Unit carrying surface acoustic wave devices

• US 4,737,742 A
• Filed: 12/15/1986
• Issued: 04/12/1988
• Est. Priority Date: 01/28/1986
• Status: Expired due to Fees

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Sone, Takehiko, Takoshima, Takehiro
• Primary Examiner(s): Nussbaum, Marvin L.
• Application Number:
  US06/941,414
• Time in Patent Office: 484 Days
• Field of Search: 333/194, 333/195, 333/196, 333/193, 333/150, 333/151, 333/152, 333/153, 333/154, 361/412, 361/395, 361/396, 361/397, 361/399, 361/400-406, 361/411, 361/418, 310/313 R, 310/313 A, 310/313 B, 310/313 C, 310/313 D, 364/821, 29/25.35, 174/68.5
• US Class Current: 333/150
• CPC Class Codes: H03H 2009/0019 Surface acoustic wave multichip
• CPC Class Codes: H03H 9/0557 the other elements being buried in the substrate
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Abstract

A unit comprising a printed board on which a plurality of surface acoustic wave (SAW) devices are installed. Each SAW device comprises a piezoelectric substate on which arrays of strip electrodes are formed. A cover is mounted over the SAW devices to hermetically seal the surfaces of the SAW devices on which the electrodes are formed. The terminals of the board are directly coupled to the terminals of the SAW devices.

Claims

1. A hermetically sealed unit for carrying surface acoustic wave devices, comprising:

a printed circuit board having a substrate with a given surface area on which circuit patterns including circuit terminals are formed;

a spacer layer provided on the periphery of the surface of the printed circuit board surrounding the surface area and circuit patterns thereon;

a plurality of surface acoustic wave devices each having a piezoelectric substrate on which at least one pair of strip shaped electrodes with connecting terminals are formed, said devices being mounted on the surface of the printed circuit board with the connecting terminals thereof joined physically and electrically to corresponding circuit terminals of the circuit patterns thereon;

a cover sealed by adhesive to the spacer layer on the printed circuit board for hermetically sealing the surface of the printed circuit board on which the surface acoustic wave devices are mounted; and

a peripheral edge of the printed circuit board being formed with semicircular cutout portions provided with external terminals which are electrically connected to the circuit terminals of the circuit patterns and to the connecting terminals of the surface acoustic wave devices, thereby allowing the surface acoustic wave devices to be electrically connected to external circuits through said external terminals while maintaining the hermetic seal of said carrying unit.

2. A unit as set forth in claim 1, wherein the surfaces of the surface acoustic wave devices on which the electrodes are formed are covered with an insulating film except for the terminals.

3. A unit as set forth in claim 2, wherein the insulating film is made from at least one material selected from the group consisting of SiO₂, Si₃ N₄, Ta₂ O₅, Al₂ O₃, ZrO₂, TiO₂, and TaN.

4. A unit as set forth claim 1 wherein the printed board is a multilayer printed board having laminated, printed circuit substrate layers.

5. A unit as set forth in claim 2, wherein the printed board is a multilayer printed board having laminated, printed circuit substrate layers.

6. A unit as set forth in any claim 3, wherein the printed board is a multilayer printed board having laminated, printed circuit substrate layers.