Method of examining and testing an electric device such as an integrated or printed circuit

• US 4,712,057 A
• Filed: 01/18/1985
• Issued: 12/08/1987
• Est. Priority Date: 05/25/1983
• Status: Expired due to Term

• Current Assignee: PAU, LEWIS, RYPEVAENGET 253, 2980 KOKKEDAL (DENMARK)
• Original Assignee: Battelle Memorial Institute
• Inventors: Pau, Louis F.
• Primary Examiner(s): Eisenzopf, Reinhard J.
• Assistant Examiner(s): BURNS, WILLIAM
• Application Number:
  US06/705,341
• Time in Patent Office: 1,054 Days
• Field of Search: 324/158 D, 324/158 T, 324/158 R, 324/73 PC, 324/73 R, 324/71.3, 324/469, 324/470, 324/300, 250/310, 250/311, 250/370 J
• US Class Current: 250/310
• CPC Class Codes: G01R 31/304 of printed or hybrid circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: G01R 31/305 using electron beams investigating or analysing materials by measuring photoelectric effect G01N23/227
• CPC Class Codes: G01R 31/308 using non-ionising electromagnetic radiation, e.g. optical radiation investigating or analysing materials by the use of optical means G01N21/00; image analysis G06T7/00

Abstract

This method is based on the radiation-matter interaction in a structure having discontinuities and where electron transport occurs in at least one layer. To this end, a stimulation signal is sent through the device under test and simultaneously at least one source of radiation sends incident radiation towards the surface of the device. The secondary radiation emitted by the device is detected together with the response of the device. The signals are compared, either individually or in combination, with a reference.

Claims

1. A method of examining and testing a layered electric circuit device having signal processing capability at discontinuities contained internally of its layers of structure in which radiation emitted by the device itself, after stimulation, is detected by scanning, electric signals characteristic of the detected radiation are formed and the signals are compared with reference signals, said method being characterized in that:

said stimulation of the device comprises, in combination, sending a given electric signal through the device for signal processing therewithin and simultaneously irradiating the device with penetrating radiation from at least one source of radiation of a predetermined type and having predetermined characteristics,

the said radiation emitted by the device being the result of interaction of the applied irradiation with the material of the device structure through which the given electric signal travels at places where the structure has discontinuities.

2. A method according to claim 1 characterized in that the radiation emitted by the device is also compared with the expected radiation to be emitted in response to said given stimulating electric signal travelling through the device.

3. A method according to claim 1 characterized in that the irradiation source comprises a pulsed ion laser.

4. A method according to claim 1, characterized in that the irradiation source comprises an infrared source (2-50 microns).

5. A method according to claim 1 characterized in that the irradiation source comprises a millimeter microwave source.

6. A method according to claim 1 characterized in that the irradiation source comprises a proton source.

7. A method according to claim 1 characterized in that the irradiation source comprises a beam of pulsed electrons.

8. A method according to claim 1 characterized in that the irradiation source comprises a neutron source.

9. A method according to claim 1 characterized in that the irradiation source comprises an ion source.

10. A method according to claim 1, characterized in that the irradiation source comprises an X-ray or UV laser.

11. A method according to claim 1 characterized in that the irradiation source comprises a nuclear magnetic resonance (NMR) source.

12. A method according to claim 1 characterized in that the irradiated surface of the device is covered with a liquid substance for locally amplifying the radiation emitted by the surface.

13. A method according to claim 12 characterized in that the substance is a liquid gas.

14. A method according to claim 12 characterized that the substance is made up of liquid crystals.

15. A method according to claim 1 characterized in that at least one of the chemical, electromagnetic and temperature parameters of the device under test is controlled to have a predetermined value.

16. A method according to claim 1 or 2 characterized in that the electric response signals of the electric device are combined in order to compare them with reference signals.

17. A method according to claim 1 characterized by detecting radiation reflected by the device itself after being stimulated.

18. A method according to claim 1 characterized by detecting radiation transmitted through the device itself after stimulation.

19. A method according to claim 4 or 5 characterized by detecting the radiation emitted by the device itself after being stimulated in the millimeter wave region from 20 to 600 GHZ, by using a cadmium/mercury telluride monocrystal photoconduction detector in the hot electron mode.

20. A method for examining and testing an electrical signal processing element having a layered structure of material, said method comprising the steps of:

passing through the said element for processing a predetermined electrical signal;

simultaneously therewith irradiating said element with radiation from at least one radiation source of predetermined type and known characteristics,

said irradiation and said electrical signal acting on said element in combination to stimulate said element;

said irradiation interacting with the material of the structure of said element through which said signal is passing at discontinuities present within said structure;

scanning the said element and detecting radiation emanating from said element owing to the said combined stimulation;

forming electrical response signals characteristic of said detected radiation; and

comparing said electrical response signals with predetermined reference signals.

21. A method according to claim 20, further comprising the steps of:

(1) detecting the processed electrical response signals of the said element to the said stimulating electrical signal travelling through the device, and (2) comparing the said response signals of said element with the expected response to said stimulating electrical signal.

22. A method according to claim 20 characterized by combining the electric response signals of the said element in order to compare them with the reference signals.

23. A method according to claim 20 characterized in that the said detected radiation is radiation emitted by reflection by the said element after being stimulated.

24. A method according to claim 20 characterized in that the said detected radiation is radiation emitted by transmission by the said element after said stimulation.

25. A method according to claim 20 characterized by stimulating the said element by means of irradiation in the millimeter wave region from 20 to 600 GHZ, and detecting the radiation emitted by said element by a cadmium/mercury telluride mono-crystal photoconduction detector in the hot electron mode.

26. A method of examining and testing an integrated, layered electric element having signal processing capability when excited by a supply voltage and suitable input electrical signals, said method comprising the steps of:

applying a supply voltage and a predetermined electrical signal to said element and to a comparison module;

simutaneously irradiating said element with penetrating radiation from at least one radiation source;

detecting secondary radiation emitted by said element and radiation reflected by said element in response to said simultaneous irradiating radiation and electrical excitation of said element;

converting said detected radiation into a stored memory representation characteristic of said electrical element under test;

detecting any faults in said stored memory representation;

comparing an output electrical signal from said element with a reference signal which corresponds to the output electrical signal that said element would produce if said element had no structural defects;

using the information from said comparing step and from said detecting faults step to determine the extent to which said device corresponds to preset standards.

27. A method as in claim 26 wherein the combination of said radiation and said electrical signal stimulating said element causes said radiation to interact with the material of said element through which said signal is passing at the discontinuities present in the structure of said element.

28. A method as in claim 27 wherein a further layer is deposited on said element in order to enhance certain secondary radiation emitted.