Laser processing method

• US 4,734,550 A
• Filed: 08/19/1986
• Issued: 03/29/1988
• Est. Priority Date: 08/20/1985
• Status: Expired due to Term

• Current Assignee: New Energy and Industrial Technology Development Organizatio
• Original Assignee: Fuji Electric Corporate Research & Development, Ltd. (Fuji Electric Systems Company Limited)
• Inventors: Matsumoto, Noriaki, Imamura, Seiji
• Primary Examiner(s): Albritton, C. L.
• Application Number:
  US06/897,830
• Time in Patent Office: 588 Days
• Field of Search: 219/121 LH, 219/121 LJ, 219/121 LY, 219/121 LA, 219/121 LP, 350/235
• US Class Current: 219/121.77
• CPC Class Codes: B23K 26/066 by using masks
• CPC Class Codes: B23K 26/0732 into a rectangular shape
• CPC Class Codes: B23K 26/0853 Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove

Abstract

A laser processing method comprises the steps of generating a pulsed laser beam having a substantially circular shape; modifying the beam to a substantially rectangular shape; and scribing the surface of a workpiece with the rectangular beam to form grooves therein. The scribing step may include scanning the surface with the beam in a predetermined pattern, and aligning two parallel sides of the rectangular beam in parallel with the direction of the scanning. The beam may be made square, or may have unequal sides with the longer sides preferably arranged in parallel with the scanning direction.

Claims

1. A laser processing method for scribing the surface of a workpiece, said method comprising:

generating a laser beam;

modifying said beam to have a substantially rectangular shape; and

scribing said surface of said workpiece with said rectangular beam to form a groove in said surface, said scribing step including periodically moving said rectangular beam relative to and along said surface, each movement of said beam causing said beam to irradiate a portion of said surface to form said groove, each of said portions overlapping an adjacent one of said portions by a predetermined amount.

2. The laser processing method of claim 1, wherein said rectangular beam has a first set of parallel sides, and said scribing step includes moving said beam relative to said surface in a predetermined pattern while maintaining said first set of parallel sides substantially in parallel with the direction of said movement.

3. The method of claim 2, wherein said rectangular beam has a second set of parallel sides shorter than said first set of parallel sides, and said scribing step includes maintaining said second set of parallel sides substantially perpendicular to said direction of movement.

4. The method of claim 2, wherein said rectangular beam has sides of equal length.

5. The method of claim 2, wherein said beam modifying step includes,

passing said beam through a rectangular aperture of a field stop to form said rectangular beam, and

focusing said rectangular beam with a condenser lens.

6. The method of claim 2, wherein said beam modifying step includes transforming said beam to have a rectangular shape and substantially uniform energy density.

7. The method of claim 6, wherein said transforming step includes,

enlarging the diameter of said laser beam with a collimator lens to cause said beam to have substantially uniform energy density;

and

passing said enlarged diameter beam through an aperture of a field stop.

8. The method of claim 5, wherein the focal length of said condenser lens is in the range of about 10 to about 15 mm.