Integrated oscillator and microstrip antenna system

• US 4,736,454 A
• Filed: 09/15/1983
• Issued: 04/05/1988
• Est. Priority Date: 09/15/1983
• Status: Expired due to Fees

• Current Assignee: Ball Corporation
• Original Assignee: Ball Corporation
• Inventors: Hirsch, Vincent A.
• Primary Examiner(s): Blum, Theodore M.
• Application Number:
  US06/532,556
• Time in Patent Office: 1,664 Days
• Field of Search: 455/129, 455/124, 343/700 MS File, 343/6.8 R, 343/7 PF, 343/6.5 SS, 343/18 E, 343/18 D, 331/107 SL, 331/108 D, 333/33
• US Class Current: 455/129
• CPC Class Codes: H01Q 1/247 with frequency mixer, e.g. for direct satellite reception or Doppler radar
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H03B 5/1847 the active element in the amplifier being a semiconductor device
• CPC Class Codes: H03B 5/1852 the semiconductor device being a field-effect device
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H

Abstract

A three-element active device is physically and electrically integrated (e.g., by soldering) onto shaped conductive areas in a thin conformable microstrip structure which includes a microstrip antenna radiator. Two of the elements of the active device are connected to microstrip reactance structures which form a series-resonant partial oscillator circuit. The third (output) element of the active device is connected directly to the microstrip antenna radiator via a microstrip transmission line which, together, directly provide the r.f. load impedance for the thus completed oscillator circuit. Quarter wavelength r.f. microstrip segments are also provided to facilitate the feeding of d.c. bias to the active device without disturbing the r.f. circuitry. The oscillator load impedance to be provided by the microstrip radiator is predetermined in accordance with conventional device-line or loadpull impedance measurements so as to maximize the power output of the active device.

Claims

1. An integrated oscillator and microstrip antenna system comprising:

a 3-element active device;

an electrically conductive reference surface;

a shaped single layer of conductive surfaces spaced from said reference surface by a distance substantially less than one-fourth wavelength at the intended operating frequency of the system;

said conductive surfaces including a microstrip radiator means and microstrip transmission line means directly connected as a load to an element of said active device without impedance matching to the microstrip transmission line means which radiator means and microstrip transmission line means together directly present a predetermined r.f. load impedance at said intended operating frequency; and

the three elements of said active device beign elecrically and mechanically connected to said conductive surfaces to form an oscillator circuit having a load impedance provided directly by said microstrip radiator means and said microstrip transmission line means without any impedance matching to the transmission line means,

wherein said microstrip transmission line means is dimensioned for electrically transforming the impedance of the microstrip radiator means connected thereto into the predetermined r.f. load impedance at said intended operating frequency and for presenting said predetermined impedance to said active device element.

2. An integrated oscillator and microstrip antenna system as in claim 1 wherein said transmission line means is connected at one end to one element of said active device and connected at its other end to a predetermined point on the periphery of the microstrip radiator means having a first predetermined impedance and wherein said transmision line means has a length dimension which transforms the said first predetermined impedance of the microstrip radiator means to the predetermined r.f. load impedance for the oscillator required to maximize the power output of the active device.

3. An integrated oscillator and microstrip antenna system as in claim 1 or 2 wherein second and third elements of said active device are respectively connected to second and third portions of said shaped single layer of conductive surfaces, said second and third portions being formed to provide respective r.f. impedances which, together, define a substantially resonant series r.f. circuit at said intended operating frequency.

4. An integrated oscillator and microstrip antenna system as in claim 3 wherein said third element of the active device is provided with two electrical contacts and wherein said third portion of the shaped single layer of conductive surfaces includes two separate areas electrically connected in parallel to said third element respectively via its two electrical contacts.

5. An integrated oscillator and microstrip antenna system as in claim 3 wherein said shaped single layer of conductive surfaces further comprises:

first and second r.f. choke/d.c. bias feed means individually electrically connected to two respective ones of the elements of the active device for feeding electrical d.c. bias currents to the active device without substantially loading the resonant series r.f. circuit.

6. An integrated oscillator and microstrip antenna system as in claim 5 wherein said first and second r.f. choke/d.c. bias feed means each comprise two successive quarter wavelength (at the intended operating frequency) segments, the first of which has a relatively higher r.f. impedance than the other segment and wherein a connection to a d.c. bias is made at the juncture of these two segments.

7. An integrated oscillator and microstrip antenna system as in claim 3 wherein said second portion of said shaped single layer of conductive surfaces provides a substantially capacitive reactance at the intended operating frequency and wherein said third portion of said shaped single layer of conductive surfaces provides a substantially inductive reactance at the intended operating frequency.

8. An integrated oscillator and microstrip antenna system as in claim 7 wherein said third element of the active device is provided with two electrical contacts and wherein said third portion of the shaped single layer of conductive surfaces includes two separate areas electrically connected in parallel with each other at said third element respectively via its two electrical contacts.

9. An integrated oscillator and microstrip antenna system as in claim 7 wherein said shaped single layer of conductive surfaces further comprises:

first and second r.f. choke/d.c. bias feed means individually electrically connected to two respective ones of the elements of the active device for feeding electrical d.c. bias currents to the active device without substantially loading the resonant series r.f. circuit.

10. An intended oscillator and microstrip antenna system as in claim 9 wherein said first and second r.f. choke/d.c. bias feed means each comprise two successive quarter wavelength (at the intended operating frequency) segments, the first of which has a reIatively higher r.f. impedance than the other segment and wherein a connection to a d c. bias is made at the juncture of these two segments.

19. A system as in claim 1 wherein said active device produces oscillations at said intended operating frequency only when said microstrip transmission line means is directly connected to said active device.

20. A system as in claim 1 wherein:

said microstrip radiator means includes an edge, and

said microstrip transmission line means is directly conected to said radiator means edge and rotates the radiator means edge impedance to said predetermined r.f. load impedance.

21. A system as in claim 1 wherein said radiator means and microstrip transmission line means together directly present a predetermined r.f. load impedance substantially equal to the negative of the output impedance of said active device at said intended operating frequency.

22. A system as in claim 1 wherein said microstrip transmission line means comprises a linear elongated conductive surface having substantially uniform width and is directly connected at one end thereof to said radiator means and directly connected at the other end thereof to said active device;

and

the length of said microstrip transmission line means is dimensioned such that said transmission line means transforms the impedance of the microstrip radiator means connected at said one end of the predetermined r.f. load impedance at said other end.

23. A system as in claim 1 wherein said microstrip transmission line means comprises an elongated strip of said conductive surfaces having substantially uniform width and spaced from said reference surface by a distance substantially less than 1/4 wavelength at the intended operating frequency.

27. A system as in claim 1 wherein said microstrip transmission line means comprises a linear elongated conductive surface having substantially uniform width and is connected at one end thereof to said first connection pad, and the length of said thereof to said first connection pad, and the length of said microstrip transmission line means is dimensioned such that said transmission line means transforms the impedance of the microstrip radiator means connected at said one end to the predetermined r.f.load impedance at said other end thereof.

29. A system as in claim 1 wherein the length of said microstrip transmission line means is optimized so as to maximize the output power radiated by said microstrip radiator means at said intended operating frequency.

11. An integrated oscillator and microstrip antenna system comprising:

(a) a conductive reference surface;

(b) a dielectric layer overlyng said reference surface and having a thickness substantially less than one-fourth wavelength at the intended operating frequency of the system;

(c) a shaped single layer conductive surface overlying and supported by said dielectric layer above said reference surface and wherein said shaped single layer conductive surface includes;

(i) at least one microstrip radiator means having a resonant dimension at said intended operating frequency and defining at least one radiating slot between an edge of the radiator means and the underlying reference surface,

(ii) microstrip transmission line means extending from the periphery of said at least one radiator means to a first connection pad, and

(iii) a second connection pad and at least one third connection pad extending to respectively associated microstrip reactance and bias feed circuitry; and

(d) a 3-element active device having at least three connection areas electrically connected respectively to said first, second and third connection pads;

said radiator means, through said microstrip transmission line means, directly providing the predetermined load impedance for the remainder of the system required to cause the active device to oscillate with delivery of substantially maximum output power at said intended operating frequency without impedance matching to the transmission line means, said microstrip transmission means being dimensioned for electrically transforming the impedance of the radiator means to the predetermined load impedance for the active device at said intended operating frequency.

12. An integrated oscillator and microstrip antenna system as in claim 11 wherein said active device is a bipolar junction transistor having base, emitter and collector elements and having its collector element electrically connected to said first connection pad.

13. An integrated oscillator and microstrip antenna system as in claim 12 wherein said emitter element is connected to said second connection pad and wherein said second connection pad extends back through a first tuning capacitance section of microstrip circuitry and two successive quarter wavelength (at the intended operating frequency) microstrip transmission line segments, the first one of which has a relatively higher r.f. impedance and wherein a connection to a d.c. emitter bias is made at the junction of these two line segments, wherein the tuning capacitance segment provides an r.f. frequency tuning capacitance, the first quarter wavelength segment provides an r.f. choke inductance and the second quarter wavelength segment provides an r.f. bypass capacitance.

14. An integrated oscillator and microstrip antenna system as in claim 12 or 13 wherein two successive quarter wavelength (at the intended operating frequency) microstrip transmission line segments extend from said transmission line means, a first one of which has a relatively higher r.f. impedance and wherein a connection to a d.c. collector bias is made at the juncture of these line segments, wherein the first one of the segments provides an r.f. choke inductance and the second segment provides an r.f. bypass capacitance.

15. An integrated oscillator and microstrip antenna system as in claim 14 wherein said base element is connected to said third connection pad which extends back through a microstrip transmission line to an r.f. electrical connection to the underlying reference surface which thereby connects an inductive r.f. impedance between said base element and said reference surface.

16. An integrated oscillator and microstrip antenna system as in claim 15 wherein said base element of the active device has electrically common contact areas at opposite sides of the active element and wherein said shaped conductive surface includes a fourth connection pad opposingly disposed but substantially identical in shape and electrical characteristics to said third connection pad, said third and fourth connection pads being connected respectively to the electrical contact areas of said base element located at opposite sides of the active element.

17. An integrated oscillator and microstrip antenna system as in claim 12 or 13 wherein said base element is connected to said third connection pad which extends back through a microstrip transmission line to an r.f. electrical connection to the underlying reference surface which thereby connects an inductive r.f. impedance between said base element and said reference surface.

18. An integrated oscillator and microstrip antenna system as in claim 17 wherein said base element of the active device has electrical contact areas at opposite sides of the active element and wherein said shaped conductive surface includes a fourth connection pad opposingly disposed but substantially identical in shape and electrical characteristics to said third connection pad, said third and fourth connection pads being connected respectively to the electrical contact areas of said base element located at opposite sides of the active element.

24. A system as in claim 11 wherein said active device produces oscillations at said intended operating frequency only when said microstrip transmission line means is directly connected to said active device.

25. A system as in claim 11 wherein said microstrip transmission line means rotates the radiator means edge impedance to said predetermined r.f. load impedance at said intended operating frequency.

26. A system as in claim 11 wherein said radiator means and microstrip transmission line means together directly present a predetermined r.f. load impedance substantially equal to the negative of the output impedance of said active device at said intended operating frequency.

28. A system as in claim 11 wherein said microstrip transmission line means compriss an elongated strip of said conductive surace having substantially uniform width and spaced from said reference surface by a distance substantially less then 1/4 wavelength at the intended operating frequency.

30. A system as in claim 11 wherein the length of said microstrip transmission line means is optimized so as to maximize the output power radiated by said microstrip radiator means at said intended operating frequency.

31. An integrated oscillator and microstrip antenna system for radiating RF signals at an intended radio operating frequency, said system comprising:

oscillator means for producing radio frequency signals at said intended operating frequency, said oscillator means including an active device having an output element and at least two additional elements, said oscillator means delivering a maximum signal output at said intended operating frequency when an optimum RF load impedance is connected to said active device output element;

an electrically conductive reference surface;

a shaped single layer of conductive surfaces spaced from said reference surface by a distance substantially less than one-fourth wavelength at said intended operating frequency, the elements of said active device being electrically and mechanically connected to said conductive surfaces;

microstrip radiator means comprising a first portion of said conductive surfaces for radiating said radio frequency signals, said conductive surfaces first portion defining a terminal point thereon, said conductive surfaces first portion being dimensioned such that approximately said optimum RF load impedance exists at said terminal point; and

microstrip transmission line means for coupling said radio frequency signals from said active device output terminal to said microstrip radiator means terminal point, said microstrip transmission line means comprising an elongated strip of conductive surface spaced from said reference surface by a distance substantially less than one-fourth wavelength at said intended operating frequency, said strip having first and second ends, said strip first end being directly electrically and mechanically connected to said active device output element, said strip second end being directly electrically and mechanically connected to said microstrip radiator means terminal point, no additional impedance matching elements being connected between said microstrip transmission line means and said active device output element, no additional impedance matching elements being connected between said microstrip transmission line means and said microstrip radiator means, said microstrip radiator means and microstrip transmission line means together directly presenting substantially said optimum RF load impedance at said intended operating frequency to said active device output element, aid microstrip transmission line means being dimensioned for electrically transforming the RF load impedance presented at the microstrip radiator means terminal point into substantially the optimum RF load impedance at said intended operating frequency and for directly presenting said substantially optimum impedance to said active device output element.

32. A system as in claim 31 wherein said microstrip radiator means includes an edge having a notch defined therein which modifies the load impedance said radiator means presents at said terminal point.

33. A system as in claim 31 wherein said transmission line means has a length dimension which is one-half wavelength at said intended operating frequency plus an addition length which electrically transforms the RF load impedance presented at the microstrip radiator means terminal point into substantially the optimum RF load impedance at said intended operating frequency.

34. A system as in claim 31 wherein said microstrip radiator means and said oscillator means are physically postioned with respect to one another so as to facilitate directly connecting said transmission line means therebetween without additional impedance matching elements.