Methods of using photosensitive compositions containing microgels

• US 4,726,877 A
• Filed: 12/18/1986
• Issued: 02/23/1988
• Est. Priority Date: 01/22/1986
• Status: Expired due to Fees

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Fryd, Michael, Suess, Terry R.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/943,070
• Time in Patent Office: 432 Days
• Field of Search: 427/96-98, 427/272, 427/282, 428/901, 29/846, 29/852, 174/68.5, 430/270, 430/281, 430/288, 430/313, 430/315, 430/318, 430/323, 430/324, 156/630, 156/634, 156/656, 156/659.1, 156/666, 156/901, 156/902
• US Class Current: 430/281.1
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A solid photopolymerizable composition, contains addition polymerizable ethylenically unsaturated monomer, initiating system, polymer binder and a microgel wherein preferably the binder and microgel form substantially a single phase and have a similar glass transition temperature above 25° C. Although less preferred the solid composition can function without the binder. A preferred use is as a photoresist.

Claims

1. In a process for laminating a photosensitive film to a substrate comprising the steps of

(a) laminating to the substrate a supported solid photosensitive film,

(b) imagewise exposing the layer to actinic radiation,

(c) removing unexposed areas of the layer to form resist areas,

(d) permanently modifying areas of the substrate which are unprotected by the resist areas by etching the substrate or by depositing a material onto the substrate, and

wherein the improvement comprises the photosensitive film which contains

(a) addition polymerizable ethylenically unsaturated monomer,

(b) initiating system activated by actinic radiation,

(c) preformed macromolecular polymer binder, and

(d) microgel,

wherein the photosensitive composition is a solid and wherein at least one of the following is present:

(i) the polymer binder and microgel form substantially one phase as viewed by the naked eye, or

(ii) the polymer binder and microgel have glass transition temperatures which do not differ by more than 50°

C. with the microgel having a glass transition temperature above 25°

C.

2. The process of claim 1 wherein after step (d) the resist areas are removed from the substrate.

3. The process of claim 1 wherein properties (i) and (ii) are present.

4. The process of claim 3 wherein the substantially one phase is present and observable after a magnification of 10 times.

5. The process of claim 4 wherein the substantially one phase is present and observable after a magnification of 100 times.

6. The process of claim 3 wherein the glass transition temperature of the polymer binder and the microgel do not differ by more than 25°

C.

7. The process of claim 3 wherein the microgel swells at least 10% in at least one of the following solvents:

n-heptane, carbon tetrachloride, toluene, methylene chloride, ethyl acetate, acetone, acetonitrile, acetic acid, dimethylsulfoxide, dimethylformamide, formamide, water, aqueous ammonium hydroxide solution containing up to 10% by weight ammonia, aqueous potassium hydroxide solution containing up to 10% by weight potassium hydroxide, methylene chloride-methanol solution containing by weight 92% methylene chloride and 8% methanol, and aqueous sodium carbonate solution containing by weight 1% sodium carbonate.

8. The process of claim 7 wherein the microgel swells at least 50% in at least one of the solvents.

9. The process of claim 3 which has a creep viscosity of at least 20 megapoise.

10. The process of claim 9 which has a creep viscosity of at least 40 megapoise.

11. In a process for laminating a photosensitive film to a substrate comprising

(a) laminating to the substrate a supported solid photosensitive film,

(b) imagewise exposing the layer to actinic radiation,

(c) removing unexposed areas of the layer to form resist areas,

(d) permanently modifying areas of the substrate which are unprotected by the resist areas by etching the substrate or by depositing a material onto the substrate, and

wherein the improvement comprises the photosensitive film which contains

(a) addition polymerizable ethylenically unsaturated monomer,

(b) initiating system activated by actinic radiation, and

(c) microgel,

wherein the photosensitive composition is a solid with the proviso that the photosensitive composition is substantially free of any preformed macromolecular polymer binder.

12. The process of claim 11 wherein after step (d) the resist areas are removed from the substrate.

13. The process of claim 11 wherein the microgel swells at least 10% in at least one of the following solvents:

n-heptane, carbon tetrachloride, toluene, methylene chloride, ethyl acetate, acetone, acetonitrile, acetic acid, dimethylsulfoxide, dimethylformamide, formamide, water, aqueous ammonium hydroxide solution containing up to 10% by weight ammonia, aqueous potassium hydroxide solution containing up to 10% by weight potassium hydroxide, methylene chloride-methanol solution containing by weight 92% methylene chloride and 8% methanol, and aqueous sodium carbonate solution containing by weight 1% sodium carbonate.

14. The process of claim 13 wherein the microgel swells at least 50% in at least one of the solvents.

15. The process of claim 11 which has a creep viscosity of at least 20 megapoise.

16. The process of claim 15 which has a creep viscosity of at least 40 megapoise.