Electronic memory card

• US 4,719,140 A
• Filed: 12/01/1986
• Issued: 01/12/1988
• Est. Priority Date: 11/05/1984
• Status: Expired due to Fees

• Current Assignee: Casio Computer Company Limited
• Original Assignee: Casio Computer Company Limited
• Inventors: Hara, Kazuya, Rikuna, Kenji
• Primary Examiner(s): Thomas, Alexander S.
• Application Number:
  US06/935,605
• Time in Patent Office: 407 Days
• Field of Search: 428/67, 428/137, 428/138, 428/916, 283/83, 283/904, 235/488, 235/492
• US Class Current: 428/138
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: Y10S 283/904 : Credit card
• CPC Class Codes: Y10T 428/22 : Nonparticulate element embedded or inlaid in substrate and visible
• CPC Class Codes: Y10T 428/24322 : Composite web or sheet
• CPC Class Codes: Y10T 428/24331 : including nonapertured component

Abstract

An IC card is disclosed, which comprises an IC pellet electrically connected to lead patterns via an anisotropically conductive adhesive layer. The IC pellet is also bonded to a print layer formed on an insulating film. A base sheet and another insulating film are laminated on the insulating film with the IC pellet sealed by resin in an IC pellet accommodation space formed in the base sheet.

Claims

1. An electronic memory card comprising:

a base sheet having a predetermined surface including an accomodation space sized for receiving an integrated semiconductor circuit pellet;

first electric conductive means which is formed on one surface of said base sheet and includes a plurality of first conductive leads each having a portion extended into said accomodation space formed in said base sheet;

at least one integrated semiconductor circuit pellet seated in said accomodation space and having a plurality of electrode terminals each of which is connected to a corresponding one of said plurality of first conductive leads;

an insulating film having substantially the same size of surface area as said base sheet and including a plurality of holes receiving therein input/output terminals, respectively, said insulating film including removable opaque means secured in a portion opposed to said Erasable and Programmable Read Only Memory for blocking light thereto;

second electric conductive means which is formed on an inner side of said insulating film and includes second conductive leads each having one end in contact with said corresponding first conductive lead and the other end extended into each of said plurality of holes.

2. An electronic memory card comprising:

a base sheet having an accomodation space sized for an integrated semiconductor circuit pellet;

at least one integrated semiconductor circuit pellet having a plurality of electrode terminals and sealed in said accomodation space;

an insulating film having a plurality of conductive leads, one end of each of which is opposed to one of said electrode terminals on the integrated semiconductor circuit pellet;

an anisotropically conductive layer interposed between said integrated semiconductor circuit pellet and said insulating film electrically coupling said electrode terminals to said conductive leads, respectively.

3. An electronic memory card according to claim 2, wherein said anisotropically conductive layer is fixedly secured to each of said conductive leads including each of one end thereof and to inner side of said insulative film.

4. An electronic memory card according to claim 2, wherein a resin fills said accomodation space.

5. An electronic memory card according to claim 2, wherein said insulating film comprises a plurality of holes with input/output terminals received therein, respectively.

6. An electronic memory card according to claim 5, wherein said insulating film is transparent and includes a decorative layer visible therethrough on the inside of the card.

7. An electronic memory card according to claim 5, wherein said integrated semiconductor circuit pellet includes an Erasable and Programmable Read Only Memory.

8. An electronic memory card comprising:

a base sheet having an accomodation space sized for an integrated semiconductor circuit pellet;

at least one integrated semiconductor circuit pellet having a plurality of electrode terminals and seated in said accomodation space;

an insulating film having a plurality of holes with input/output terminals received therein, respectively;

a plurality of conductive leads, one end of each of which is connected to one of said electrode terminals on the integrated semiconductor circuit pellet and the other end of which is coupled to an input/output terminal at one end of said holes, said conductive leads being formed on at least one of said base sheet and said insulating film; and

an anisotropically conductive layer interposed between said integrated semiconductor circuit pellet and said insulating film electrically coupling said electrode terminals to said conductive leads, respectively.