Low power circuitry components

• US 4,734,315 A
• Filed: 06/05/1986
• Issued: 03/29/1988
• Est. Priority Date: 06/05/1985
• Status: Expired due to Fees

• Current Assignee: Space-Bate; Joyce Florence
• Original Assignee: Space-Bate; Joyce Florence
• Inventors: Spence-Bate, Harry A. H.
• Primary Examiner(s): Kittle, John E.
• Assistant Examiner(s): Ryan, Patrick J.
• Application Number:
  US06/870,996
• Time in Patent Office: 663 Days
• Field of Search: 428/195, 428/209, 428/901, 428/131, 174/16 R, 361/383, 361/384, 361/412, 361/414
• US Class Current: 428/209
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24273 including aperture
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A low power electrical circuitry component is made from several laminae stacked one on top of the next; at least two of the laminae are provided with circuitry, suitably printed circuitry with electrical connections between circuit elements of the circuitry on one lamina interconnected with those elements of the next or subsequent such laminae by means of connections substantially perpendicular to the planes of the laminae; apertures or recesses may be formed in some of the laminae to provide holders for wafers and other circuitry items so that the laminae provide a strong frame and encapsulation for wafers and so on; ducts may be provided in or between laminae for cooling.

Claims

1. A low power circuitry component comprising a plurality of laminae held together contiguously in a stack, each lamina carrying electrical conductors so arranged that no conductors of different said laminae cross and wherein inter-connections between conductors of different said lamine are made in a direction substantially perpendicular to a plane of the laminae and, gas ducting within the stack of laminae whereby a coolant may be caused to flow through the stack.

2. A component as claimed in claim 1 wherein at least one of the laminae of the stack has at least one recess therein to receive and at least partially enclose a circuit item.

3. A component as claimed in claim 1 wherein at least one of the laminae of the stack has at least one aperture therethrough to receive and at least partially enclose a circuit item.

4. A component as claimed in claim 1 wherein the ducting is formed by grooves in at least one lamina of the stack.

5. A component as claimed in claim 1 wherein at least one of the inter-connections between conductors of different said laminae comprises means for receiving at least one lead of an item within said stack for physical and electrical connection in said circuitry component.