Semiconductor power module with an integrated heat pipe
First Claim
1. Semiconductor power module, comprising a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent said ceramic plate at said opening, a heat pipe integrated in the semiconductor power module having a vapor space, a condensation zone and a heating zone for distributing heat removed from said semiconductor power component at said heating zone over an area of said condensation zone being larger than said given size, a highly heat-conducting ceramic base plate having two metallized sides, a frame sealingly interconnecting said carrier plate and said base plate forming said vapor space of said heat pipe therebetween, and a working liquid in said heat pipe, all parts of said heat pipe contacting said working liquid being formed of a material from the group consisting of ceramic, copper and copper-coated material.
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Accused Products
Abstract
A semiconductor power module includes a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent the ceramic plate at the opening, a heat pipe integrated in the semiconductor power module having a vapor space, a condensation zone and a heating zone for distributing heat removed from the semiconductor power component at the heating zone over an area of the condensation zone being larger than the given area, a highly heat-conducting ceramic base plate having two metallized sides, and a frame vacuum-tightly interconnecting the carrier plate and the base plate forming the vapor space of the heat pipe therebetween.
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Citations
14 Claims
- 1. Semiconductor power module, comprising a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent said ceramic plate at said opening, a heat pipe integrated in the semiconductor power module having a vapor space, a condensation zone and a heating zone for distributing heat removed from said semiconductor power component at said heating zone over an area of said condensation zone being larger than said given size, a highly heat-conducting ceramic base plate having two metallized sides, a frame sealingly interconnecting said carrier plate and said base plate forming said vapor space of said heat pipe therebetween, and a working liquid in said heat pipe, all parts of said heat pipe contacting said working liquid being formed of a material from the group consisting of ceramic, copper and copper-coated material.
Specification