Power supply module

• US 4,712,160 A
• Filed: 06/30/1986
• Issued: 12/08/1987
• Est. Priority Date: 07/02/1985
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Sato, Toshiaki, Matsumoto, Nobuo, Mori, Hisako, Nishii, Kazuhiko, Tabuchi, Kastumi, Horio, Yashuhiko
• Primary Examiner(s): Tolin, G. P.
• Application Number:
  US06/880,315
• Time in Patent Office: 526 Days
• Field of Search: 363/141, 363/146, 307/150, 174/16 HS, 174/52 PE, 361/383, 361/386-389, 361/392-395, 361/399
• US Class Current: 361/710
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00

Abstract

Disclosed herein is a power module which is simple in assembly and which allows efficient release of heat generated by a converter transformer and power devices on primary and secondary circuits which are electrically separated from each other. The power module is of a construction such that a converter transformer, a primary circuit board on one side of which a part of the primary circuit of a switching power supply unit is integrated, and a secondary circuit board on one side of which a part of the secondary circuit of the switching power supply unit is integrated are three-dimensionally joined into an integral module by a resin of high thermal conduction and electrical insulation properties, the device-mounted sides of the primary and secondary circuit boards facing each other. The transformer may be placed between the two circuit boards or, alternatively, in parallel and adjacent to the two circuit boards.

Claims

1. A power module comprising:

a primary circuit board one major surface of which is an element mounting surface on which circuit elements of a primary circuit of a power circuit are mounted, the other major surface of said primary circuit board being a heat radiating surface on which no circuit element is mounted;

a secondary circuit board one major surface of which is an element mounting surface on which circuit elements of a secondary circuit of said power circuit are mounted, the other major surface of said secondary circuit board being a heat radiating surface on which no circuit element is mounted, said primary and secondary circuit boards being spaced apart from each other and disposed so that the respective element mounting surfaces face each other;

a converter transformer disposed in parallel with and adjacent to said primary and secondary circuit boards; and

a resin body of electrically insulating and thermally conductive resin embedding therein said primary and secondary circuit boards and said converter transformer so that said primary and secondary circuit boards and said converter transformer are three-dimensionally joined only with said resin body, said heat radiating surfaces of said primary and secondary circuit boards being exposed outside to form parts of opposite outer walls of said power module,

wherein a clearance is provided within said resin body along each of said element mounting surfaces of said primary and secondary circuit boards, said clearance being filled with an electrically insulating and thermally low conductive material for preventing heat generated on each of said primary and secondary circuit boards from being transmitted through said resin body to said converter transformer.

2. A power module as claimed in claim 1, further comprising heat sinks provided on said opposite outer walls of said power module for enhancing heat radiation.

3. A power module as claimed in claim 2, wherein an additional clearance is provided within said resin body along a part of each of said heat sinks closer to said converter transformer for preventing heat generated on each of said primary and secondary circuit boards and transmitted to said part of each of said heat sinks from being further transmitted through said resin body to said converter transformer.

4. A power module comprising:

a primary circuit board having a first major surface which is an element mounting surface on which circuit elements of a primary circuit of a power circuit are mounted, said primary circuit board having a second major surface which is a heat radiating surface on which no circuit element is mounted;

a secondary circuit board having a first major surface which is an element mounting surface on which circuit elements of a secondary circuit of said power circuit are mounted, said secondary circuit board having a second major surface which is a heat radiating surface on which no circuit element is mounted, said primary and secondary circuit boards being spaced apart from each other with said first major surface of said primary circuit board facing said first major surface of said secondary circuit board;

a converter transformer disposed between a plane containing said first major surface of said primary circuit board and a plane containing said first major surface of said secondary circuit board;

means joining said primary circuit board, said secondary circuit board and said converter transformer together, said means comprising a resin body of electrically insulating and thermally conductive resin embedding therein said primary and secondary circuit boards with said second major surfaces uncovered by said resin body and said resin body embedding therein said converter transformer so that said primary and secondary circuit boards and said converter transformer are three-dimensionally joined solely by means of said resin body, said heat radiating second major surfaces of said primary and secondary circuit boards being exposed to form parts of opposite outer walls of said power module.

5. The power module of claim 4, wherein a clearance is provided within said resin body along each of said element mounting first major surfaces of said primary and secondary circuit boards, each said clearance being filled with an electrically insulating and thermally low conductive material for preventing heat generated on each of said primary and secondary circuit boards from being transmitted through said resin body to said converter transformer.

6. The power module of claim 4, further comprising heat sinks provided on said opposite outer walls of said power module for enhancing heat radiation.

7. The power module of claim 6, wherein said resin body fills a space between said first major surfaces of said primary and secondary circuit boards and said converter transformer is disposed outside said space with one end of said converter transformer adjacent said space, said resin body including an additional clearance along a part of each of said heat sinks facing said converte transformer for preventing heat generated on each of said primary and secondary circuit boards and transmitted to said part of each of said heat sinks from being further transmitted through said resin body to said converter transformer.

8. The power module of claim 4, wherein said converter transformer is disposed between said first major surfaces of said primary and secondary circuit boards.