Molded electronic circuit device
First Claim
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1. A molded electronic circuit device comprising:
- a printed circuit board having an electronic circuit, the electronic circuit being partially constituted by heat-radiating electronic elements such as a power transistor;
a case for holding the printed circuit board; and
a molding synthetic resin material filled in the case between the electronic elements so as to conduct heat away from the electronic elements, the molding synthetic resin material being obtained such that one of silicon carbide and a silicon carbide compound is mixed as a major constituent in an epoxy resin and that a metal oxide is added to a resultant mixture, wherein the silicon carbide and the silicon carbide compound comprise a powder whose particle size falls within the range of 6 to 10μ
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Abstract
A molded electronic circuit device including a printed circuit board having an electronic circuit in a synthetic resin, the electronic circuit including heat-radiating electronic elements such as a power transistor and contained within a case holding the printed circuit board. According to the present invention, the synthetic resin material fills the case between the electronic elements so as to conduct heat away from the electronic elements, the synthetic resin material comprising a silicon carbide or a silicon carbide compound mixed as a major constituent in an epoxy resin and having a metal oxide added to the resultant mixture.
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Citations
3 Claims
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1. A molded electronic circuit device comprising:
a printed circuit board having an electronic circuit, the electronic circuit being partially constituted by heat-radiating electronic elements such as a power transistor;
a case for holding the printed circuit board; and
a molding synthetic resin material filled in the case between the electronic elements so as to conduct heat away from the electronic elements, the molding synthetic resin material being obtained such that one of silicon carbide and a silicon carbide compound is mixed as a major constituent in an epoxy resin and that a metal oxide is added to a resultant mixture, wherein the silicon carbide and the silicon carbide compound comprise a powder whose particle size falls within the range of 6 to 10μ
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Specification
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Current AssigneeStanley Electric Company Limited
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Original AssigneeStanley Electric Company Limited
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InventorsKudo, Sinji
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Primary Examiner(s)Scott, J. R.
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Assistant Examiner(s)Ginsburg, Morris
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Application NumberUS06/684,667Time in Patent Office1,061 DaysField of Search361/386, 361/387, 361/388, 361/389, 357/81, 174/16 HS, 174/52 PEUS Class Current361/720CPC Class CodesC08K 3/34 Silicon-containing compoundsC08L 63/00 Compositions of epoxy resin...H01B 3/40 epoxy resinsH05K 3/285 Permanent coating compositionsH05K 5/0095 hermetically-sealedH05K 5/064 sealed by potting, e.g. wat...
