Cooling system for electronic circuit components

• US 4,712,158 A
• Filed: 03/26/1986
• Issued: 12/08/1987
• Est. Priority Date: 03/28/1985
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Kikuchi, Shunichi, Matsunaga, Haruyuki, Katsuyama, Koji, Katsumi, Hideo
• Primary Examiner(s): NOT, DEFINED
• Application Number:
  US06/843,947
• Time in Patent Office: 622 Days
• Field of Search: 361/386, 361/385, 361/384, 361/383, 361/382, 174/16 HS, 200/289
• US Class Current: 361/699
• CPC Class Codes: F28F 2250/04 Communication passages between channels
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/4332 Bellows
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/4735 Jet impingement H01L23/4336 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling system for electronic circuit components mounted on a printed circuit board, includes a cooling plate having a coolant passage, thermal contacts arranged on the cooling plate to be in resilient contact with the surfaces of the electronic components, which are cooled via the thermal contacts by liquid coolant flowing through the coolant passage. The cooling plate has one or more shortcut passages, the cross-sectional area of which is smaller than that of the coolant passage, to mutually connect predetermined portions of the coolant passage. The liquid coolant can be discharged from the cooling plate via the shortcut passage.

Claims

1. A cooling system for electronic circuit components mounted on a printed circuit board, including a cooling plate arranged substantially in parallel with said printed circuit board, said cooling plate having therein one or more coolant passages, thermal contact elements arranged on said cooling plate so as to be in resilient contact with the surfaces of the electronic circuit components, and means for supplying and circulating liquid coolant, through said coolant passage, so that the electronic circuit components are cooled via said thermal contact elements by said liquid coolant, characterized in that, said cooling plate has one or more shortcut passages, the cross-sectional area of which is smaller than that of said coolant passage,. to mutually connect predetermined portions of said coolant passage.

2. A cooling system as set forth in claim 1, wherein said coolant passage is arranged in a zig-zag fashion or separated into a plurality of branch coolant passages so that the coolant circulates all over the cooling plate, said coolant passage having one or more blind portions when said cooling plate is situated vertically in a predetermined state, and said shortcut passage is arranged so as to mutually connect the bottoms of said blind portions and to connect one of said bottoms of the blind portions to another lower level portion of said coolant passage, so that the liquid coolant is discharged under its own gravity via said shortcut passage and is removed from the cooling plate.

3. A cooling system as set forth in claim 2, wherein said coolant passage is arranged in a zig-zag fashion and has substantially vertical straight portions arranged in parallel to each other and U-shaped bottom and top portions for connecting said straight portions in turn, at the bottom and top ends thereof, alternately, and said shortcut passage is arranged so as to mutually connect both said U-shaped bottom portions and top portions, respectively, and to connect one of said U-shaped bottom portions to one of the straight portions in the vicinity of the coolant inlet and to connect one of said U-shaped top portions to one of the straight portions in the vicinity of the coolant outlet.

4. A cooling system as set forth in claim 3, wherein said cooling plate which has said cooling passage arranged in a zig-zag fashion is placed as having substantially horizontal straight portions in parallel to each other and U-shaped portions on both sides for connecting said straight portions in turn.

5. A cooling system as set forth in claim 2, wherein said coolant passage has a reduced cross-sectional area at a cooling point, at which a contact element is arranged on the surface of the cooling plate.

6. A cooling system as set forth in claim 2, wherein said coolant passage comprises a lower horizontal main passage connected to a coolant inlet and an upper horizontal main passage connected to a coolant outlet, arranged substantially in parallel to each other, and a plurality of vertical branch passages arranged in parallel to each other and between said lower and upper main passages.

7. A cooling system as set forth in claim 2, wherein said cooling plate has a plurality of coolant chambers at cooling points, each of said cooling chambers is closed by said contact element, said coolant element comprises a hollow resilient member, which defines therein a part of said coolant chamber, a nozzle pipe is protruded from said coolant passage into said coolant chamber so that the coolant is injected toward a portion of the hollow resilient member opposite to the electronic component to be cooled.

8. A cooling system as set forth in claim 7, wherein said shortcut passage comprises at least one opening provided in said pipe nozzle at a bottom level of said coolant chamber.

9. A cooling system as set forth in claim 7, wherein said shortcut passage comprises at least one groove provided in the cooling plate, at each cooling point, said groove extends along the coolant passage to the adjacent cooling chamber.

10. A cooling system as set forth in claim 7, wherein said shortcut passage is arranged in parallel to the coolant passage, at each cooling point, and extends to the adjacent cooling chamber.

11. A cooling system as set forth in claim 1, wherein the cross-sectional area of said shortcut passage is 0.10 to 0.15 times that of said coolant passage.