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Semiconductor power module with ceramic substrate

  • US 4,731,644 A
  • Filed: 06/16/1986
  • Issued: 03/15/1988
  • Est. Priority Date: 06/15/1985
  • Status: Expired due to Term
First Claim
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1. Semiconductor power module, comprising a cap-shaped plastic housing, a ceramic substrate with upper and lower surfaces being disposed in and forming a bottom surface of said housing, upper and lower metallizations respectively disposed on said upper and lower surfaces of said substrate, components disposed on said upper metallization, at least one support having upper and lower parts and being disposed on said substrate in said housing, a first elastomeric soft casting compound disposed in said housing covering said substrate and said lower part of said at least one support, said upper part of said at least one support protruding from said first casting compound, and a second thermo-setting hard casting compound covering said upper part of said at least one support and connecting said upper part to said housing.

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