High-density electronic modules--process and product
First Claim
1. A method for fabricating a module containing high-density electronic circuitry, comprising:
- providing a plurality of integrated circuit chips, each having a multiplicity of closely-spaced electrical leads at an access side thereof;
stacking and bonding the integrated circuit chips in a structure having an access plane which includes the access sides of the stacked chips, on which plane there is a two-dimensional array of closely-spaced electrical leads;
forming on the access plane, in electrical contact with the leads a plurality of conductive lines and a plurality of conductive terminals;
providing a substrate adapted to support the stacked chips and having printed thereon circuitry including a plurality of conductive lines and a plurality of conductive terminals;
the conductive terminals on the access plane being located in precise matched relationship with the conductive terminals on the substrate;
covering either the substrate or the access plane with a layer of insulation having openings therethrough matched to the conductive terminals thereon;
depositing electrically conducting bonding bumps on the conductive terminals of both the access plane and the substrate;
aligning the bonding bumps on the substrate with those on the access plane; and
using heat and/or pressure to bond the aligned bonding bumps together, thereby providing a plurality of spaced electrical connections between the access plane and the substrate.
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Accused Products
Abstract
A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all the leads of the stack are exposed on an access plane. Bonding bumps are formed at appropriate points on the access plane. A supporting substrate, formed of a light transparent material, such as silicon, is provided with suitable circuitry and bonding bumps on its face. A layer of insulation is applied to either the access plane or the substrate face, preferably the latter. The bonding bumps on the insulation-carrying surface are formed after the insulation has been applied. The substrated face is placed on the access plane of the stack, their bonding bumps are microscopically aligned, and then bonded together under heat and/or pressure. A layer of thermally conductive (but electrically non-conductive) adhesive material is inserted between the substrate and stack. The substrate and stack combination is then placed and wire bonded in a protective container having leads extending therethrough for external connection.
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Citations
17 Claims
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1. A method for fabricating a module containing high-density electronic circuitry, comprising:
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providing a plurality of integrated circuit chips, each having a multiplicity of closely-spaced electrical leads at an access side thereof; stacking and bonding the integrated circuit chips in a structure having an access plane which includes the access sides of the stacked chips, on which plane there is a two-dimensional array of closely-spaced electrical leads; forming on the access plane, in electrical contact with the leads a plurality of conductive lines and a plurality of conductive terminals; providing a substrate adapted to support the stacked chips and having printed thereon circuitry including a plurality of conductive lines and a plurality of conductive terminals; the conductive terminals on the access plane being located in precise matched relationship with the conductive terminals on the substrate; covering either the substrate or the access plane with a layer of insulation having openings therethrough matched to the conductive terminals thereon; depositing electrically conducting bonding bumps on the conductive terminals of both the access plane and the substrate; aligning the bonding bumps on the substrate with those on the access plane; and using heat and/or pressure to bond the aligned bonding bumps together, thereby providing a plurality of spaced electrical connections between the access plane and the substrate. - View Dependent Claims (2, 3, 4, 12, 13, 14)
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5. A high-density electronic module comprising:
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a plurality of IC chips, each having electrical leads extending to one side of the chip; the chips being secured together to provide an integrated stack, in which all the electrical leads extend to a single two-dimensional access plane; a supporting substrate which has electrical circuitry thereon, and which is adapted to provide a support for the stacked chips; a first group of bonding bumps deposited on the access plane of the stack; a second group of bonding bumps deposited on the substrate; insulation on either the stack or the substrate which covers its surface except for the bonding bumps; each bonding bump on the stack being bonded to a bonding bump on the substrate, thereby providing electrical contact between the stack and substrate at selected terminals. - View Dependent Claims (6, 7, 8, 9, 10, 11, 15, 16, 17)
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Specification