Shielding apparatus for a printed circuit board

• US 4,739,453 A
• Filed: 03/19/1987
• Issued: 04/19/1988
• Est. Priority Date: 03/20/1986
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kurokawa, Osamu
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US07/027,879
• Time in Patent Office: 397 Days
• Field of Search: 174/51, 174/35 R, 174/68.5, 361/395, 361/399, 361/400, 361/409, 361/410, 361/414, 361/422, 361/424
• US Class Current: 361/816
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218

Abstract

A shielding apparatus for use in a printed circuit board shields electronic circuitry mounted on the printed circuit board against interfering electric waves. The shielding apparatus comprises a multi-layer printed circuit board having a circuit trace printed on a middle layer and a ground trace printed on each of the surface layers. Circuitry blocks consisting of a plurality of electrical elements are mounted on the top surface of the printed circuit board and are electrically connected to one another by the circuit trace. Metallic cases are provided on the top and bottom surfaces of the printed circuit board for covering the circuitry blocks and are in contact with the ground trace.

Claims

1. A shielding apparatus for shielding electric circuitry mounted on a printed circuit board against interfering electric waves comprising:

a multi-layer printed circuit board having a circuit trace printed on a middle layer;

a first circuitry block mounted on an outer surface of said multi-layer printed circuit board, said first circuitry block being electrically connected to said circuit trace, so that said first circuitry block is connected to at least one other circuitry block mounted on said multi-layer printed circuit board via said circuit trace; and

metallic plate means covering said first circuitry block to thereby isolate said first circuitry block from said other circuitry block.

2. A shielding apparatus according to claim 1 wherein said multi-layer printed circuit board further includes a ground trace printed on each of the outer surface layers of the circuit board, said ground trace being in contact with said metallic means.

3. A shielding apparatus according to claim 2 further comprising a contacting material sandwiched between and contacting both said ground trace and said metallic means to ensure firm contact between the ground trace and the metallic means.

4. A shielding apparatus according to claim 2 wherein a plurality of through holes are formed in the printed circuit board so so that said ground trace printed on each of the surface layers are connected to each other by said through holes.

5. A shielding apparatus according to claim 1 wherein said first circuitry block is mounted on the top surface layer of said printed circuit board and said metallic means comprises first and second metallic means, said first metallic means covering said first circuitry block and said second metallic means being provided on the bottom surface layer of the printed circuit board at a location corresponding to the location of said first metallic means.