Method and apparatus for high speed profile grinding of rotation symmetrical workpieces

• US 4,709,508 A
• Filed: 09/08/1986
• Issued: 12/01/1987
• Est. Priority Date: 03/15/1984
• Status: Expired due to Fees

• Current Assignee: Erwin Junker
• Original Assignee: Erwin Junker
• Inventors: Junker, Erwin
• Primary Examiner(s): Schmidt, Frederick R.
• Assistant Examiner(s): RACHUBA, MAURINA T
• Application Number:
  US06/906,558
• Time in Patent Office: 449 Days
• Field of Search: 51/105 R, 51/50 R, 51/289 R, 51/95 WH
• US Class Current: 451/49
• CPC Class Codes: B24B 5/00 Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor B24B11/00 - B24B21/00 take precedence; honing machines or devices using abrading blocks performing axial and rotary movements superimposed on one another B24B33/00

Abstract

In a method and an apparatus for high speed profile grinding of rotatably clamped rotation symmetrical workpieces, a grinding disk of an essentially flat surface line is being guided against the surface of the workpiece so that during the grinding process, the grinding disk touches the circumference of the workpiece in the region of the finished diameter only at a point which lies perpendicular to the longitudinal axis of the workpiece, whereby the surface line of the grinding disk forms a clearance angle with the circumferential line of the ground surface of the workpiece.

Claims

1. A method for grinding of a rotation symmetrical workpiece, comprising:

clamping in a grinding machine a workpiece having a longitudinal axis and rotating the workpiece about the longitudinal axis thereof,

providing a grinding disk having a central axis, a peripheral surface and a leading surface, said grinding disk having a hardness so that the grinding disk wears during grinding,

installing the grinding disk adjacent the workpiece so that said peripheral surface is located radially inside and axially adjacent an imaginary cylindrical surface corresponding to the outer surface of the workpiece to be ground, said peripheral surface being arranged relative to the axis of the workpiece to form a clearance angle between said peripheral surface and the surface of the workpiece that is ground, and

rotating the grinding disk about the central axis thereof and moving the grinding disk in a direction parallel to the longitudinal direction of the workpiece so that said leading surface engages the workpiece and grinds the workpiece while the grinding disk wears,

whereby said leading surface makes contact with the workpiece during grinding and the grinding disk makes only point contact with the workpiece after grinding, independently of the wear of the grinding disk.

2. A method according to claim 1, in which the intersection of an axial cross-section of said grinding disk and said peripheral surface is a straight line.

3. A method according to claim 1, in which said peripheral surface is frustoconical.

4. A method according to claim 1, in which said peripheral surface is cylindrical.

5. A method according to claim 1, in which the clearance angle is so small that, independently of wear of the leading surface, the point of contact remains at a point defined by the intersection of the leading surface, the peripheral surface and the workpiece.

6. A method according to claim 1, in which said workpiece axis and said grinding disk axis are oblique relative to each other.

7. A method according to claim 1, in which said workpiece axis and said grinding disk axis are skewed relative to each other.

8. A method according to claim 6, in which said peripheral surface is frustoconical.

9. A method according to claim 7, in which said peripheral surface is frustoconical.

10. Apparatus for grinding of a rotation symmetrical workpiece, comprising

a grinding machine;

means for clamping the workpiece in the grinding machine along a longitudinal axis of the workpiece;

a grinding disk having a peripheral surface and a leading surface;

means for moving the grinding disk in a direction parallel to the longitudinal direction of the workpiece and radially setting the grinding disk in correspondence with a circumferential profile of the workpiece to be ground; and

means for mounting the grinding disk with said peripheral surface arranged with respect to the axis of the workpiece to form a clearance angle between said peripheral surface and the surface of the workpiece that is ground,

whereby said leading surface makes contact with the workpiece during grinding and the grinding disk makes only point contact with the workpiece after grinding independently of wear of the grinding disk.

11. Apparatus according to claim 10, in which the intersection of an axial cross-section of said grinding disk and said peripheral surface is a straight line.

12. Apparatus according to claim 10, in which said peripheral surface is frustoconical.

13. Apparatus according to claim 10, in which said peripheral surface is cylindrical.

14. Apparatus according to claim 10, further comprising means for relatively orienting the axis of the grinding disk and said workpiece axis in oblique relationship.

15. Apparatus according to claim 14, in which the orienting means is adjustable.

16. Apparatus according to claim 14, in which said peripheral surface is frustoconical.

17. Apparatus according to claim 10, further comprising means for relatively orienting the axis of the grinding disk and said workpiece axis in skewed relationship.

18. Apparatus according to claim 17, in which the orienting means is adjustable.

19. Apparatus according to claim 17, in which said peripheral surface is frustoconical.