Process and apparatus for plasma treatment

• US 4,718,976 A
• Filed: 08/19/1986
• Issued: 01/12/1988
• Est. Priority Date: 03/31/1982
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Fujimura, Shuzo
• Primary Examiner(s): Massie, Jerome
• Application Number:
  US06/898,845
• Time in Patent Office: 511 Days
• Field of Search: 156/643, 156/345, 156/646, 204/182.32, 204/298, 239/390, 239/515
• US Class Current: 216/67
• CPC Class Codes: C23C 16/452 by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
• CPC Class Codes: C23C 16/455 characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
• CPC Class Codes: H01J 37/3244 Gas supply means

Abstract

A process and apparatus for plasma treatment by the use of a plasma generating chamber and a separate treating chamber in which an activated gas, excited in the plasma generating chamber, is introduced into the treating chamber, distributed within the treating chamber by a gas diffusing plate, and then is brought into contact with a material to be treated.

Claims

1. A process for plasma treatment of a material in a treating chamber using a separate plasma generating chamber, comprising the steps of:

(a) introducing an activated gas, excited in the plasma generating chamber, into the treating chamber through an activated gas opening, so that the activated gas impinges upon a gas diffusing device positioned in front of the activated gas opening perpendicular to the direction of the activated gas flow and parallel to the material in the treating chamber;

(b) distributing the activated gas within the treating chamber using the gas diffusing device after the activated gas has impinged upon the gas diffusing device, said distributing step comprising distributing the activated gas in a limited treating region defined by a barrier positioned within the treating chamber and extending from an upper portion at either side of the plasma generating chamber adjacent the activated gas opening to a lower portion at either side of the material to be treated; and

(c) bringing the activated gas into contact with the surface of the material to be treated downstream of the gas diffusing device within the treating chamber.

2. A process as claimed in claim 1, wherein said step (a) comprises introducing the activated gas into the treating chamber through the activated gas opening by way of a conductance regulating device.

3. A plasma treatment apparatus having a plasma generating chamber in which an activated gas is excited, and a separate treating chamber having a treating region for plasma treatment of a material, comprising:

a gas passageway connecting the plasma generating chamber to the treating chamber and having an opening for introducing the activated gas which is excited in the plasma generating chamber, into the treating chamber;

gas diffusing means, positioned laterally in front of the opening of the gas passageway upstream of the treating region within the treating chamber and perpendicular to the flow of the activated gas, for distributing the activated gas within the treating chamber; and

a barrier, positioned in the treatment chamber so as to surround said gas diffusing means, extending from an upper portion located adjacent the gas passageway to a lower portion adjacent the material to be treated, for defining the treating region.

4. A plasma treatment apparatus as claimed in claim 3, wherein said gas diffusing means is variable in size, wherein the distance at which said gas diffusing means is positioned from the activated gas opening is variable, and wherein the angle to which said gas diffusing means is positioned with respect to the axis of the activated gas opening is variable.

5. A plasma treatment apparatus as claimed in claim 3, further comprising conductance regulating means, positioned at the activated gas opening, for introducing the activated gas into the treating chamber.

6. A plasma treatment apparatus as claimed in claim 5, wherein said conductance regulating means has an opening which is variable in size.

7. A plasma treatment apparatus having a plasma generating chamber for exciting activated gas and having a separate treating chamber for plasma treatment of a material, comprising:

a gas passageway connecting the plasma generating chamber to the treating chamber and having an opening for introducing the activated gas which is excited in the plasma generating chamber, into the treating chamber;

a gas diffusing plate, positioned laterally in front of the opening of the gas passageway between the opening of the gas passageway and the material to be treated and perpendicular to the direction of flow of the activated gas, for distributing the activated gas within the treating chamber; and

a barrier, positioned in the treatment chamber so as to surround said gas diffusing plate, having an upper portion extending from the plasma generating portion to a lower portion adjacent the material to be treated, for defining a treating region.

8. A plasma treatment apparatus as claimed in claim 7, further comprising a conductance regulating plate having an aperture for defining the activated gas opening through which the activated gas is introduced into the treating chamber.

9. A plasma treatment apparatus as claimed in claim 8, further comprising means for varying the distance between said gas diffusing plate and said conductance regulating plate.

10. A plasma treatment apparatus as claimed in claim 9, further comprising means for varying the angle at which said gas diffusing plate is positioned with respect to the axis of the aperture in said conductance regulating plate.

11. A plasma treatment apparatus as claimed in claim 10, wherein said gas diffusing plate has a variable diameter.

12. A plasma treatment apparatus as claimed in claim 11, wherein the aperture of said condutance regulating plate has a variable diameter.

13. A plasma treatment apparatus as claimed in claim 8, further comprising means for varying the angle at which said gas diffusing plate is positioned with respect to the axis of the aperture in said conductance regulating plate.

14. A plasma treatment apparatus as claimed in claim 7, wherein said gas diffusing plate has a variable diameter.

15. A plasma treatment apparatus as claimed in claim 8, wherein the aperture of said conductance regulating plate has a variable diameter.

16. A plasma treatment apparatus as claimed in claim 8, further comprising a barrier, positioned in the treatment chamber so as to surround said gas diffusing plate, for defining a treating region.