Transparent conductive windows, coatings, and method of manufacture
First Claim
1. An electrically conductive window having high optical transparency in the infrared, visible, or UV bands comprisinga substrate having at lease one smooth contiuous surface on one side thereof,an intermediate dielectric impedance matching stack dsposited on said substrate surface,a first difusion barrier layer deposited on said intermediate matching stack,a nucleating layer deposited on said first barrier layer,a conductive metal layer deposited on said nucleating layer in a film of continuous uniform thickness of about 10 nm or lesss with optical constants n, k,said nucleating layer being selected to cooparate with said metal layer to allow the metal layer to form in a continuous thin film without agglomeration having optical constants n, k approximating these of the bulk metal and with a low sheet resistance,said intermediate stack forming an impedance match between said substrate and said conductive layer,a second diffusion barrier layer deposited on said metal layer, andan outer dieletric anti-reflection stack deposited on said second barrier layer to form an impedance match between said conductive layer and air.
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Abstract
Methods are disclosed for the manufacture of optical conductive transparent windows and coatings having high transparency over a wide bandwidth combined with a large acceptance angle of incidence. Particulars for making windows and coatings with gold films of high transparency and low sheet resistance using specified nucleating and barrier layers are given. Examples include windows and coatings constructed for operation in the infrared and ultraviolet.
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Citations
29 Claims
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1. An electrically conductive window having high optical transparency in the infrared, visible, or UV bands comprising
a substrate having at lease one smooth contiuous surface on one side thereof, an intermediate dielectric impedance matching stack dsposited on said substrate surface, a first difusion barrier layer deposited on said intermediate matching stack, a nucleating layer deposited on said first barrier layer, a conductive metal layer deposited on said nucleating layer in a film of continuous uniform thickness of about 10 nm or lesss with optical constants n, k, said nucleating layer being selected to cooparate with said metal layer to allow the metal layer to form in a continuous thin film without agglomeration having optical constants n, k approximating these of the bulk metal and with a low sheet resistance, said intermediate stack forming an impedance match between said substrate and said conductive layer, a second diffusion barrier layer deposited on said metal layer, and an outer dieletric anti-reflection stack deposited on said second barrier layer to form an impedance match between said conductive layer and air.
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13. An electrically conductive window having optical transparency in the infrared, visible, or UV bands comprising
a substrate transparent at said band and having a surface on one side thereof, means for impedance matching energy of said band to said substrate, means forming a first diffusion barrier at the surface of said last named means, means forming a nucleating surface on said barrier, a layer of substantially transparent conductive metal deposited on said nucleating means to a thickness yielding a resistance value of less than about 10 ohms/sq., said nucleating means being selected to cooperate with said metal layer to allow the metal layer to form in a continuous thin film without agglomeration having optical constants n, k approximating these of the bulk metal, said first matching means forming an impedance match between said substrate and said conductive layer, means forming a second diffusion barrier on said metal layaer, and means on said second barrier to form a impedance match between the underlying means and layer, and air.
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25. A transparent, conductive window comprising
a substrate having an outer surface, first means formed at said surface for matching the impedance of the substrate to overlaid material subsequently deposited or created, second means formed at the outer surface of said first means for creating a barrier against diffusion of overlaid material therethrough, third means formed at the outer surface of said second means for causing nucleation of overlaid material fourth substantially transparent means deposited on siad third means for forming a conductive metal layer at the surface thereof having a surface conductivity of less than 10 ohms/sq. fifth means formed on said fourth means for creating a barrier against upward outward migration of said fourth means, and sixth means formed on said fifth means for matching the impedance of the previous means to air.
Specification