Apparatus for removing solder from the drill holes of empty printed circuit boards coated with solder

• US 4,703,714 A
• Filed: 11/09/1984
• Issued: 11/03/1987
• Est. Priority Date: 04/15/1981
• Status: Expired due to Fees

• Current Assignee: Siemens-Albis AG (Siemens AG)
• Original Assignee: Siemens-Albis AG (Siemens AG)
• Inventors: Bajka, Imre, Furrer, Robert
• Primary Examiner(s): Lawrence, Evan K.
• Application Number:
  US06/669,948
• Time in Patent Office: 1,089 Days
• Field of Search: 73/12, 118/57, 118/641, 427/347
• US Class Current: 118/57
• CPC Class Codes: B23K 1/018 Unsoldering; Removal of melted solder or other residues
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: H05K 13/0061 Tools for holding the circuit boards during processing; handling transport of printed circuit boards
• CPC Class Codes: H05K 2203/0271 Mechanical force other than pressure, e.g. shearing or pulling
• CPC Class Codes: H05K 2203/0292 Using vibration, e.g. during soldering or screen printing
• CPC Class Codes: H05K 2203/044 Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
• CPC Class Codes: H05K 2203/0445 Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
• CPC Class Codes: H05K 2203/045 Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing
• CPC Class Codes: H05K 2203/1509 Horizontally held PCB
• CPC Class Codes: H05K 2203/1518 Vertically held PCB
• CPC Class Codes: H05K 3/0088 for treatment of holes
• CPC Class Codes: H05K 3/3468 Applying molten solder

Abstract

During the pre-soldering or tinning of printed circuit boards, as a rule, also the drill holes or bores and, in particular, the through-metallized drill holes are filled in an undesirable manner with solder. This solder must be removed before mounting the electrical components or elements upon the printed circuit boards. A simple apparatus is disclosed for this purpose, affording a faultless de-soldering of the drill holes, without deleteriously affecting the properties of the solder material. The printed circuit boards, in a condition where the solder applied during the pre-soldering operation is still molten, are accelerated at least once and thereafter suddenly brought to standstill in such a fashion that the excess solder is knocked or propelled out of the drill holes. The apparatus serves to guide the printed circuit board essentially horizontally in a frame and to accelerate such printed circuit board in a guided vertical drop or fall in the direction of an impact location, so that upon concussion of the frame at the impact location the excess solder is downwardly knocked or propelled out.

Claims

1. An apparatus for removing excess molten solder out of drill holes of component-free printed circuit boards, comprising:

movable frame means;

receiving means provided for said movable frame means for receiving at least one printed circuit board;

guide means cooperating with said movable frame means and said receiving means and along which there can be randomly displaced said receiving means containing said at least one printed circuit board;

means for defining an impact location;

said printed circuit board being displaceable along said guide means and undergoing an acceleration relative to said impact location;

said receiving means containing structure for receiving said printed circuit board in a substantially horizontal position;

said guide means including two substantially parallel vertical guide rails along which there is movable said movable frame means; and

at least one controllable displacement means for displacing said movable frame means along said guide rails into any random position between a lower boundary position and an upper boundary position and thereafter under the action of said displacement means moving said movable frame means from a predetermined selected random position through a vertical drop along said guide means towards said impact location.

2. The apparatus as defined in claim 1, further comprising:

control means for the elimination of the action of said displacement means for moving said movable frame means out of a predetermined selected random position through a vertical drop in a guided free fall along said guide means towards said impact location.

3. An apparatus for removing excess molten solder out of drill holes of component-free printed circuit boards, comprising:

movable frame means;

receiving means provided for said movable frame means for receiving at least one printed circuit board;

guide means cooperating with said movable frame means and said receiving means and along which there can be randomly displaced said receiving means containing said at least one printed circuit board;

means for defining an impact location;

said printed circuit board being displaceable along said guide means and undergoing an acceleration relative to said impact location;

a drop region defined beneath said movable frame means; and

container means arranged at the drop region of said frame means for receiving solder particles knocked out of the drill holes of the printed circuit board upon impact of the frame means at the impact location.

4. The apparatus as defined in claim 3, wherein:

said receiving means defines a support plane for said at least one printed circuit board; and

said container means being connected with said frame means at a predetermined distance below said support plane for the printed circuit board.

5. The apparatus as defined in claim 4, wherein:

said container means has a floor position composed of at least two parts which upon impact of said frame means are downwardly displaced and thus open the floor portion of said container means; and

said floor portion of said container means being subjected to the action of spring force which, after standstill of said frame means, causes said at least two parts of the floor portion of said container means to again assume an initial position closing a bottom region of the container means.

6. An apparatus for eliminating excess molten metal from through holes of tinned printed circuit boards, comprising:

receiving means for supporting at least one printed circuit board;

movable frame means for supporting said receiving means;

stop means defining at least one impact location for said movable frame means;

retaining means for retaining said movable frame means in a desired initial location;

said retaining means comprising release means for releasing said movable frame means from said desired initial location;

stationary guide means cooperating with said movable frame means for freely permitting guided displacement of said movable frame means, said receiving means and said at least one printed circuit board supported in said receiving means toward said stop means;

said movable frame means comprising container means for receiving droplets of excess molten metal shaken loose from said at least one printed circuit board by inertial forces upon impact of said movable frame means against said stop means; and

said movable frame means being configured to support said receiving means such that said at least one printed circuit board supported in said receiving means is freely situated in spaced relationship to said container means and said container means shields said at least one printed circuit board from air currents.

7. The apparatus as defined in claim 6, wherein:

said retaining means comprises alternate means for retaining said movable frame means in an alternate initial location in addition to said desired initial location; and

said alternate initial location being more remote from said stop means than said desired initial location.

8. The apparatus as defined in claim 6, wherein:

said container means comprises a floor member;

said floor member comprising at least one pivotably arranged floor member component; and

said movable frame member being provided with spring means for maintaining said at least one pivotably arranged floor member component in a closed position during said guided displacement and for permitting said at least one pivotably arranged floor member component to pivot into an open position under the action of inertial forces upon impact of said movable frame means against said stop means.

9. The apparatus as defined in claim 6, further including:

controllable displacement means for positively effecting said guided displacement of said movable frame means toward said stop means.