Bidirectional optoelectronic component operating as an optical coupling device

• US 4,733,094 A
• Filed: 05/09/1986
• Issued: 03/22/1988
• Est. Priority Date: 05/10/1985
• Status: Expired due to Fees

• Current Assignee: Thomson-CSF (Thales SA)
• Original Assignee: Thomson-CSF (Thales SA)
• Inventors: Morel, Philippe, Simon, Jacques, Carpentier, Jean F.
• Primary Examiner(s): Nelms, David C.
• Assistant Examiner(s): Allen, Stephone B.
• Application Number:
  US06/861,567
• Time in Patent Office: 683 Days
• Field of Search: 250/227, 250/551, 350/96.15, 357/19, 455/606, 455/618, 455/619
• US Class Current: 250/551
• CPC Class Codes: G02B 6/2817 using reflective elements to split or combine optical signals
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

The invention concerns bidirectional optical fiber connections, and more particularly an optical coupling device between an emitting electroluminescent diode and a detecting photodiode, the optoelectronic component according to the invention comprising an electroluminescent diode called DEL sealed in a box of the transistor box type the cover of which carries a microlens centered on the optical axis of the box, while inside the box are integrated: a photodiode mounted at the side of the DEL and outside the optical axis, a semitransparent mirror and a mirror support, this support being machined so as to form a second mirror that reflects light to be detected towards the detecting diode; the novel component can be used in bidirectional optical connections, in computers and telephone exchange centers.

Claims

1. A bidirectional optoelectronic photocoupler comprising:

a encapsulating box;

a micro lens mounted through the top surfaces of said box;

a light emitting diode mounted on a mounting surface on the bottom of said box in line with the optical axis of said microlens;

at least one detecting photodiode mounted on the same mounting surface as said light emitting diode and outside the optical axis of said microlens;

first planar reflecting means placed within said box along the optical axis of said microlens and inclined with respect to said axis made of a semitransparent mirror;

second planar reflecting means placed within said box in a parallel plane to said first planar reflecting means; and

support means for holding said first and second planar reflecting means in said box.

2. An optoelectronic photocoupler according to claim 1, wherein the luminous radiation emitted by said light emitting diode is essentially transmitted without deflection, along the optical axis of the microlens through the first plane reflecting means and is partially reflected by the face of the said, second planar reflecting means which is located opposite the light emitting diode

3. An optoelectronic photocoupler according to claim 1, further comprising;

a adjusting photodiode, mounted on the mounting surface next to the light emitting diode for providing a feedback signal to control said light emitting diode;

third reflecting means, for reflecting in the direction of the adjusting photodiode the luminous radiation emitted by the light emitting diode and partially reflected by the semitransparent mirror.

4. An optoelectronic photocoupler according to claim 1, 2 or 3, wherein semitransparent mirror is constituted by a strip of transparent material, such as glass or quartz, the faces of which are treated so as to confer thereupon a transmission coefficient suitable for the luminous radiation.

5. An optoelectronic photocouplet according to claim 1, wherein the support means comprises a piece, the external profile of which corresponds to the internal profile of the cover of the box, said support being provided at its center with a hole centered on the optical axis for the passage of the luminous radiation, and being provided on the side facing the microlens and with a plane inclined with respect to the optical axis and on which is fixed the semitransparent mirror, and further provided on the side of the light emitting diode with at least one plane the surface of which is polished, forming at least one reflecting surface.

6. An optoelectronic photocoupler according to claim 5, wherein the support means is fixed inside the cover of the box by force fitting and glueing.

7. An optoelectronic photocoupler according to claim 5, wherein the support means is fixed within the cover of the box by local deformation of the cover.

8. An optoelectronic photocoupler according to claim 5, wherein the support means is positioned inside the cover of the box by means of a sleeve that rests upon the base plate of the box, and is maintained in position by means of a resilient washer.

9. An optoelectronic photocoupler according to claim 1, which is associated to an optical fiber in a monofiber bidirectional connection.