Laser soldering apparatus and method

• US 4,700,044 A
• Filed: 07/31/1986
• Issued: 10/13/1987
• Est. Priority Date: 07/31/1986
• Status: Expired due to Term

• Current Assignee: Hutchinson Technology Incorporated (TDK Corporation)
• Original Assignee: Hutchinson Technology Incorporated (TDK Corporation)
• Inventors: Hokanson, John M., Ziegler, David A., Field, Terrence G., Bentz, Kenneth S.
• Primary Examiner(s): Albritton, C. L.
• Application Number:
  US06/892,789
• Time in Patent Office: 439 Days
• Field of Search: 219/121 LC, 219/121 LD, 219/121 EC, 219/121 ED, 219/121 L, 219/121 LM, 219/85 BA, 219/85 BM
• US Class Current: 219/121.63
• CPC Class Codes: B23K 1/0056 soldering by means of beams, e.g. lasers, E.B.
• CPC Class Codes: B23K 26/10 using a fixed support , i.e. involving moving the laser beam
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 13/06 Wiring by machine
• CPC Class Codes: H05K 2201/10287 Metal wires as connectors or conductors
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Fine wires are soldered without flux to solder pads on a flexible circuit of a workpiece by a laser. The laser beam is aligned and moved over the solder pad to describe a rectangle by movement of mirrors on a programmed, motor driven X-Y-Z linear table. Wires are deeply sunk into the solder pads by the weight of a cone brought against the wire carried by the X-Y-Z table. Vaporized insulation is restrained within the cone to maintain a clean microelectronic workpiece.

Claims

1. Apparatus for soldering fine wires to a solder pad on a microelectronic workpiece, the apparatus comprising:

(a) laser beam discharge means for soldering wires to a solder pad on a workpiece;

(b) work station means including an X-Y-Z positioning fixture for aligning a laser beam from said laser beam discharge means upon a solder pad of a workpiece;

(c) fixture means for holding a workpiece having solder pads such that said solder pads may be in alignment with said laser beam; and

(d) said workstation means further including cone means including a cone constructed and arranged such that said laser beam passes through said cone, and said cone means including a cone holder constructed and arranged such that said cone may be positioned onto a wire placed over a solder pad such that said wire may be pushed into said solder pad solely by the weight of said cone when said solder pad is heated by a laser beam.

2. The apparatus of claim 1 further including conveyer means for moving workpieces having solder pads to a position in which said solder pads may be in alignment with said laser beam.

3. The apparatus of claim 1 wherein said cone means further includes a lens holder and lens, said lens holder and cone holder being rigidly connected to a table of said X-Y-Z positioning fixture.

7. The apparatus of claim 1 wherein said cone holder includes an aperture through which said cone may pass vertically due to gravity, said cone further including means for limiting vertical travel of said cone through said holder.

4. A method for laser soldering flexible, insulated wire to solder pads on a workpiece;

the method comprising the steps of;

(a) conveying a workpiece to a laser station, said workpiece having flexible, insulated wire to be soldered positioned above a solder pad;

(b) aligning a laser beam from said laser station over the wire and solder pad such that said wire is between said laser beam and said solder pad;

(c) depressing a cone means through which said laser beams passes over said solder pad so as to press said wire against said solder pad;

(d) applying a laser beam to said wire and solder pad to remove wire insulations and to solder said wire to said pad; and

(e) removing the cone means from said pad after said laser beam is removed from said pad.

5. The method of claim 4 wherein said laser beam is applied to said solder pad such that said beam describes a rectangular path on said solder pad.

6. The method of claim 4 wherein said laser beam traverses a rectangular path by moving laser beam aligning mirrors affixed to an X-Y-Z positioning fixture.