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Laser soldering apparatus and method

  • US 4,700,044 A
  • Filed: 07/31/1986
  • Issued: 10/13/1987
  • Est. Priority Date: 07/31/1986
  • Status: Expired due to Term
First Claim
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1. Apparatus for soldering fine wires to a solder pad on a microelectronic workpiece, the apparatus comprising:

  • (a) laser beam discharge means for soldering wires to a solder pad on a workpiece;

    (b) work station means including an X-Y-Z positioning fixture for aligning a laser beam from said laser beam discharge means upon a solder pad of a workpiece;

    (c) fixture means for holding a workpiece having solder pads such that said solder pads may be in alignment with said laser beam; and

    (d) said workstation means further including cone means including a cone constructed and arranged such that said laser beam passes through said cone, and said cone means including a cone holder constructed and arranged such that said cone may be positioned onto a wire placed over a solder pad such that said wire may be pushed into said solder pad solely by the weight of said cone when said solder pad is heated by a laser beam.

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