Constant impedance integrated circuit connector

• US 4,720,770 A
• Filed: 11/03/1986
• Issued: 01/19/1988
• Est. Priority Date: 11/03/1986
• Status: Expired due to Fees

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Jameson, Tom G.
• Primary Examiner(s): Leung, Philip H.
• Assistant Examiner(s): Thompson, Gregory D.
• Application Number:
  US06/926,154
• Time in Patent Office: 442 Days
• Field of Search: 165/80.3, 165/80 B, 165/185, 174/16 HS, 174/35 R, 174/51, 174/75 C, 339/112 R, 339/17 CF, 339/143 R, 339/177 R, 339/177 E, 357/81, 361/386-388, 361/413, 361/424
• US Class Current: 361/705
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01R 13/6585 Shielding material individually surrounding or interposed between mutually spaced contacts
• CPC Class Codes: H01R 2103/00 Two poles
• CPC Class Codes: H01R 24/44 comprising impedance matching means
• CPC Class Codes: H01R 24/50 mounted on a PCB [Printed Circuit Board]

Abstract

An interconnecting grid is disclosed for joining integrated circuit components. The grid has the form of a honeycomb, and is made up of a plurality of interconnected hexagonal conduits, each conduit surrounding an associated pin extended from the integrated circuit component. Each conduit surrounds its associated pin to protect the pin from mechanical damage and isolate the pin from signals emitted by neighboring pins and other extraneous noise. The grid further functions as a heat sink for the removal of heat from the integrated circuit component.

Claims

1. An integrated circuit device comprising:

a dielectric body, and a metallized layer including an integrated circuit mounted over the dielectric body;

a plurality of electrically conductive elongate contacts mounted with respect to the dielectric body, in electrical communication with said integrated circuit, and extending away from said dielectric body in a first direction; and

a plurality of electrically conductive conduit members mounted with respect to said dielectric body and extending in said first direction, each of said conduit members positioned in spaced apart and surrounding relation to an associated one of said elongate contacts;

said conduit members being interconnected to form a unitary grid in which said conduit members form a pattern corresponding to the pattern formed by said elongated contacts.

2. The integrated circuit device of claim 1 wherein:

said elongated connectors comprise pins embedded in said dielectric body and protruding outward from the dielectric body in said first direction.

3. The integrated circuit device of claim 2 wherein:

each of said conduit members includes a plurality of discrete wall segments, and at least one of the wall segments of each conduit member is shared with an adjacent conduit member.

4. The integrated circuit device of claim 3 wherein:

said conduit members are hexagonal and form a grid having the shape of a honeycomb, and said pins are arranged in parallel longitudinal rows, with the pins in each row longitudinally offset from the pins in next adjacent rows.

5. The integrated circuit device of claim 1 wherein:

the spacing between each of said contacts and its associated conduit member is selected to maintain a predetermined impedance at each of said contacts.

6. The integrated circuit device of claim 5 wherein:

each of said contacts comprises a pin circular in cross-section and centered within its associated conduit member.

7. The integrated circuit device of claim 1 wherein:

each of said elongate contacts is flat and rectangular in cross-section with a cross-sectional width greater than its cross-sectional thickness, each of said conduit members is hexagonal, and wherein each of said contacts is positioned in its associated conduit member such that a plane including two opposite corners of said conduit member passes through said associated contact in the direction of the width of said contact.

8. The integrated circuit device of claim 1 wherein:

said grid is mounted with respect to said dielectric body by a thermally conductive epoxy adhesive.

9. The integrated circuit device of claim 1 wherein:

said grid is soldered to said metallized layer.

10. The integrated circuit device of claim 1 wherein:

said dielectric body is substantially flat and rectangular, with said elongate contacts embedded in said dielectric body and extending from opposite sides of said body, and wherein first contact portions of said contacts are extended from one side of said body, and surrounded by first ones of said conduit members mounted on said one side and second contact portions of said contacts, larger in cross-section than said first contact portions, are extended from the opposite side of said body, said second contacts surrounded by correspondingly larger second ones of said conduit members mounted to said opposite side of the body.

11. The integrated circuit device of claim 1 in combination with apparatus including:

an elongate connector means mounted to a dielectirc base, extended therefrom and adapted for electrical and mechanical engagement with an associated one of said contacts; and

a plurality of elastically deformable connector members mounted to said dielectric base and extending therefrom generally parallel to said connector means and in spaced apart relation to said connector means, and adapted for insertion into an associated one of said conduit members, elastically deforming upon said insertion to guide said connector means into said electrical and mechanical engagement with said associated contact and to frictionally maintain said engagement.

12. The integrated circuit device of claim 11 wherein:

each of said conduit members includes a plurality of discrete wall segments, with each of said connector members adapted to engage one of said segments upon said insertion.

13. The integrated circuit device of claim 12 wherein:

said conduit members are hexagonal and form a grid having the shape of a honeycomb, and said contacts are arranged in parallel longitudinal rows, with the contacts in each row longitudinally offset from the contacts in adjacent rows.

14. The integrated circuit device of claim 11 wherein:

said connector members and said connector means comprise electrically conductive prongs.

15. The integrated circuit device of claim 11 wherein:

said first contacts comprise pins.

16. The integrated circuit device of claim 15 wherein:

each of said connector means comprises a plurality of associated spring loaded prongs adapted to frictionally engage their associated pin.

17. The integrated circuit device of claim 11 wherein:

said plurality of connector members comprise at least four of said connector members associated with each of said connector means.

18. An integrated circuit device including:

an integrated circuit chip having a substantially flat top surface and a substantially flat bottom surface;

a plurality of elongate, conductive first contacts mounted to said integrated circuit chip and extended away from said bottom surface in a first direction; and

a plurality of elongate, conductive second contacts mounted to said integrated circuit chip and extended away from said top surface in a second direction;

a first unitary grid comprising a plurality of conductive first conduit members mounted to said integrated circuit chip and extended away from said bottom surface in said first direction, each of said first conduit members surrounding an associated one of said first contacts and spaced apart from said associated contact a predetermined distance to determine a selected characteristic impedance in said associated first contact; and

a second unitary grid comprising a plurality of conductive second conduit members mounted to said integrated circuit chip and extended away from said top surface in said second direction, each of said second conduit members surrounding an associated one of said second contacts and spaced apart from said associated second contact a predetermined distance to determine a selected characteristic impedance in said associated second contact.

19. The integrated circuit device of claim 18 wherein:

said first contacts comprise signal pins, and said second contacts comprise test pins.

20. The integrated circuit device of claim 19 further including:

a plurality of elongate, conductive third contacts mounted to said integrated circuit chip and extended away from said top surface in said second direction, said third contacts being larger than said first contacts and said second contacts; and

a third unitary grid comprising a plurality of conductive third conduit members mounted to said integrated circuit chip and extended way from said top surface in said second direction, each of said third conduit members being larger than said first conduit members and said second conduit members, surrounding an associated one of said third contacts, and spaced apart from said associated third contact a predetermined distance to determine a selected characteristic impedance in said associated third contact.