Film-type electrical element and connection wire combination and method of connection

• US 4,719,317 A
• Filed: 03/18/1986
• Issued: 01/12/1988
• Est. Priority Date: 04/03/1985
• Status: Expired due to Fees

• Current Assignee: WC Heraeus GmbH A Limited Liability Company of FED REP of Germany
• Original Assignee: WC Heraeus GmbH (Heraeus Holding GMBH)
• Inventors: Deckelmann, Karl, Reynolds, Quentin
• Primary Examiner(s): NIMMO, MORRIS
• Application Number:
  US06/840,923
• Time in Patent Office: 665 Days
• Field of Search: 228/248, 228/122, 228/123, 228/124, 228/179, 174/94 R, 428/432, 338/309, 338/322, 338/329, 339/275 C, 252/512, 252/514, 501/61, 501/75, 403/179, 403/270
• US Class Current: 174/94.00R
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/85801 Soldering or alloying
• CPC Class Codes: H01R 4/04 using electrically conductive adhesives
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/035 Paste overlayer, i.e. conductive paste or solder paste over conductive layer
• CPC Class Codes: H05K 2201/10287 Metal wires as connectors or conductors
• CPC Class Codes: H05K 2203/1453 Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 3/321 by conductive adhesives

Abstract

To form a sturdy, environmentally essentially unaffected and high-temperature resistance electrical connection between a connection wire (4) and a conductive track (2) on the substrate (1), a portion of the wire (4) is embedded in a unitary bonding element (3). The bonding element comprises about 70% of metal particles and 30% of glass particles to form a bonding spot. The bonding spot is made by applying a paste of glass and platinum powder, with the glass powder having a grain size several times larger than the platinum powder on the conductive track (2), pressing the end portion of the connection wire (4) into the spot so that the wire will be completely surrounded, and then firing the bonding spot. If the conductive track (2) is applied by film technology, firing of the conductive track (2) and of the bonding spot (3) can be carried out in a single operating step. Preferably, the conductive track and the bonding spot (3), as well as the connecting wire (4), have temperature coefficient-compatible components which, preferably, are similar or the same. The conductive track may be a temperature raising resistor (R).

Claims

1. Electrical or electronic component having

a substrate (1) having an essentially insulating surface;

a film-type conductive track (2) in layer form of conductive material (2) applied to the insulating substrate (1);

a connection wire (4); and

further comprising a unitary mechanical and electrical bonding connection (3) between the conductive track (2) and the connection wire (4),

which bonding connection is characterized by

a unitary element (3) of electrically conductive metal particles and glass particles,

wherein the metal particles ensure electrical connection between the conductive track (2) and the connection wire (4),

said unitary element (3) being bonded to the conductive track (2)

wherein at least in part, an end portion of said connection wire (4) is surrounded by and embedded in said unitary element; and

wherein the metal particles comprise metal powder present in between 40 to 80% (by weight) of the unitary element (3).

2. Component according to claim 1, wherein the metal powder is present in between about 50 to 75%.

3. Component according to claim 2, wherein the metal powder is present in about 70%.

4. Component according to claim 1, wherein the metal powder comprises a powder of platinum, or of a platinum alloy.

5. Component according to claim 1, wherein the metal powder has an average grain size of between about 1.5 to 5 micrometers.

6. Component according to claim 2, wherein the metal powder has an average grain size of about 2 micrometers.

7. Component according to claim 1, wherein the glass particles comprise lead-boron-silicate glass.

8. Component according to claim 7, wherein the glass particles comprise

PbO--40 to 90%

B₂ O₃ --5 to 20%

SiO₂ --5 to 55%

(all percentages by weight).

9. Component according to claim 8, wherein the glass particles comprise

PbO--45 to 60%

B₂ O₃ --7 to 15%

SiO₂ --30 to 45%.

10. Component according to claim 9, wherein the glass particles comprise

PbO--about 50%

B₂ O₃ --about 10%

SiO₂ --about 40%.

11. Component according to claim 7, wherein the glass particles further comprise at least one of:

CaO--up to 8%

Al₂ O₃ --up to 6%.

12. Component according to claim 1, wherein the glass particles have a grain size of between about 3 to 50 micrometers.

13. Component according to claim 12, wherein the glass particles have a grain size of 5 to 30 micrometers.

14. Component according to claim 6, wherein the glass particles have a grain size of about 8 micrometers.

15. Component according to claim 1, wherein the unitary element (3) comprises the residue of a paste formed by said metal particles and glass particles and a solvent comprising

ethyl cellulose--about 1.8%

terpineol--about 8%

dibutylphthalate--about 1.8%

all percentages by weight of the entire paste prior to firing, said paste having been fired at a temperature in excess of the vaporization temperature of said solvent.

16. Component according to claim 1, wherein said unitary element (3) comprises the residue of a paste formed by about 62% metal particles;

about 26.4% glass particles, said glass particles comprising about 50% PbO, about 10% B₂ O₃ and about 40% SiO₂ ;

and the remainder formed by a solvent, said solvent comprising

about 1.8% ethyl cellulose, about 8% terpineol and about 1.8% dibutylphthalate

all percentages by weight and before evaporation of the solvent upon firing.

17. Component according to claim 1, wherein the average diammetrical particle or grain size of the glass particles is at least several times as great as the grain size of the metal particles to provide for association of a plurality of metal particles with any one glass particle.

18. Electrical or electronic component having

a substrate having an essentially insulating surface;

a film-type conductive track (2) in layer form of conductive material applied to the insulating surface of the substrate (1);

a connection wire (4) and

comprising a unitary and electrical bonding connection between the conductive track (2) and the connection wire, which bonding connection is characterized by a unitary element comprising the residue of a paste formed by metal particles which ensure electrical connection between the conductive track (2) and the connection wire (4) and glass particles, and a solvent, which residue occurs after firing of said paste and evaporation of the solvent, said unitary element being bonded to the conductive track and, at least in part, embedding and surrounding an end portion of said connection wire within said unitary element; and

wherein the metal particles comprise metal powder present in between 40 to 80% (by weight) of the unitary element (3).

19. The electrical or electronic component of claim 18, wherein said film-type conductive track and the paste forming said unitary element are of essentially the same composition and are being bonded together by simultaneous firing in one firing step.

33. The electrical or electronic component of claim 19 wherein the average diametrical particle or grain size of the glass particles is at least several times as great as the grain size of the metal particles to provide for association of a plurality of metal particles with any one glass particle.

34. The electrical or electronic component of claim 33 wherein the metal powder is present in between about 50 to 75%, and has an average grain size of between about 1.5 to 5 micrometers.

20. Electrical or electronic component having

a substrate (1) having an essentially insulating surface;

a film-type conductive track (2) in layer form of conductive material (2) applied to the insulating substrate (1);

a connection wire (4); and

further comprising a unitary mechanical and electrical bonding connection (3) between the conductive track (2) and the connection wire (4),

which bonding connection is characterized by

a unitary element (3) of electrically conductive metal particles and glass particles,

wherein the metal particles ensure electrical connection between the conductive track (2) and the connection wire (4),

said unitary element (3) being bonded to the conductive track (2)

wherein at least in part, an end portion of said connection wire (4) is surrounded by and embedded in said unitary element; and

wherein the metal powder comprises a powder of platinum, or of a platinum alloy.

21. Electrical or electronic component having a substrate (1) having an essentially insulating surface;

a film-type conductive track (2) in layer form of conductive material (2) applied to the insulating substrate (1);

a connection wire (4); and

further comprising a unitary mechanical and electrical bonding connection (3) between the conductive track (2) and the connection wire (4),

which bonding connection is characterized by

a unitary element (3) of electrically conductive metal particles and glass particles,

wherein the metal particles ensure electrical connection between the conductive track (2) and the connection wire (4),

said unitary element (3) being bonded to the conductive track (2)

wherein at least in part, an end portion of said connection wire (4) is surrounded by and embedded in said unitary element; and

wherein the metal powder has an average grain size of between about 1.5 to 5 micrometers.

22. Electrical or electronic component having a substrate (1) having an essentially insulating surface;

a film-type conductive track (2) in layer form of conductive material (2) applied to the insulating substrate (1);

a connection wire (4); and

further comprising a unitary mechanical and electrical bonding connection (3) between the conductive track (2) and the connection wire (4),

which bonding connection is characterized by

a unitary element (3) of electrically conductive metal particles and glass particles,

wherein the metal particles ensure electrical connection between the conductive track (2) and the connection wire (4),

said unitary element (3) being bonded to the conductive track (2)

wherein at least in part, an end portion of said connection wire (4) is surrounded by and embedded in said unitary element; and

wherein the glass particles comprise lead-boron-silicate glass.

23. Component according to claim 22, wherein the glass particles comprise

PbO--40 to 90%

B₂ O₃ --5 to 20%

SiO₂ --5 to 55%

(all percentages by weight).

24. Component according to claim 22, wherein the glass particles comprise

PbO--45 to 60%

B₂ O₃ --7 to 15%

SiO₂ --30 to 45%.

25. Component according to claim 22, wherein the glass particles comprise

PbO--about 50%

B₂ O₃ --about 10%

SiO₂ --about 40%.

26. Component according to claim 22, wherein the glass particles further comprise at least one of:

CaO--up to 8%

Al₂ O₃ --up to 6%.

27. Component according to claim 22, wherein the glass particles have a grain size of between about 3 to 50 micrometers.

28. Component according to claim 22, wherein the glass particles have a grain size of 5 to 30 micrometers.

29. Component according to claim 22, wherein the glass particles have a grain size of about 8 micrometers.

30. Component according to claim 22, wherein the unitary element (3) comprises the residue of a paste formed by said metal particles and glass particles and a solvent comprising

ethyl cellulose--about 1.8%

terpineol--about 8%

dibutylphthalate--about 1.8%

all percentages by weight of the entire paste prior to firing, said paste having been fired at a temperature in excess of the vaporization temperature of said solvent.

31. Component according to claim 22, wherein said unitary element (3) comprises the residue of a paste formed by about 62% metal particles;

about 26.4% glass particles, said glass particles comprising about 50% PbO, about 10% B₂ O₃ and about 40% SiO₂ ;

and the remainder formed by a solvent, said solvent comprising

about 1.8% ethyl cellulose, about 8% terpineol and about 1.8% dibutylphthalate

all percentages by weight and before evaporation of the solvent upon firing.

32. Component according to claim 22, wherein the average diammetrical particle or grain size of the glass particles is at least several times as great as the grain size of the metal particles to provide for association of a plurality of metal particles with any one glass particle.