Method and apparatus for correcting rotational errors during inspection of reticles and masks

• US 4,737,920 A
• Filed: 11/28/1984
• Issued: 04/12/1988
• Est. Priority Date: 11/30/1983
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nippon Kogaku K. K. (Nikon Corporation)
• Inventors: Ozawa, Haruo
• Primary Examiner(s): Lall, Parshotam S.
• Assistant Examiner(s): Juffernbruch, Daniel W.
• Application Number:
  US06/675,897
• Time in Patent Office: 1,231 Days
• Field of Search: 364/488, 364/489, 364/490, 364/491, 364/525, 356/400, 356/401, 356/394, 356/397, 356/372, 356/150, 382/44, 382/45, 382/46, 358/101, 901/46, 901/47, 355/53
• US Class Current: 356/394
• CPC Class Codes: G03F 7/70616 Monitoring the printed patterns

Abstract

A method and apparatus for inspecting masks and reticles by simplifying rotational alignment thereof so as to shorten alignment time is proposed wherein a rotational angle representing a rotational error between a reference substrate and a substrate to be inspected is measured in advance, the substrate to be inspected being provided with the same circuit patterns as those of the reference substrate in one-to-one correspondence, a position of a stage having these substrates thereon is automatically measured, and a measurement error caused by the rotational error can be automatically corrected, thereby providing accurate measured values.

Claims

1. An apparatus for correcting rotational alignment errors in the inspection of two substrates to determine differences between corresponding patterns thereon, said apparatus comprising:

(a) stage means for disposing both of said substrates thereon;

(b) moving means for moving said stage means along a rectangular coordinates system;

(c) means for producing an image of each of said substrates disposed on said stage means and for superposing said images;

(d) position detecting means responsive to said stage means for detecting the position of said stage means within said rectangular coordinates system and for generating output signals;

(e) first displacement means for providing a relative displacement between the produced images of said substrates in one direction;

(f) second displacement means for providing a relative displacement between the produced images of said substrates in another direction which is perpendicular to said one direction;

(g) displacement detecting means responsive to said first and second displacement means for detecting the relative displacements of said images in said directions and for generating output signals;

(h) memory means; and

(i) calculating means for calculating a relative rotational angle of said substrates on said stage means on the basis of output signals of said position detecting means and said displacement detecting means and for providing said calculated angle to said memory means for storage therein, said calculating means subsequently calculating correction values for providing corrected values of measured relative displacements between positions of corresponding points on said images, respectively, on the basis of said calculated angle stored in said memory means.

2. An apparatus according to claim 1, wherein said first displacement means and said second displacement means are operative to provide said relative displacements between the images of said substrates without moving said substrates.

3. An apparatus according to claim 2, wherein each of said first and second displacement means includes a plane parallel plate, respectively.

4. An apparatus according to claim 3, which further comprises display means responsive to said calculating means for displaying said corrected values.

5. A method of correcting relative rotational alignment errors of a pair of substrates having corresponding patterns thereon that are compared to determine differences between said patterns, and in which measurements are made of displacements between selected corresponding points on said patterns, which comprises:

(a) disposing both of said substrates on a stage;

(b) moving said stage along a plane;

(c) detecting the position of said stage along said plane in a two-dimensional coordinate system;

(d) providing an image of each of said substrates disposed on said stage;

(e) providing relative displacements between said images in said two-dimensional coordinate system;

(f) detecting said displacements of said images;

(g) calculating a relative rotational angle of said substrates on said stage in response to said detecting of said position of said stage and said detecting of said image displacements; and

(h) determining from said rotational angle correction values for the correction of measured displacements between positions of corresponding points on said patterns.

6. A method according to claim 5, wherein said calculating of said relative rotational angle comprises superposing said images, moving said stage along said plane in a first coordinate direction to determine a first distance between two points in one of said images along said first direction, relatively displacing said images until one of said two points in one of said images coincides with a corresponding point in the other of said images to determine a second distance along a second coordinate direction perpendicular to said first direction, and determining said relative rotational angle from said distances.

7. A method of correcting relative rotational alignment errors of a pair of substrates having corresponding patterns thereon that are compared to determine differences between said patterns, and in which measurements are made of displacements between selected corresponding points on said patterns, which comprises:

(a) forming an image of each of said substrates;

(b) moving said images in a two-dimensional coordinate system;

(c) calculating in response to the moving of said images a relative rotational angle of said substrates in a plane of said coordinate system, said calculating being performed trigonometrically from the coordinates of a point on one of said images with respect to an origin of said coordinate system and comprising moving said one of said images along two directions parallel to said coordinates, respectively, and measuring corresponding amounts of movement; and

(d) determining from said relative rotational angle correction values for the correction of measured displacements between the positions of corresponding points on said patterns in said coordinate system.

8. A method of correcting relative rotational alignment errors of a pair of substrates having corresponding patterns thereon that are compared to determine differences between said patterns, and in which measurements are made of displacements between selected corresponding points on said patterns, which comprises:

(a) forming an image of each of said substrates;

(b) moving said images in a two-dimensional coordinate system;

(c) calculating in response to the moving of said images a relative rotational angle of said substrates in a plane of said coordinate system, said calculating comprising causing a first point in one of said images to coincide with a corresponding first point in the other of said images at a reference position, moving said images along one of said coordinates to cause a second point in said one image to be disposed at said reference position and measuring the amount of such movement, moving the other image along the other of said coordinates to cause a second point in said other image corresponding to the second point in said one image to be disposed at said reference position and measuring the amount of that movement, and determining the relative rotational angle from the measured amounts of movement; and

(d) determining from said relative rotational angle correction values for the correction of measured displacements between the positions of corresponding points on said patterns in said coordinate system.

9. A method according to claim 8, wherein the first mentioned moving is performed by moving said substrates and wherein the second mentioned moving is performed without moving said substrates.