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Quad processor

  • US 4,715,921 A
  • Filed: 10/24/1986
  • Issued: 12/29/1987
  • Est. Priority Date: 10/24/1986
  • Status: Expired due to Term
First Claim
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1. A multiple-processing and contamination-free plasma etching system, comprising:

  • plural, single-wafer plasma etching vessels each having an ingress and egress defining port that are arrayed about a predetermined spacial locus in such a way that the several ports thereof are accessible form a single location spaced from the several ports;

    a wafer queuing station spaced with the plural vessels along the same predetermined spacial locus defining a wafer access port accessible from said single location;

    plural valve means individually coupled to corresponding ones of said plural, single-wafer plasma etching vessel ingress and egress ports and to said wafer queuing station wafer access port;

    single-wafer transfer means disposed at said single location and cooperative with corresponding ones of said plural valve means for moving wafers from and to said wafer access port of said queuing station from and to selected ones of said single-wafer plasma etching vessels through the associated one of said ingress and egress ports thereof; and

    processor means for controlling said vessels, said transfer means and said valve means to provide selectable single or multistep processing of wafers in said queuing station in one or more of said etching vessels.

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