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Laser marking method and ablative coating for use therein

  • US 4,707,722 A
  • Filed: 01/09/1987
  • Issued: 11/17/1987
  • Est. Priority Date: 12/17/1984
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device package comprising:

  • at least one metal surface;

    a layer of nickel coating said at least one metal surface, said layer of nickel having an upper portion converted to a radiant energy absorptive form, said upper portion defining an opening therethrough exposing a lower nonconverted portion of said layer of nickel.

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