Method of making sealed housings containing delicate structures

• US 4,701,999 A
• Filed: 12/17/1985
• Issued: 10/27/1987
• Est. Priority Date: 12/17/1985
• Status: Expired due to Fees

• Current Assignee: PTO (Safe Fleet Holdings LLC)
• Original Assignee: PTO (Safe Fleet Holdings LLC)
• Inventors: Palmer, Clarence K.
• Primary Examiner(s): Grimley, Arthur T.
• Assistant Examiner(s): TONE, DAVID
• Application Number:
  US06/810,032
• Time in Patent Office: 679 Days
• Field of Search: 174/52 FP, 357/70, 29/588, 29/827, 264/272.17, 264/248, 264/259, 264/274
• US Class Current: 29/827
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/20752 larger or equal to 20 microns less than 30 microns
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

A method of making an integrated circuit package comprising an integrated "chip" within an hermetically sealed housing with external electrical leads extending from the chip terminals, and the product formed by such method. The method involves injection molding of a thermoplastic rim on and in sealed relation to a lead frame prior to locating the chip in the central region of the frame and installing fine wire connections from the chip terminals to the lead fingers. The housing is completed by a solid bottom wall insert sealed in the lower mouth of the rim and a solid top wall cap sealed to the upper mouth of the rim by procedures which involve no flowing of plastic material over or into contact with either (i) the upper surfaces of the lead fingers prior to making the wire connections to such fingers, or (ii) the chip and the wire connectors after they have been associated with the lead frame.

Claims

1. The method of sealing a delicate structure, connected to a flexibly deformable connection sheet, within a housing having a side wall rim extending between top and bottom walls, said delicate structure being subject to damage by passage of or contact with flowing plastic material, said method comprising in combination

(a) forming a bottom wall insert,

(b) forming a top wall cap,

(c) associating said connection sheet with a mold cavity while injecting a plastic material in flowable state, and causing said material to solidify, to form said rim which captures and bonds to said connection sheet,

(d) locating said bottom wall insert in general proximity to the region to be occupied by the lower edges of the rim,

(e) subsequent to said step (d), creating a seal between the edges of said bottom wall insert and said rim,

(f) subsequent to said step (c), installing said delicate structure and making connections between it and the exposed upper surfaces of said sheet,

(g) subsequent to said step (f), locating said top wall cap above the delicate structure and in proximity to the upper edges of said rim, and

(h) subsequent to said step (g), creating a seal between the edges of said cap and said rim, said step (d) being performed prior to step (c) and said steps (c) and (e) being performed concurrently.

2. The method set forth in claim 1 wherein said step (d) further includes bringing the bottom wall insert into underlying abutment with said connection sheet, and said steps (c) and (e) are carried out concurrently by associating said connection sheet and the abutting insert within a mold cavity which defines said rim in contact with the edges of the insert while injecting a plastic material in flowable state, and causing said material to solidify in intimate, sealing contact with the edges of said insert.

3. The method set forth in claim 2 further characterized in that said step (a) is carried out to form at least the edge portions of said bottom wall insert of a solidified thermoplastic material, and said steps (c) and (e) are both accomplished concurrently by injecting a thermoplastic material at elevated temperature and then permitting it to cool, whereby the edges of said insert are at least slightly melted by heat from the injected material and a fusion seal is formed between the insert edges and the resulting rim.

4. The method of sealing an integrated circuit chip within a housing and with externally extending leads for electrical connections, said method comprising, in combination,

(a) forming a bottom wall insert,

(b) forming a top wall cap,

(c) disposing said insert in underlying abutment with the central region of a lead frame sheet of conductive material, said lead frame having spaced lead fingers extending inwardly with their tips in proximity to a central region,

(d) disposing the abutting lead frame and insert in a mold cavity while injecting plastic material in a flowable state, and causing said material to solidify, to form a rim which captures and sealingly bonds to said lead frame, said rim surrounding and being spaced from the inner tips of said lead fingers, and said rim at the time of its formation being bonded and sealed to the edges of said bottom wall insert,

(e) installing the integrated circuit chip in the central region of said lead frame, and making conductive wire connections from terminals on the chip to the inner tips of respective lead fingers, and

(f) disposing said top cap in or at the upper region of said rim and creating a seal between the two.

5. The method set forth in claim 4 further characterized in that said step (a) is carried out to form at least the edge portions of said bottom wall insert of solidified thermoplastic material, and said step (d) is carried out by injecting a thermoplastic material at elevated temperature and then permitting it to cool, whereby said rim at the time of its formation becomes bonded and sealed by fusion to the edges of said insert.

6. The method of sealing an integrated circuit chip within a housing and with externally extending leads for electrical connections, said method comprising, in combination,

(a) forming a bottom wall insert,

(b) forming a top wall cap of a predetermined peripheral configuration,

(c) disposing said insert in underlying abutment with the central region of a lead frame sheet of conductive material, said lead frame having spaced lead fingers extending inwardly with tips bordering a central region,

(d) disposing the abutting lead frame and said insert in a first mold cavity while injecting plastic material in a flowable state, and causing said material to solidify, to form a rim which captures and bonds to said lead frame and intimately bonds to the edges of said insert, the resulting structure being a plastic box open only at its top through which the central region of said lead frame and the inner ends of the lead fingers are accessible, with the lead fingers backed-up by the insert and extending in sealed relation outwardly through the rim,

(e) installing the integrated circuit chip in the central region of said lead frame and making conductive wire connections from terminals on the chip to the inner tips of respective lead fingers,

(f) locating said top wall cap above the now-installed chip and wires, the predetermined peripheral configuration of said cap resulting in its edges being in proximity to the upper edge of said rim, and

(g) disposing the thus-located assembly in a second mold cavity while injecting plastic material in a flowable state, and causing said material to solidify and form a bonded bridge joining the edges of the cap and rim.

7. The method set forth in claim 6 further characterized in that said steps (d) and (g) are carried out by injecting a thermoplastic material at elevated temperature, whereby a fusion seal is formed between said rim and bridge during said step (g).

8. The method set forth in claim 6 further characterized in that said steps (a) and (b) are carried out to form at least the edge portions of said bottom wall insert and said top wall cap of solidified thermoplastic material, and the injecting of said steps (d) and (g) is carried out by injecting a thermoplastic material at elevated temperature, whereby said bottom insert and said rim are sealingly joined by fusion, and said top cap and the rim are each sealingly joined to said bridge by fusion.

9. The method set forth in claim 6 further characterized in that said step (b) is carried out to form the top wall cap in the shape of a plug which fits into the upper mouth formed by said rim, said plug--after said step (f) is completed--bearing against the lead frame in a region adjacent to the rim but spaced from and surrounding said central region, and said plug being free of contact with said chip and said wires.

10. The method of sealing a delicate structure, connected to a flexibly deformable connection sheet, within a housing having a side wall rim extending between top and bottom walls, said delicate structure being subject to damage by passage of or contact with flowing plastic material, said method comprising in combination

(a) forming a bottom wall insert,

(b) forming a top wall cap,

(c) associating said connection sheet with a mold cavity while injecting a plastic material in flowable state, and causing said material to solidify, to form said rim which captures and bonds to said connection sheet,

(d) locating said bottom wall insert in general proximity to the region occupied or to be occupied by the lower edges of the rim,

(e) subsequent to said step (d), creating a seal between the edges of said bottom wall insert and said rim,

(f) subsequent to said step (c), installing said delicate structure and making connections between it and the exposed upper surface of said sheet,

(g) subsequent to said step (f), locating said top wall cap above the delicate structure and in proximity to the upper edges of said rim, and

(h) subsequent to said step (g), creating a seal between the edges of said cap and said rim by associating the top cap and the rim within a mold cavity which defines a space bridging the edges of the cap and the rim while injecting a platic material in flowable state, and causing said material to solidify in intimate sealing contact both with the edges of the cap and with the rim.

11. The method set forth in claim 10 further characterized in that said step (b) is carried out to form at least the edge portions of said top wall cap of a solidified thermoplastic material, said step (c) is carried out by injecting a thermoplastic material at elevated temperature and then permitting it to cool, and said step (h'"'"') is carried out by injecting a thermoplastic material at elevated temperature and then permitting it to cool, whereby the edges of the cap and the rim are at least slightly melted by heat from the last-mentioned injected material and a fusion seal is created between the edges of the cap and the rim, on the one hand, and the plastic which fills said bridging space, on the other hand.

12. In a method of making an integrated circuit chip assembly which is comprised of an integrated circuit chip connected to lead frame fingers within a sealed housing through which the fingers within a sealed housing through which the fingers extend for external electrical connection, the combination of steps which include

(a) pre-forming a bottom wall insert,

(b) placing said insert in underlying relation to the lead frame,

(c) disposing the lead frame and the underlying insert in a mold cavity which extends above and below the lead frame and borders the periphery of the insert, and injecting a plastic material in flowable state into the cavity,

(d) permitting or causing said plastic material to solidify, thereby creating a rim through which the lead frame extends in sealed relation and which at its lower portion has intimate, sealing contact with the edges of the insert,

(e) installing the integrated circuit chip through the open upper mouth of said rim and connecting the chip electrically to the lead frame, and

(f) locating a top wall cap in the upper mouth of said rim and creating a seal between the rim and the edges of the cap.

13. The method defined by claim 12 further characterized in that

said step (a) is carried out to form at least the edge portions of said bottom wall insert of a solidified thermoplastic material,

said step (c) is carried out by injecting a thermoplastic material which is heated and flowable, and

said step (d) is carried out by permitting the injected material is cool,

whereby the edges of the insert are at least slightly melted by heat from the injected material and a fusion seal is automatically formed between the insert edges and the resulting rim.

14. The method defined by claim 12 further characterized in that

said step (f) is carried out by associating the top cap and the upper portion of the rim within a mold cavity which defines a space bridging the edges of the cap and the rim, while injecting a plastic material in flowable state into such cavity, and causing said injected material to solidify in intimate sealing contact both with the edges of the cap and with the rim.

15. The method set out in claim 14 further characterized in that

said top wall cap is pre-formed with at least its edge portions of a solidified thermoplastic material,

said step (c) is carried out by injecting a thermoplastic material at elevated temperature, and

said step (f) is carried out by injecting a thermoplastic material at elevated temperature into said bridging cavity and then permitting it to cool,

whereby the edges of the cap and the rim are at least slightly melted by heat from the last-mentioned injected material and a fusion seal is created between the edges of the cap and the rim, on the one hand, and the plastic which fills said bridging cavity, on the other hand.