Method of detecting the endpoint of the etch of epitaxially grown silicon

• US 4,717,446 A
• Filed: 09/18/1986
• Issued: 01/05/1988
• Est. Priority Date: 09/18/1986
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Nagy, Andrew G., Stemple, Donald K., Tracy, Clarence J.
• Primary Examiner(s): Bashore, S. Leon
• Assistant Examiner(s): DANG, THI D
• Application Number:
  US06/909,043
• Time in Patent Office: 474 Days
• Field of Search: 156/626, 156/627, 156/345, 156/643, 156/646, 148/175
• US Class Current: 438/14
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: G01B 11/0683 measurement during deposition or removal of the layer
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A method of detecting the endpoint of expitaxially grown silicon using a monitor wafer is described. A monitor wafer having a substrate, an oxide layer, and a polysilicon layer is process in an epi chamber along with working wafers. The monitor wafer is used to determine the endpoint of the working wafers epi layer when the epi layer is etched.

Claims

1. A method of detecting the endpoint of epitaxially grown silicon comprising the steps of:

providing a working wafer having a silicon substrate;

providing a monitor wafer having a substrate, an oxide layer disposed on said substrate, and a polysilicon layer disposed on said oxide layer;

growing an epitaxial layer on said working wafer and said monitor wafer simultaneously;

etching said working wafer and said monitor wafer;

detecting an endpoint between said polysilicon layer and said oxide layer of said monitor wafer using a laser; and

halting said etching when said endpoint is detected by said laser.

2. The method of claim 1 wherein said epitaxial layer grown on said working wafer is an epitaxial silicon layer.

3. The method of claim 1 wherein said epitaxial layer grown on said monitor wafer is an epitaxial polysilicon layer.

4. The method of claim 1 wherein said step of etching is a dry etching.

5. The method of claim 4 wherein said dry etching is a plasma etching.

6. The method of claim 1 wherein said step of detecting said endpoint is performed by laser interferometry.

7. A method of detecting the endpoint of epitaxially grown silicon comprising the steps of:

providing a working wafer having a silicon substrate;

providing a monitor wafer having a substrate, an oxide layer disposed on said substrate, and a polysilicon layer disposed on said oxide layer;

growing an epitaxial layer on said working wafer and said monitor wafer simultaneously;

processing said working wafer;

etching said working wafer and said monitor wafer;

detecting an endpoint between said polysilicon layer and said oxide layer of said monitor wafer using a laser; and

halting said etching when said endpoint is detected by said laser.

8. The method of claim 7 wherein said epitaxial layer grown on said working wafer is an epitaxial silicon layer.

9. The method of claim 7 wherein said epitaxial layer grown on said monitor wafer is an epitaxial polysilicon layer.

10. The method of claim 7 wherein said step of etching is a dry etching.

11. The method of claim 10 wherein said dry etching is a plasma etching.

12. The method of claim 7 wherein said step of detecting said endpoint is performed by laser interferometry.

13. A method of detecting the endpoint of epitaxially grown silicon comprising the steps of:

providing a working wafer having a silicon substrate;

providing a monitor wafer having a substrate, an oxide layer disposed on said substrate, and a polysilicon layer disposed on said oxide layer;

growing an epitaxial layer of silicon on said working wafer and an epitaxial layer of polysilicon on said monitor wafer simultaneously;

processing said working wafer;

etching said working wafer and said monitor wafer using a plasma etcher;

detecting an endpoint between said polysilicon layer and said oxide layer of said monitor wafer using laser interferometry; and

halting said etching when said endpoint is detected by said laser.