plate for biasing said end portion of said lead wire toward said semiconductor element.

6. The press-packed semiconductor device according to claim 5, wherein:

said through hole of said conducting plate includes a spring support surface facing said semiconductor element;

said insulating means includes an insulating guide member disposed in said through hole and having an end face facing said semiconductor element, said lead wire extending through an interior portion of said guide member and said end portion of said lead wire being exposed at said end face of said guide member; and

said spring means includes a coil spring disposed between said spring support surface of said through hole and said guide member.

7. The press-packed semiconductor of claim 1, wherein said first, second, and third electrode contacts of said semiconductor device are, respectively, a collector contact, an emitter contact, and a base contact.

8. The press-packed semiconductor of claim 1, further comprising an insulating plate disposed between said mounting surface of said support member and said first pressing portion of said first electrode plate.

9. The press-packed semiconductor of claim 1, wherein said first and second pressing portions are substantially perpendicular to said first and second lead portions, respectively.

10. A press-packed semiconductor device, comprising:

a. a heat-discharging support member having a mounting surface;

b. a lid disposed on said support member and defining a cavity therebetween;

c. at least two press-packed semiconductor elements disposed in said cavity, each of said semiconductor elements having first and second sides, a first electrode contact positioned on said first side, and second and third electrode contacts positioned on said second side, each of said semiconductor elements being spaced apart from said mounting surface of said support member with one of said sides facing said mounting surface;

d. at least two first electrode plates each including a first pressing portion disposed in said cavity and contacting said first side of one of said semiconductor elements to form an electrical connection with said first electrode contact of said respective semiconductor element, each of said first electrode plates further including a first lead portion extending from said first pressing portion through said lid and having an end positioned outside said cavity;

e. at least two second electrode plates each including a second pressing portion disposed in said cavity and spaced apart from said second side of one of said semiconductor elements, at least one of said second electrode plates further including a second lead portion extending from said second pressing portion through said lid and having an end positioned outside said cavity;

f. at least two conducting plates each disposed between said second side of one of said semiconductor elements and said second pressing portion of one of said second electrode plates to form an electrical connection between said second electrode contact of said respective semiconductor element and said respective second electrode plate, each of said conducting plates including a through hole positioned at said third electrode contact of said respective semiconductor element;

g. at least two lead wires each extending through said through hole of one of said conducting plates and having an end portion contacting said third electrode contact of said semiconductor element positioned at said through hole of said respective conducting plate to form an electrical connection between said lead wire and said respective third electrode contact;

h. first pressing means for elastically pressing said second pressing portions of said second electrode plates toward said first pressing portions of said first electrode plates to maintain said electrical connections between said first electrode contacts of said semiconductor elements and said first electrode plates and between said second electrode contacts of said semiconductor elements and said second electrode plates; and

i. second pressing means for elastically pressing said end portions of said lead wires toward said third electrical contacts of said semiconductor elements to maintain said electrical connections between said lead wires and said third electrode contacts.

11. The press-packed semiconductor device according to claim 10, further comprising an insulating plate disposed between said mounting surface of said support plate and said first pressing portions of said first electrode plates.

12. The press-packed semiconductor device according to claim 11, wherein said first pressing portions of said first electrode plates are substantially coplanar.

13. The press-packed semiconductor device according to claim 10, further comprising means for electrically and mechanically connecting said first electrode plate contacting one of said semiconductor elements with said second electrode plate spaced apart from another of said semiconductor elements.

14. A press-packed semiconductor device, comprising:

a. a heat-discharging support member having a mounting surface;

b. a lid disposed on said support member and defining a cavity therebetween;

c. first and second press-packed semiconductor elements disposed adjacent each other in said cavity, each of said semiconductor elements having first and second sides, a first electrode contact positioned on said first side, and second and third electrode contacts positioned on said second side, each of said semiconductor elements being spaced apart from said mounting surface of said support member with one of said sides facing said mounting surface;

d. a pair of first electrode plates each including a first pressing portion disposed in said cavity and contacting said first side of one of said semiconductor elements to form an electrical connection with said first electrode contact of said respective semiconductor element, each of said first electrode plates further including a first lead portion extending from said first pressing portion through said lid and having an end positioned outside said cavity, said first electrode plate contacting said first semiconductor element further including a first internal connection terminal extending from said first pressing portion between said first and second semiconductor elements;

e. a pair of second electrode plates each including a second pressing portion disposed in said cavity and spaced apart from said second side of one of said semiconductor elements, said second electrode plate spaced apart from said first semiconductor element further including a second lead portion extending from said second pressing portion through said lid and having an end positioned outside said cavity, said second electrode plate spaced apart from said second semiconductor element further including a second internal connection terminal extending from said second pressing portion between said first and second semiconductor elements;

f. a pair of conducting plates each disposed between said second side of one of said semiconductor elements and said second pressing portion of one of said second electrode plates to form an electrical connection between said second electrode contact of said respective semiconductor element and said respective second electrode plate, each of said conducting plates including a through hole positioned at said third electrode contact of said respective semiconductor element;

g. a pair of lead wires each extending through said through hole of one of said conducting plates and having an end portion contacting said third electrode contact of said semiconductor element positioned at said through hole of said respective conducting plate to form an electrical connection between said lead wire and said respective third electrode contact;

h. first pressing means for elastically pressing said second pressing portions of said second electrode plates toward said first pressing portions of said first electrode plates to maintain said electrical connections between said first electrode contacts of said semiconductor elements and said first electrode plates and between said second electrode contacts of said semiconductor elements and said second electrode plates;

i. second pressing means for elastically pressing said end portions of said lead wires toward said third electrical contacts of said semiconductor elements to maintain said electrical connections between said lead wires and said third electrode contacts; and

j. means for mechanically and electrically connecting said first and second internal connection terminals.

15. The press-packed semiconductor device according to claim 14, wherein:

said first and second internal connection terminals are substantially parallel and each of said internal connection terminals has a free end with a slot opening out of said free end; and

said connecting means includes a bolt and nut assembly passing through said slots and clamping said internal connection terminal together.