Semiconductor device having a protection circuit with lateral bipolar transistor

• US 4,720,737 A
• Filed: 12/22/1986
• Issued: 01/19/1988
• Est. Priority Date: 06/30/1983
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Shirato, Takehide
• Primary Examiner(s): CLAWSON JR, JOSEPH
• Application Number:
  US06/943,867
• Time in Patent Office: 393 Days
• Field of Search: 357/23.13, 357/13, 357/35, 357/43, 357/51, 365/56, 365/91
• US Class Current: 257/362
• CPC Class Codes: H01L 27/0251 for MOS devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A protection circuit for inner elements such as metal insulator semiconductor (MIS) field effect transistors in a semiconductor device of high packing density has been improved. The protection circuit comprises protective elements of two types. One type has a deep diffusion region providing the element with high surge capacity, that is an ability to withstand the energy of an incoming surge, and the other type has a shallow diffusion region providing a low breakdown voltage. With a combination of these two types of protective element, the protection circuit can withstand high energy of an input surge and, at the same time, provide a low protection voltage suitable to protect the inner elements from breakdown.

Claims

1. A semiconductor device including a semiconductor substrate of a first conductivity type, at least one terminal for providing at least one of input and output signals, a protection circuit and an inner element, said protection circuit comprising:

a first protective element comprising a diode having a first impurity region of a second conductivity type opposite to said first conductivity type of said substrate, a first end of said first impurity region being connected to said terminal; and

a second protective element comprising a lateral bipolar transistor having a collector region and an emitter region, both of said collector and emitter regions having the second conductivity type, being formed in said substrate, being arranged to but separate from each other so as to define a base region in said substrate, and being shallower than said first impurity region, a first end of said collector region being connected to a second end of said first impurity region that is spaced from said first end thereof, a second end of said collector region being connected to said inner element, and said emitter region being electrically connected to ground;

wherein said terminal, said first protective element, said second protective element and said inner element are operatively connected in series in the recited order, and said first protective element has a higher surge capacity and higher junction breakdown voltage than that of said second protective element as a result of said first impurity region and said collector region;

so that a protection voltage corresponding to said at least one of said input and output signals is provided by said protection circuit to said inner element.

2. The device of claim 1, wherein a first conductive means connects from said first end of said first impurity region to said terminal, and a second conductive means connects said second end of said first impurity region to said first end of said second protective element, so that the respective resistance of said first impurity region between said first and second ends thereof is in series between said terminal and said second protective element.

3. The device of claim 1, or 2, wherein said first protective element removes excess energy from said input signals provided at said terminal, and said second protective element limits the value of said protection voltage supplied to said inner element in correspondence to said input signal.

4. The device of claim 1, or 2, wherein said terminal is for a predetermined one of said input signals along and of the combination of said input signals and output signals.

5. The device of claim 4, said terminal being for the combination of input and output signals, wherein respective input and output circuits each comprise respective ones of said series-connected first and second protective elements and inner circuit connected to said at least one terminal.

6. The device of claim 1, wherein said inner element is protected from a surge of 350 volts on said at least one of said input and output signals.

7. The device of claim 6, said junction breakdown voltage of said first protective element being approximately 5 volts higher than that of said second protective element.

8. The device of claim 7, said junction breakdown voltage of said first protective element being approximately 35 volts.

9. The device of claim 1, wherein said collector region of said second protective element is connected to the same potential as said substrate.

10. The device of claim 1, said inner element having an impurity region of said seond conductivity type in said substrate, of the same depth as said second and third impurity regions of said second protective element.

11. The device of claim 6, said inner element having an impurity region of said second condutivity type in said substrate, of the same depth as said collector and emitter regions of said second protective element.

12. The device of claim 9, said inner element having an impurity region of said second conductivity type in said substrate, of the same depth as said collector and emitter regions of said second protective element.

13. The device of claim 1, said collector region comprising a drain of a transistor of said inner element.

14. The device of claim 1, wherein said first protective element prevents destructive burn-out of said second protective element.

15. The device of claim 1, said inner element having an impurity region of said second conductivity type in said substrate, wherein said collector and emitter regions of said second protective element are respectively selected to be larger and smaller than said impurity region of said inner element.