Cast membrane protected pressure sensor

• US 4,732,042 A
• Filed: 04/22/1986
• Issued: 03/22/1988
• Est. Priority Date: 04/22/1986
• Status: Expired due to Term

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Adams, Victor J.
• Primary Examiner(s): Pellinen, A. D.
• Assistant Examiner(s): WILLIAMS, HOWARD L
• Application Number:
  US06/855,055
• Time in Patent Office: 700 Days
• Field of Search: 357/26, 357/72, 73/706, 73/715, 73/723, 73/725, 73/726, 73/727, 73/756, 73/DIG. 4, 73/754, 73/724, 338/4, 338/42, 338/226, 338/252, 338/253, 174/52 PE, 361/331, 128/748, 128/675
• US Class Current: 73/706
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: Y10S 73/04 Piezoelectric

Abstract

A solid state semiconductor pressure sensor is described in which the pressure sensor element is protected from the ambient whose pressure is being measured by a combination of a pressure transfer medium and a thin covering membrane. A method is described for applying the thin covering membrane so as to substantially avoid entrapment of air or formation of voids in the pressure transfer medium which would degrade the performance of the sensor. The pressure transfer medium is a gel-like material such as a silicone rubber. The membrane is chosen to be substantially impermeable to the ambients being measured and sufficiently flexible to avoid attenuation of the input pressure signal. The membrane is cast in place by applying a thin liquid coating or a heat deformable film over the pressure transfer medium and then converting it into a thin solid membrane stuck to the pressure transfer medium and the pressure sensor body.

Claims

1. An environmentally protected pressure sensor, comprising:

a body;

a cavity formed in an opening in said body, having a first surface for receiving a pressure sensing element and a substantially rigid second surface extending from said first surface to said opening;

a pressure sensing element sealably mounted on said first surface and having a pressure sensing region facing said cavity;

lead means in said body for providing electrical connections to said sensing element, wherein said lead means have first ends external to said body and second ends in said cavity;

a non-gaseous pressure transfer medium in contact with said pressure sensing region and partially filling said cavity and in contact with said second surface and having an exposed surface; and

a homogeneous thin flexible membrane means sealed to said second surface and said exposed surface of said pressure transfer medium and responsive to an external pressure, for preventing materials from the environment from reaching said sensor element, wherein said membrane means has a first thickness over said exposed surface and a second thickness less than said first thickness where it seals to said second surface.

2. The pressure sensor of claim 1 wherein said pressure transfer medium has an elasticity, as measured using a Universal Penetrometer with a 19.5 gm shaft and a 6.35 mm diameter foot, in the range of 2-8 mm penetration or larger.

3. The pressure sensor of claim 1 wherein said membrane means has a Shore A hardness less than 70.