Semiconductor device and method of producing the same

• US 4,706,105 A
• Filed: 06/13/1986
• Issued: 11/10/1987
• Est. Priority Date: 02/02/1983
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Masuda, Masachika, Murakami, Gen
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Clark, S. V.
• Application Number:
  US06/874,121
• Time in Patent Office: 515 Days
• Field of Search: 357/70, 357/68, 174/52 FP, 361/421
• US Class Current: 257/695
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A semiconductor device comprising a square package body, a plurality of leads which jut out from each of four sides of the package body, a beveled portion which is formed in at least one corner of the package body, and leads which jut out from the beveled portion.

Claims

1. A semiconductor device comprising a package body, made of a resin, encapsulating a semiconductor element, said package body having four sides and having a regular square or oblong shape, a plurality of connection leads which jut out from each of the four sides of said package body, a tab surrounded by said connection leads and having said semiconductor element positioned thereon, tab suspending leads extending from said tab, and a chamfered portion which is formed in at least one corner of said package body, said plurality of connection leads being connected to electrode pads on the semiconductor element, at least one of said plurality of connection leads jutting out from said chamfered portion.

2. A semiconductor device according to claim 1, wherein said plurality of connection leads jutting out from each of the four sides of said package body and from said chambered portion are arranged so as to be symmetric with respect to a center of said package body.

3. A semiconductor device according to claim 5, further comprising wire means for connecting said plurality of connection leads to corresponding electrode pads of said semiconductor element.

4. A semiconductor device according to claim 3, wherein said plurality of connection leads jutting out from each of the four sides of said package body and from said chamfered portion are bent stepwise.

5. A semiconductor device according to claim 1, wherein said plurality of leads and said tab are made of metal.

6. A semiconductor device according to claim 3, wherein the tab suspending leads, extending from said tab, do not jut out from said package body.

7. A semiconductor device according to claim 1, wherein said at least one of said plurality of connection leads jutting out from said chamfered portion juts out from said package body in substantially the same direction as connection leads jutting out from a side of said package body adjacent the chamfered portion.

8. A semiconductor device according to claim 2, wherein said at least one of said plurality of connection leads jutting out from said chambered portion juts out from said package body in substantially the same direction as connection leads jutting out from a side of said package body adjacent the chamfered portion.

9. A semiconductor device according to claim 3, wherein said at least one of said plurality of connection leads jutting out from said chamfered portion juts out from said package body in substantially the same direction as connection leads jutting out from a side of said package body adjacent the chamfered portion.

10. A semiconductor device according to claim 4, wherein said at least one of said plurality of connection leads jutting out from said chamfered portion juts out from said package body in substantially the same direction as connection leads jutting out from a side of said package body adjacent the chamfered portion.

11. A semiconductor device according to claim 5, wherein said at least one of said plurality of connection leads jutting out from said chamfered portion juts out from said package body in substantially the same direction as connection leads jutting out from a side of said package body adjacent the chamfered portion.

12. A semiconductor device according to claim 6, wherein said at least one of said plurality of connection Ieads jutting out from said chamfered portion juts out from said package body in substantially the same direction as connection leads jutting out from a side of said package body adjacent the chambered portion.