Use of a copper-titanium-cobalt alloy as the material for electronic components

• US 4,734,255 A
• Filed: 03/25/1986
• Issued: 03/29/1988
• Est. Priority Date: 04/02/1985
• Status: Expired due to Fees

• Current Assignee: Wieland-Werke AG (Schwenk Donau GmbH & Company KG)
• Original Assignee: Wieland-Werke AG (Schwenk Donau GmbH & Company KG)
• Inventors: Stueer, Heinrich, Puckert, Franz J., Duerrschnabel, Wolfgang
• Primary Examiner(s): Rutledge, L. Dewayne
• Assistant Examiner(s): WYSZOMIERSKI, GEORGE P
• Application Number:
  US06/843,944
• Time in Patent Office: 735 Days
• Field of Search: 420/492, 420/496, 148/432, 148/411, 148/414
• US Class Current: 420/492
• CPC Class Codes: C22C 9/00 Alloys based on copper
• CPC Class Codes: C22C 9/06 with nickel or cobalt as the next major constituent
• CPC Class Codes: H01L 23/49579 characterised by the materials of the lead frames or layers thereon
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to the use of a copper-titanium-cobalt-alloy which consists of 0.05-0.6% titanium; 0.05-0.6% cobalt; remainder copper, whereby the cobalt is partially replaced by iron. Due to its excellent characteristics with respect to electrical and thermal conductivity, mechanical strength, softening resistance and homogeneity, the alloy is used as the material for electronic components, in particular lead frames for transistors, integrated circuits or the like, and parts for electronic components for automobiles.

Claims

1. A supporting or connecting element of an electronic device, said element being made of an alloy consisting of:

space="preserve" listing-type="tabular">______________________________________ Ti 0.05-0.6 wt. % Co 0.05-0.6 wt. % Cu and balance unavoidable impurities ______________________________________

wherein the weight ratio of Ti/Co is from 1.0 to 1.5.

2. An element as claimed in claim 1, which is a lead frame.

3. An element as claimed in claim 1, in which said alloy is essentially free of zinc, tin, nickel, silicon, aluminum, cadmium, beryllium, lead, selenium and tellurium.

4. An alloy consisting of from 0.05 to 0.6 percent by weight of titanium, from 0.05 to 0.6 percent by weight of cobalt and the balance is copper and unavoidable impurities, the weight ratio of Ti/Co being from 1/1 to 1.5/1.

5. An electronic component made of an alloy as claimed in claim 4.

6. A lead frame for transistors and integrated circuits, said lead frame being made of an alloy as claimed in claim 4.

7. An alloy consisting of from 0.2 to 0.5 percent by weight of titanium, from 0.2 to 0.5 percent by weight of cobalt and the balance being copper and unavoidable impurities, the weight ratio of Ti/Co being from 1/1 to 1.5/1.

8. An electronic component made of an alloy as claimed in claim 7.

9. A lead frame for transistors and integrated circuits, said lead frame being made of an alloy as claimed in claim 7.