Anisotropically conductive composite medium

• US 4,737,112 A
• Filed: 09/05/1986
• Issued: 04/12/1988
• Est. Priority Date: 09/05/1986
• Status: Expired due to Term

• Current Assignee: American Telephone & Telegraph Company (AT&T, Inc.), Bell Telephone Laboratories, Inc. (Nokia Corporation)
• Original Assignee: American Telephone & Telegraph Company (AT&T, Inc.)
• Inventors: Seger, Stephen G. Jr., Jin, Sungho, Tiefel, Thomas H., Mottine, John J. Jr., Sherwood, Richard C.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US06/903,729
• Time in Patent Office: 585 Days
• Field of Search: 339/17 M, 339/59 M, 339/61 M, 339/DIG. 3, 264/24, 264/108, 428/900, 156/272.4, 439/65-74, 439/91
• US Class Current: 439/66
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/29355 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/29357 Cobalt [Co] as principal constituent
• CPC Class Codes: H01L 2224/2936 Iron [Fe] as principal constituent
• CPC Class Codes: H01L 2224/29439 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29444 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01R 12/714 : with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 13/03 : characterised by the material, e.g. plating, or coating materials
• CPC Class Codes: H01R 13/2414 : conductive elastomers
• CPC Class Codes: H01R 4/04 : using electrically conductive adhesives
• CPC Class Codes: H05K 2201/083 : Magnetic materials
• CPC Class Codes: H05K 2203/104 : Using magnetic force, e.g. to align particles or for a temporary connection during processing
• CPC Class Codes: H05K 3/323 : by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: Y10S 428/90 : Magnetic feature
• CPC Class Codes: Y10T 428/2857 : including metal or compound thereof or natural rubber

Abstract

Electrical interconnection is established by means of an anisotropically conductive, composite layer medium comprising electrically conductive particles in a nonconductive matrix material. Enhanced uniformity of conductivity across the medium, and minimized incidence of lateral shorting are achieved as a result of essentially uniform distribution of electrically conductive particles which are also magnetic, such distribution resulting upon application of a magnetic field essentially perpendicular to a layer before or during hardening of the matrix material.

Claims

1. Device comprising a first component and a second component, said first component having a first surface comprising a first electrical contact, and said second component having a second surface comprising a second electrical contact,

at least a first portion of said first electrical contact facing at least a second portion of said second electrical contact,

the space between said first portion and said second portion being occupied essentially in an electrical interconnection layer which consists essentially of a composite material,

said composite material comprising essentially spherical, electrically conductive particles in single-layer arrangement in a nonconductive matrix material such that particles individually form electrical connections between said first portion and said second portion,

said device being characterized in that said particles comprise a magnetic material,

distribution of said particles in said layer, individually or in pairs, being essentially uniform laterally as resulting from the application of an essentially uniform magnetic field essentially perpendicular to said layer before or during hardening of said matrix material.

2. Device of claim 1 in which said essentially nonconductive material is an elastomeric material.

3. Device of claim 1 in which said essentially nonconductive material is an adhesive material.

4. Device of claim 1 in which said essentially nonconductive material is a glassy material.

5. Device of claim 1 in which said essentially nonconductive material is a thermoplastic material.

6. Device of claim 1 in which a surface portion of said electrically conductive particles comprises a corrosion-resistant material.

7. Device of claim 1 in which a surface portion of said electrically conductive particles is easily deformable.