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Method for imaging printed circuit board component leads

  • US 4,728,195 A
  • Filed: 03/19/1986
  • Issued: 03/01/1988
  • Est. Priority Date: 03/19/1986
  • Status: Expired due to Term
First Claim
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1. A method for generating a component pin signature for an assembled printed circuit board, the method comprising the steps of(A) simultaneously illuminating with a light source at least a substantial portion of a solder pad of the circuit board, said solder pad being associated with a component hole in the board and being arranged for electrical connection with a component lead passed through the component hole,(B) receiving with a photoreceptor emissions reflected from the illuminated portion of said solder pad, said photoreceptor being so arranged that passage of the component lead through the component hole occludes or shadows a portion of the solder pad from which the photoreceptor would otherwise receive reflected emissions, and(C) generating an imaging signal representative of emissions received at the photoreceptor.

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