Flexible printed circuits and methods of fabricating and forming plated thru-holes therein

• US 4,715,928 A
• Filed: 09/19/1986
• Issued: 12/29/1987
• Est. Priority Date: 09/27/1985
• Status: Expired due to Fees

• Current Assignee: Bill L. Hamby
• Original Assignee: Bill L. Hamby
• Inventors: Hamby, Bill L.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/909,315
• Time in Patent Office: 466 Days
• Field of Search: 428/137-140, 428/192, 428/901, 29/846, 29/852, 174/68.5, 361/397, 361/398, 361/401, 361/402, 361/414, 204/15, 204/24, 204/38.4, 427/96, 427/97, 156/150, 156/151, 156/629, 156/630, 156/632, 156/633, 156/634, 156/645, 156/656, 156/659.1, 156/666, 156/901, 156/902
• US Class Current: 216/18
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09109 Locally detached layers, e.g. in multilayer
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

Flexible printed circuits and methods of fabricating and forming plated thru-holes therein are disclosed. The flexible printed circuits have one or more substantially rigid regions where plated thru-holes are to be formed, the regions being made rigid by the substitution of epoxy glass or other conventional rigid printed circuit board materials in place of the flexible material used for the flexible portions of the circuit. In this manner the thru-holes are formed through conventional printed circuit board layers, allowing plating of the thru-holes using conventional well developed techniques. This process avoids the necessity of plating thru-holes in flexible printed circuit materials currently requiring special equipment and techniques, and further avoids stress concentration at the junction between the rigid plated thru-holes and the adjacent flexible printed circuit. Various methods for forming such circuits and circuits so formed are disclosed.

Claims

1. A method of making flexible printed circuits comprising the steps of

(a) providing a sheet of metal,

(b) covering at least a first area of the metal sheet with a sheet of flexible material,

(c) covering a second area of the metal sheet at least in part coterminous with the first area with a rigid printed circuit board material,

(d) bonding the flexible material and the rigid material to the metal sheet,

(e) etching the metal sheet to form a circuit pattern and

(f) bonding additional flexible material and rigid printed circuit board to the flexible material and rigid printed circuit board material, respectfully, of steps (b) and (c) to sandwich the circuit pattern formed in step (e) therebetween.

2. The method of claim 1 further comprised of the steps of drilling at least one thru-hole through the rigid printed circuit board material and a part of the circuit pattern sandwiched therein and plating the thru-hole to make electrical contact with the circuit pattern.

3. The method of claim 1 wherein additional rigid printed circuit board is bonded to the rigid printed circuit board of claim 14 so as to overlay and reinforce the junction with the adjacent flexible material.

4. The method of claim 3 further comprised of the steps of drilling at least one thru-hole through the rigid printed circuit board material and a part of the circuit pattern sandwiched therein and plating the thru-hole to make electrical contact with the circuit pattern.

7. The method of claim 1 wherein the thru-hole passes through at least two layers of metal circuit pattern, whereby the plating of step (4) electrically interconnects multilayers of th flexible printed circuit.

8. The method of claim 7 wherein in step (2), additional rigid printed circuit board substrates are bonded between the rigid printed circuit board substrates of the circuit elements and on the top and bottom of the stack thereof so as to somewhat overlie the junction between the flexible material and the rigid printed circuit board substrate of the adjacent circuit element, thereby to reinforce the junction.

9. The method of claim 1 wherein in step (2), additional rigid printed circuit board substrates are bonded between the rigid printed circuit board substrates of the circuit elements and on the top and bottom of the stack thereof so as to somewhat overlie the junction between the flexible material and the rigid printed circuit board substrate of the adjacent circuit element, thereby to reinforce the junction.

5. A method of making multilayer flexible printed circuits comprising the steps of

(1) forming a plurality of printed circuit elements, each being formed by the steps of

(a) providing a sheet of metal,

(b) covering at least a first area of the metal sheet with a sheet of flexible material,

(c) covering a second area of the metal sheet at least in part coterminous with the first area with a rigid printed circuit board material,

(d) bonding the flexible material and the rigid material to the metal sheet,

(e) etching the metal sheet to form a circuit pattern and

(f) bonding additional flexible material and rigid printed circuit board material to the flexible material and rigid printed circuit board material, respectively, of steps (b) and (c) to sandwich the circuit pattern formed in step (e) therebetween

(2) bonding the plurality of circuit elements together in a stack through the rigid printed circuit board substrates,

whereby at least one portion of the multilayer flexible printed circuit does not include any layers of the flexible material therein.

6. The method of claim 18 further comprised of the steps of

(3) drilling at least one thru-hole through the portion of the multilayer flexible printed circuit which does not include any layers of the flexible material therein and through at least on layer of metal circuit pattern therein, and

(4) plating the thru-hole to make electrical contact with all layers of the metal circuit pattern through which the thru-hole passes.

10. A method of making a flexible printed circuit comprising the steps of:

providing an electrically conductive layer of material having two sides, a first sheet of flexible electrically insulative material having a first edge, and a first sheet of rigid printed circuit board substrate having an edge;

positioning said flexible sheet and said rigid sheet on a first side of said electrically conductive layer of material with said edges of said flexible and rigid sheets in abutting relation;

bonding said sheets to said electrically conductive layer of material while maintaining the edges of said sheets in abutting relation; and

forming a circuit pattern in said layer of electrically conductive material such that said circuit pattern extends between said flexible and rigid sheets.

11. The method of claim 10 in which said flexible electrically insulative material further has a second edge, said method, prior to forming said circuit pattern in said electrically conductive layer further comprising the steps of:

providing a second sheet of rigid printed circuit board substrate having an edge;

positioning said second rigid sheet on said first side of said electrically conductive lay er of material with said edge of said second rigid sheet and said second edge of said flexible sheet in abutting relation;

bonding said second rigid sheet to said electrically conductive layer of material while maintaining the edges of said second rigid sheet and said flexible sheet in abutting relation;

such that said circuit pattern formed in said conductive layer extends between said flexible sheet and said first and second rigid sheets.

12. The method of claim 10, further comprising the steps of:

providing a second flexible sheet having an edge and a second rigid sheet having an edge;

positioning said second flexible and rigid sheets on a second side of said patterned conductive layer such that said second flexIble and rigid sheets overlay said first flexible and rigid sheets and such that the edges of said second flexible and rigid sheets are in abutting relation and whereby said patterned conductive layer is sandwiched between said first flexible and rigid layers and said second flexible and rigid layers.

13. The method of claim 12, further comprising the steps of drilling at least one thru-hole through said first and second rigid sheets and a part of said circuit pattern sandwiched therebetween and plating the thru-hole to make an electrical contact with the circuit pattern.

14. A method of making multilayer flexible printed circuits comprising the steps of:

(1) forming a plurality of printed circuit elements, each being formed by the steps of;

(a) providing an electrically conductive layer of material having two sides, first and second sheets of flexible electrically insulative material each having an edge, and first and second sheets of rigid printed circuit board substrate each having edges;

(b) positioning said first flexible sheet and said first rigid sheet on a first side of said electrically conductive layer of material with said edge of said first flexible and rigid sheets in abutting relation;

(c) bonding said first sheets to said electrically conductive layer of material while maintaining the edges of said first sheet in abutting relation;

(d) forming circuit pattern in said layer of electrically conductive material such that said circuit pattern extends between said first flexible and rigid shets;

(e) positioning said second flexible and rigid sheets on a second side of said pattern conductive layer such that said second flexible and rigid sheets overlay said first flexible and rigid sheets and such that the edges of said second flexible and rigid sheets are in abutting relation; and

(f) bonding said second flexible and rigid sheets to said patterned conductive layer and said first flexible and rigid sheets;

whereby said patterned conductive layer is sandwiched between said first flexible and rigid layers and said second flexible and rigid layers;

(2) arranging said plurality of circuit elements in a multilayer stack such that at 1east one portion of said multilayer stack does not include any layers of the flexible material therein; and

(3) bonding said plurality of circuit elements together through said portion of said stack that does not includes any of the flexible material.

15. The method of claim 14 further comprising the steps of:

(4) drilling at least one thru-hole through said portion of the multilayer flexible printed circuit which does not include any layers of the flexible material therein; and

(5) plating the thru-hole to make electrical contact with all layers of the electrically conductive material through which the thru-hole passes.