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Heatsink package for flip-chip IC

  • US 4,698,663 A
  • Filed: 12/03/1986
  • Issued: 10/06/1987
  • Est. Priority Date: 09/17/1986
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a substrate having at least one wiring layer formed on a top surface thereof;

    at least one semiconductor element mounted with a top face thereof downward on said substrate and electrically coupled to said wiring layer;

    a cap having at least one opening which is smaller than an external size of said semiconductor element, a peripheral portion of said cap being adhered on the top surface of said substrate and a portion of said cap around said opening being adhered on a bottom face of said semiconductor element to thereby hermetically seal said semiconductor element; and

    a heatsink member mounted on said cap, said heatsink member having a portion which fits into said opening and makes contact with the bottom face of said semiconductor element.

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