Spherical copper based powder particles and process for producing same

• US 4,711,661 A
• Filed: 09/08/1986
• Issued: 12/08/1987
• Est. Priority Date: 09/08/1986
• Status: Expired due to Fees

• Current Assignee: GTE Products Corporation
• Original Assignee: GTE Products Corporation
• Inventors: Johnson, Walter A., Kemp, Preston B. Jr.
• Primary Examiner(s): NOT, DEFINED
• Application Number:
  US06/905,011
• Time in Patent Office: 456 Days
• Field of Search: 75/0.5 B, 75/0.5 BC, 75/0.5 BB, 75/251, 75/252, 75/10.19, 75/10.20, 264/15
• US Class Current: 75/342
• CPC Class Codes: B22F 1/065 Spherical particles
• CPC Class Codes: Y10S 75/956 Producing particles containing a dispersed phase

Abstract

A powdered material and a process for producing the material are disclosed. The powdered material consists essentially of copper based spherical particles which are essentially free of elliptical shaped material and elongated particles having rounded ends. The material has a particle size of less than about 20 micrometers. The process for making the spherical particles involves mechanically reducing the size of a starting material to produce a finer powder which is then entrained in a carrier gas and passed through a high temperature zone at a temperature above the melting point of the finer powder to melt at least about 50% by weight of the powder and form the spherical particles of the melted portion. The powder is directly solidified.

Claims

1. A process comprising:

(a) mechanically reducing the size of a copper based material to produce a finer powder, the major portion of which has a particle size of less than about 20 micrometers;

(b) entraining said finer powder in a carrier gas and passing said powder through a high temperature zone at a temperature above the melting point of said finer powder, said temperature being from about 5500°

C. to about 17,000°

C., said temperature being created by a plasma jet to melt at least about 50% by weight of said finer powder to form essentially spherical particles of said melted portion; and

(c) rapidly and directly resolidifying the resulting high temperature treated material while in flight to form fine spherical particles having a particle size of less than about 20 micrometers in diameter, said particles being essentially free of elliptical shaped material and essentially free of elongated particles having rounded ends.

2. A process of claim 1 wherein the size of said material is reduced by attritor milling said material to produce said finer powder.

3. A process of claim 1 wherein after said resolidification, said high temperature treated material is classified to obtain the desired particle size of said spherical particles.

4. A process of claim 1 wherein said copper based material is copper metal.

5. A process of claim 1 wherein said copper based material is a copper alloy.

6. A process of claim 1 wherein said copper based material is copper metal with additives selected from the group consisting of oxides, nitrides, borides, carbides, silicides, carbonitrides, and mixtures thereof.

7. A process of claim 1 wherein said copper based material is a copper based alloy with additives selected from the group consisting of oxides, nitrides, borides, carbides, silicides, carbonitrides, and mixtures thereof.

8. A process of claim 1 wherein said fine spherical particles have a particle size of less than about 20 micrometers.

9. A powdered material consisting essentially of spherical particles of a copper based material, said powdered material being essentially free of elliptical shaped material and essentially free of elongated particles having rounded ends, said powdered material having a particle size of less than about 20 micrometers.

10. A powdered material of claim 9 wherein said copper based material is copper metal.

11. A powdered material of claim 9 wherein said copper based material is a copper alloy.

12. A powdered material of claim 9 wherein said copper based material is copper metal with additives selected from the group consisting of oxides, nitrides, borides, carbides, silicides, carbonitrides, and mixtures thereof.

13. A powdered material of claim 9 wherein said copper based material is a copper based alloy with additives selected from the group consisting of oxides, nitrides, borides, carbides, silicides, carbonitrides, and mixtures thereof.

14. A powdered material of claim 10 wherein said spherical particles have a particle size of less than about 15 micrometers.

15. A powdered material of claim 10 wherein said spherical particles have a particle size of less than about 10 micrometers.

16. A powdered material consisting essentially of spherical particles of a copper based material, said powdered material being directly solidified from high temperature treated material, said powdered material having a particle size of less than about 20 micrometers.

17. A powdered material of claim 17 wherein said copper based material is copper metal.

18. A powdered material of claim 17 wherein said copper based material is a copper alloy.

19. A powdered material of claim 17 wherein said copper based material is copper metal with additives selected from the group consisting of oxides, nitrides, borides, carbides, silicides, carbonitrides, and mixtures thereof.

20. A powdered material of claim 17 wherein said copper based material is a copper based alloy with additives selected from the group consisting of oxides, nitrides, borides, carbides, silicides, carbonitrides, and mixtures thereof.

21. A powdered material of claim 17 wherein the particle size is less than about 15 micrometers.

22. A powdered material of claim 17 wherein the particle size is less than about 10 micrometers.