Apparatus and method for opto-electronic package

• US 4,695,719 A
• Filed: 12/05/1983
• Issued: 09/22/1987
• Est. Priority Date: 12/05/1983
• Status: Expired due to Term

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Wilwerding, Dennis J.
• Primary Examiner(s): Bell, Janyce A.
• Application Number:
  US06/557,972
• Time in Patent Office: 1,387 Days
• Field of Search: 250/216, 250/239, 250/578, 350/167, 350/320
• US Class Current: 250/216
• CPC Class Codes: G02B 3/00 Simple or compound lenses
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

An opto-electronic package in which the cover of the package is made so as to have the optical components including lenslets, filters and masks as part thereof so that the assembly of the package may be simplified and that problems associated with different indices of thermal expansion among the parts is reduced.

Claims

1. In the process of making an opto-electronic package for ranging devices having a substrate, a die with electronic components and radiation detectors thereon, a plurality of lenslets with a mask therebetween mounted adjacent the die and a transparent cover adjacent the lenslets and mask and attached to the substrate so that radiation is directed by the lenslets to the detectors and not the electronic components, the improvement comprising:

constructing the lenslets in the cover on one side.

2. The process of claim 1 further comprising:

forming the mask on the cover between the lenslets.

3. The process of claim 2 further comprising:

forming a dichroic fitter on the cover.

17. The process of claim 1 wherein the constructing the lenslets in the cover is performed by a diffusion technique.

4. The method of constructing an opto-electronic package for ranging devices comprising the steps of:

(1) forming a plurality of lenslets in a transparent cover.

(2) mounting a die with electronic components and radiation detectors thereon to a substrate, and

(3) mounting the cover to the substrate so that the lenslets direct radiation to the detectors and not to the electronics components.

5. The method of claim 4 further comprising the step of applying an opaque material around the lenslets on the cover.

6. The method of claim 5 further including the step of depositing a dichroic filter on the cover to block radiation of undesired frequencies.

18. The method of claim 4 wherein the forming of a plurality of lenslets in the transparent cover is performed by a diffusion process.

7. An opto-electronic package for ranging devices comprising:

a substrate;

a die having electronic components and radiation detectors thereon attached to the substrate; and

a transparent cover having a plurality of lenslets formed therein and attached to the substrate so that the lenslets direct radiation to the detectors.

8. Apparatus according to claim 7 further including an opaque mask surrounding the lenslets on the cover so as to prevent radiation from reaching areas on the die other than the detectors.

9. Apparatus according to claim 8 further including a dichroic filter on the cover to block radiation of undesired frequencies.

10. Apparatus according to claim 7 wherein the transparent cover is glass.

11. Apparatus according to claim 10 wherein the lenslets are formed by a diffusion process.

19. The package of claim 7 wherein the transparent cover has the lenslets formed therein by a diffusion process.

12. A cover of transparent material for an opto-electronic package comprising:

a plurality of lenslets formed by a diffusion process on one side of the cover; and

an opaque material formed around the lenslets.

13. The cover of claim 12 further including a dichroic filter formed on the cover.

14. The cover of claim 12 wherein the transparent material is glass.

15. The method of constructing a cover for an opto-electronic package comprising the steps of:

(1) depositing a metal layer on one side of the cover,

(2) depositing a photoresist layer over the metal layer,

(3) exposing the photoresist to a predetermined pattern of light,

(4) developing the photoresist to soften the predetermined pattern,

(5) washing the rest away in the soft spots,

(6) etching the metal away in the exposed areas to leave spots in the pattern where lenslets are to be formed,

(7) forming the lenslets in the pattern by a diffusion process,

(8) removing the remaining metal, and

(9) repeating steps (1)-(6) to form a mask.

16. The method of claim 15 further including the step of depositing a dichroic fitter on the cover.