Method of fabricating a self-aligned metal-semiconductor FET having an insulator spacer

• US 4,711,858 A
• Filed: 06/18/1986
• Issued: 12/08/1987
• Est. Priority Date: 07/12/1985
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Harder, Christoph S., Wolf, Hans P., Jaeckel, Heinz
• Primary Examiner(s): Chaudhuri, Olik
• Application Number:
  US06/875,835
• Time in Patent Office: 538 Days
• Field of Search: 29/571, 29/576 E, 148/171, 148/175, 357/15, 357/22 I, 357/22 K, 357/23.2, 437/99, 437/234, 156/656
• US Class Current: 438/180
• CPC Class Codes: H01L 29/0891 of field-effect transistors with Schottky gate
• CPC Class Codes: H01L 29/812 with a Schottky gate H01L29/7725, H01L29/775, H01L29/778, H01L29/806 take precedence; with Schottky contact on top of heterojunction gate H01L29/802
• CPC Class Codes: Y10S 438/969 Simultaneous formation of monocrystalline and polycrystalline regions

Abstract

A method for the fabrication of self-aligned MESFET structures with a recessed refractory submicron gate. After channel formation on a semi-insulating (SI) substrate, which may consist of a III-V compound semiconductor such as GaAs, with subsequent annealing, refractory gate material is deposited and patterned. This is followed by the overgrowth of a highly doped contact layer of, e.g., GaAs, using MOCVD of MBE processes resulting in poly-crystalline material over the gate "mask" and mono-crystalline material on exposed semiconductor surfaces. Next, the poly-crystalline material is removed in a selective etch process, this step being followed by the deposition of source and drain electrodes. In order to further improve process reliability, insulating sidewalls are provided at the vertical edges of the gate to avoid source-gate and drain-gate shorts.

Claims

1. A method of fabricating a self-aligned metal-semiconductor field effect transistor, the transistor being formed on a semi-insulating semiconductor substrate and comprising a current channel and associated source, gate and drain electrodes, characterized in that it comprises the following steps:

forming an active channel layer at the surface of said semiconductor substrate,

depositing a refractory metal gate layer over said substrate surface,

selectively etching said gate layer to form said gate electrode,

depositing a thin dielectric layer over said gate electrode and over said substrate surface,

etching said dielectric layer so as to form an insulating sidewall layer on the vertical ediges of said gate electrode,

forming a highly doped continuous semiconductor contact layer over said substrate surface, over said gate electrode and over said insulating sidewall layer, said contact layer being mono-crystalline material over said substrate surface and poly-crystalline material over said gate electrode and over said insulating sidewall layer,

removing said poly-crystalline material, and

depositing and selectively etching a metal layer over said mono-crystalline material to form said source and said drain electrodes.

2. A method as set forth in claim 1 wherein said dielectric etching is performed by an anisotropic etching process.

3. A method as set forth in claim 1 wherein said semi-insulating substrate includes gallium arsenide.

4. A method as set forth in claim 3 wherein said highly doped continuous contact layer includes GaALAs.

5. A method of fabricating a transistor which includes the steps of:

forming an n conductivity type channel at the surface of a semi-insulating semiconductor substrate,

depositing a refractory metal layer over said channel,

etching said metal layer to form a gate electrode,

depositing a layer of dielectric material over said gate electrode and over said substrate surface,

etching said layer of dielectric material so as to form an insulating sidewall layer on the vertical edges of said gate electrode,

forming a highly n+ doped continuous semiconductor layer over said channel, over said gate electrode and over said insulating sidewall layer,

etching portions of said semiconductor layer disposed over said gate electrode and over said insulating sidewall layer, and

forming a metallic contact to the remaining portion of said semiconductor layer.

6. A method as set forth in claim 5 wherein said etching includes

anisotropically etching said layer of dielectric material to form spacers on the vertical edges of said gate electrode.

7. A method as set forth in claim 5 wherein said semiconductor substrate is gallium arsenide.

8. A method as set forth in claim 5 wherein said refractory metal layer is tungsten silicide.

9. A method as set forth in claim 5 wherein said semiconductor layer is gallium arsenide.

10. A method as set forth in claim 5 wherein said semiconductor layer is gallium aluminum arsenide.