Chip carrier mounting device
First Claim
1. A device for providing a plurality of discrete quantities of preformed solder material for forming connections between electrically conductive elements comprising:
- a retaining member having a plurality of apertures therein spaced to correspond to preselected points on the electrically conductive elements; and
preforms of solder material disposed in or supported by the apertures whereby the ends of the preforms are adapted to contact preselected points on the electrically conductive elements and wherein the solder material comprises filled solder which contains from about 20% to about 80% by weight based on the total weight of the solder-filler mixture of a filler which is solid at a temperature at which the solder is molten or supported solder and wherein the filled solder or supported solder, separate from the retaining member and apertures thereof, substantially retains its preform physical shape while the solder is in a molten state.
3 Assignments
0 Petitions
Accused Products
Abstract
A chip carrier mounting device which is hereinafter also referred to as an "interconnection preform placement device" includes a retaining member having a predetermined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatique. A method of forming resilient interconnections comprises placing the interconnection retaining member device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.
260 Citations
27 Claims
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1. A device for providing a plurality of discrete quantities of preformed solder material for forming connections between electrically conductive elements comprising:
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a retaining member having a plurality of apertures therein spaced to correspond to preselected points on the electrically conductive elements; and preforms of solder material disposed in or supported by the apertures whereby the ends of the preforms are adapted to contact preselected points on the electrically conductive elements and wherein the solder material comprises filled solder which contains from about 20% to about 80% by weight based on the total weight of the solder-filler mixture of a filler which is solid at a temperature at which the solder is molten or supported solder and wherein the filled solder or supported solder, separate from the retaining member and apertures thereof, substantially retains its preform physical shape while the solder is in a molten state. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for forming a resilient connection for connection preselected points of first and second electrically conductive elements comprising:
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positioning a first electrically conductive element in alignment with one side of a retaining member having apertures spaced to correspond to the preselected points on the electrically conductive elements and having disposed in said apertures preforms of solder material; and effecting a bond between one end of the preforms and the preselected points on the first electrically conductive element; wherein the preforms of solder material are filled solder containing from about 20% to about 80% by weight based on the total weight of the solder-filler mixture of a filler which is solid at a temperature at which the solder is molten or supported solder which, separate from the retaining member and apertures thereof, substantially retains its preform physical shape while the solder is in a molten state. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification