Method of manufacturing a film-type electronic device

• US 4,697,335 A
• Filed: 03/31/1986
• Issued: 10/06/1987
• Est. Priority Date: 03/31/1986
• Status: Expired due to Term

• Current Assignee: Hy-Meg Corporation
• Original Assignee: Hy-Meg Corporation
• Inventors: Pedersen, David, Cupidro, Vincent N.
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US06/846,105
• Time in Patent Office: 554 Days
• Field of Search: 29/620, 29/846, 156/155, 156/277, 156/239, 156/240, 427/149, 428/204
• US Class Current: 29/620
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/0284 Paper, e.g. as reinforcement paper sheet substrates H05K1/0386
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 2203/0531 Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
• CPC Class Codes: H05K 2203/0786 Using an aqueous solution, e.g. for cleaning or during drilling of holes
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: Y10T 29/49099 Coating resistive material on a base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24876 Intermediate layer contains particulate material [e.g., pigment, etc.]

Abstract

There is provided a soluble chemical layer affixed to a rigid backing, whereupon an electronic configuration is printed and covered with a lacquer. The pattern and lacquer coating are then separated from the backing by dissolving the soluble chemical. Once free, the pattern is transferred to and fused to the substrate.

Claims

1. A method of manufacturing a film-type electronic device comprising:

a. attaching a water soluble layer to a rigid reinforcing base,

b. applying a pattern of film having electrical properties to said soluble layer, and

c. drying said pattern of film while maintaining said soluble layer in attachment with said base;

d. applying a water insoluble top layer in adhering overlying relation to said pattern of film to provide support thereto.

2. The method of claim 1 further comprising:

a. dissolving said soluble layer to free said pattern of film and accompanying top layer, and

b. applying said pattern of film to a substrate.

3. The method of claim 2 wherein said pattern of film is applied through silk-screen methods to said soluble layer, and further comprising the step of drying said film pattern prior to application of said top layer.

4. The method of claim 3 further comprising the step of heating said substrate with the pattern of film applied to a temperature and for a duration sufficient to fuse the pattern of film to said substrate.

5. The method of claim 3 wherein said soluble layer is comprised of decalcomania paper adhered to said rigid reinforcing base.

6. The method of claim 5 wherein said reinforcing base is fluid absorbable to enhance the dissolution of said soluble layer.

7. A film-type electronic device comprising:

a. a substrate, and

b. a film pattern having electrical properties applied to said substrate by attaching a water soluble layer to a rigid reinforcing base,

applying a pattern of film having electrical properties to said soluble layer,

drying said pattern of film while maintaining said soluble layer in attachment with said base,

applying a water insoluble top layer in adhering overlying relation to said pattern of film to provide support thereto,

dissolving said soluble layer to free said pattern of film and accompanying top layer, and

applying said pattern of film to said substrate.