Method of manufacturing a curvilinear array of ultrasonic transducers

• US 4,734,963 A
• Filed: 11/13/1986
• Issued: 04/05/1988
• Est. Priority Date: 12/08/1983
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Ishiyama, Kazufumi
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US06/930,104
• Time in Patent Office: 509 Days
• Field of Search: 29/25.35, 310/800, 310/334, 310/335, 310/357-359, 310/320, 310/365
• US Class Current: 29/25.35
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: G10K 11/32 characterised by the shape of the source
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A curvilinear array of ultrasonic transducers primarily for use in a medical diagnostic apparatus by which divergent ultrasonic beams are transmitted without resorting to sector scanning techniques to steer the ultrasonic beam. The curvilinear array of ultrasonic transducers includes a flexible transducer assembly bonded to a curvilinear surface of backing base. The flexible transducer assembly includes a flexible backing plate and an array of ultrasonic transducers elements disposed on the flexible backing. The array is formed of a transducer plate having grooves cut through to the flexible backing plate to isolate the transducer elements.

Claims

1. A method of manufacturing a convex array of ultrasonic transducers, comprising the following steps in the stated order:

bonding a flexible printed circuit board having electrode lead patterns to a portion of a rear surface of a flat transducer plate;

bonding said rear surface of said transducer plate having said electrode lead patterns bonded thereto to one side of a flexible backing plate to sandwich said flexible print cirucit board between said flexible backing plate and said transducer plate;

cutting through said transducer plate and said flexible printed circuit board at least through to the flexible backing plate between said electrode lead patterns to produce an array of transducer elements; and

bending said flexible backing plate around a convex surface of a backing base and bonding the other side of said flexible backing plate to said convex surface.

2. The method according to claim 1, comprising:

dividing said flexible printed circuit board into a plurality of separated slips after said cutting step; and

bending said slips of said flexible printed circuit board around a side surface of said backing plate in a direction generally perpendicular to said transducer elements.

3. The method according to claim 1, wherein the other side of said flexible backing plate is temporarily fixed to a flat rigid base while said transducer plate is cut.

4. The method according to claim 1, further comprising bonding a first matching layer to a front surface of said transducer plate before cutting said transducer plate.