×

Substrate for printed circuit

  • US 4,707,565 A
  • Filed: 03/17/1986
  • Issued: 11/17/1987
  • Est. Priority Date: 03/19/1985
  • Status: Expired due to Term
First Claim
Patent Images

1. A substrate for a printed circuit, in which a metal foil is mounted onto at least one of the outermost surfaces of a laminate made of a plurality of glass fiber woven fabrics comprised of warps and wefts impregnated with synthetic resin, and heated and pressed wherein said warps and wefts are in the form of threads comprised of a plurality of filaments, the filaments of said glass fiber woven fabrics being open, such that said synthetic resin fills gaps among the opened said filaments so that the said laminated glass fiber woven fabrics including the opened filaments are integrally joined with each other.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×