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Compressive pedestal for microminiature connections

  • US 4,716,049 A
  • Filed: 06/30/1986
  • Issued: 12/29/1987
  • Est. Priority Date: 12/20/1985
  • Status: Expired due to Fees
First Claim
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1. A method for making a resilient microelectronic connective member including the steps of:

  • providing a substrate for forming said resilient microelectronic connective member;

    covering said substrate with a substrate mask having an aperture;

    filling said aperture with a filling material which will form a positive meniscus at the top boundary of said substrate mask in order to form a rounded pillar on said substrate within said aperature;

    dissolving said substrate mask with a dissolving substance that will remove said substrate mask from said substrate but that will leave said pillar intact on said substrate;

    impressing a pedestal design mask over said pillar;

    depositing a layer of metal over said pedestal design mask in order to form a resilient microelectronic connective member; and

    dissolving said pillar with a dissolving substance that will remove said pillar but that will leave said resilient microelectronic connective member on said substrate.

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