Micromechanical elements and methods for their fabrication

• US 4,740,410 A
• Filed: 05/28/1987
• Issued: 04/26/1988
• Est. Priority Date: 05/28/1987
• Status: Expired due to Fees

• Current Assignee: Regents of the University of California (University of California)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Muller, Richard S., Tai, Yu C., Fan, Longsheng
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/055,027
• Time in Patent Office: 334 Days
• Field of Search: 156/626, 156/643, 156/644, 156/646, 156/645, 156/651, 156/652, 156/653, 156/656, 156/657, 156/659.1, 156/661.1, 156/662, 156/667, 357/26, 357/65, 357/69, 357/71, 357/76, 174/68.5, 361/400, 361/404, 29/610 SG, 338/2-6, 428/131, 428/133, 428/134, 428/137, 428/138, 428/139, 428/174, 428/596, 428/597, 428/601, 428/603, 346/75, 346/140 R
• US Class Current: 428/133
• CPC Class Codes: B23P 11/00 Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00
• CPC Class Codes: B23P 15/00 Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
• CPC Class Codes: B23P 15/003 bearings see also F16C33/00
• CPC Class Codes: B29C 67/00 Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
• CPC Class Codes: B81B 2201/035 Microgears
• CPC Class Codes: B81C 1/00198 comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
• CPC Class Codes: G03F 7/00 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using photoresist structures for special production processes, see the relevant places, e.g. B44C, H01L, e.g. H01L21/00, H05K
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: Y10T 428/12368 Struck-out portion type
• CPC Class Codes: Y10T 428/1241 Nonplanar uniform thickness or nonlinear uniform diameter [e.g., L-shape]
• CPC Class Codes: Y10T 428/24289 Embedded or interlocked
• CPC Class Codes: Y10T 428/24331 including nonapertured component
• CPC Class Codes: Y10T 428/24628 Nonplanar uniform thickness material

Abstract

A method and the product resulting from the method, for making a microminiature structure with two or more members measuring less than 1000 micrometers in any linear dimension and relatively movable to each other, comprising the steps of (a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate, (b) depositing a first structural layer over the first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate, (c) providing a second sacrificial coating over the second exposed portion of the substrate and said first structural layer, with openings through both the first and second sacrificial layers to expose a third portion of the substrate, (d) adding a second structural layer thereover and defining it, (e) possibly adding alternately other sacrificial coatings and other structural layers, and (f) etching the first and second and other sacrificial layers to remove them completely so that the two or more structural layers become movable relative to each other.

Claims

1. A method for making a microminiature structure with two members measuring less than 100 μ

m in any linear dimension and relatively movable to each other, comprising the steps of;

(a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate,

(b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate,

(c) providing a second sacrificial coating over said second exposed portion of the substrate and said first structural layer, with openings through both the first and second sacrificial layers to expose a third portion of the substrate,

(d) adding a second structural layer thereover and defining it, and

(e) etching the first and second sacrificial layers to remove them completely so that the two structural layers become movable relative to each other.

2. The method of claim 1 wherein said sacrificial coating consists of material selected from the group consisting of silicon oxide, silicon nitride, polyimide, and resists, including photoresists.

3. The method of claim 1 wherein said structural layers consists of material selected from the group consisting of polysilicon, silicon nitride, and silicides.

4. The method of claim 1 wherein said structural layers consist of a metal.

5. The product resulting from the method of claim 1.

6. The product of claim 5 wherein said product is a microminiature pin joint.

7. The product of claim 5 wherein said product is an X-Y micropositioning moving table.

8. The product of claim 5 wherein said product is a micromechanical force or torque transducer.

9. The product of claim 5 wherein said product is a micromechanical ratchet.

10. The product of claim 5 wherein said product is an analog micromechanical computing device.

11. The product of claim 5 wherein said product is a digital micromechanical logic device.

12. The product of claim 5 wherein said product is an accelerometer.

13. The product of claim 5 wherein said product is an engine knock sensor.

14. The product of claim 5 wherein said product is a micromechanical optical shutter.

15. The product of claim 5 wherein said product is a micromechanical fluid valve.

16. A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of:

(a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate,

(b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate,

(c) providing a second sacrificial coating over said second exposed portion of the substrate and said first structural layer, with openings through both the first and second sacrificial layers to expose a third portion of the substrate,

(d) adding a second structural layer thereover and defining it, and

(e) etching the first and second sacrificial layers to remove them completely so that the two polysilicon layers become movable relative to each other.

17. The product resulting from the method of claim 16.

18. A method for making a microminiature device with two members relatively movable to each other, comprising the steps of:

(a) cleaning thoroughly and preparing a substrate wafer,

(b) providing a first sacrificial layer thereon, said layer having a high etching rate in a selected etchant,

(c) providing openings through said first sacrificial layer to expose a portion of the substrate,

(d) depositing over said first sacrificial layer and the exposed portion of the substrate a first structural layer,

(e) defining a selected area of said first structural layer and providing openings through that area of said structural layer and said first sacrificial layer to expose a second portion of said substrate,

(f) coating a second sacrificial layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first structural layer,

(g) providing openings through both said first and second sacrificial layers to expose a third portion of said substrate,

(h) adding a second structural coating to form a second layer thereover and defining it, and

(i) etching the first and second sacrificial layers to remove them completely so that said first and second structural layers become moveable relative to each other.

19. The device of claim 18 wherein said sacrificial coating consists of material selected from the group consisting of silicon oxide, silicon nitride, polyimide, and resists, including photoresists.

20. The device of claim 18 wherein said structural layers consists of material selected from the group consisting of polysilicon, silicon nitride, and silicides.

21. The device of claim 18 wherein said structural layers consist of a metal.

22. The product resulting from the method of claim 18.

23. A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of:

(a) cleaning thoroughly and preparing a substrate wafer,

(b) providing a first sacrificial layer thereon, said layer having a high etching rate in a selected etchant,

(c) providing openings through said first sacrificial layer to expose a portion of the substrate,

(d) depositing over said first sacrificial layer and the exposed portion of the substrate a first structural layer,

(e) defining a selected area of said first structural layer and providing openings through that area of said structural layer and said first sacrificial layer to expose a second portion of said substrate,

(f) coating a second sacrificial layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first structural layer,

(g) providing openings through both said first and second sacrificial layers to expose a third portion of said substrate,

(h) adding a second structural coating to form a second layer thereover and defining it, and

(i) etching the first and second sacrificial layers to remove them completely so that said first and second structural layers become movable relative to each other.

24. The pin joint resulting from the method of claim 23.

25. A method for making a microminiature device with at least two members relatively movable to each other, comprising the steps of:

(a) cleaning thoroughly and preparing a silicon substrate wafer,

(b) providing a first layer of an oxide thereon, said oxide having a high etching rate in a selected etching acid,

(c) providing openings through said first oxide layer to expose a portion of said substrate,

(d) depositing over said first oxide layer and the exposed portion of said substrate a first layer of polysilicon,

(e) defining a selected area of said first layer of polysilicon and providing openings through that area of said first polysilicon layer and said first oxide layer, to expose a second portion of the base substrate,

(f) coating a second oxide layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon,

(g) providing openings through both the first and second oxide layers to expose a third portion of said substrate,

(h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and

(i) etching said first and second oxide layers to remove them completely, so that the first and second polysilicon layers become movable relative to each other.

26. The device resulting from the method of claim 25.

27. A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of;

(a) cleaning thoroughly and preparing a silicon substrate wafer,

(b) providing a first layer of an oxide thereon, said oxide having a high etching rate in a selected etching acid,

(c) providing openings through said first oxide layer to expose a portion of said substrate,

(d) depositing over said first oxide layer and the exposed portion of said substrate a first layer of polysilicon,

(e) defining a selected area of said first layer of polysilicon and providing openings through that area of said first polysilicon layer and said first oxide layer, to expose a second portion of the base substrate,

(f) coating a second oxide layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon,

(g) providing openings through both the first and second oxide layers to expose a third portion of said substrate,

(h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and

(i) etching said first and second oxide layers to remove them completely, so that the first and second polysilicon layers become movable relative to each other.

28. The pin joint resulting from the method of claim 27.

29. A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of:

(a) cleaning thoroughly and preparing a silicon substrate wafer,

(b) providing a first layer of phosphosilicate glass thereon,

(c) providing openings through said first phosphosilicate glass layer to expose a portion of said substrate,

(d) depositing over said first phosphosilicate glass layer and the exposed portion of said substrate a first layer of polysilicon,

(e) defining a selected area of said first layer of layer polysilicon and providing openings through that area of said first polysilicon layer and said first layer of coating to expose a second portion of said substrate,

(f) coating a second phosphosilicate glass layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon,

(g) providing openings through both the first and second layers of phosphosilicate glass to expose a third portion of said substrate,

(h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and

(i) etching said first and second phosphosilicate glass layers to remove them completely, so that said first and second polysilicon layers become movable relative to each other.

30. The pin joint resulting from the method of claim 29.

31. A method for making a microminiature device having at least two members relatively movable to each other, comprising the steps of:

(a) cleaning thoroughly and preparing a silicon substrate wafer,

(b) providing a first layer of phosphosilicate glass thereon,

(c) providing openings through said first phosphosilicate glass layer to expose a portion of said substrate,

(d) depositing over said first phosphosilicate glass layer and the exposed portion of said substrate a first layer of polysilicon,

(e) defining a selected area of said first layer of layer polysilicon and providing openings through that area of said first polysilicon layer and said first layer of coating to expose a second portion of said substrate,

(f) coating a second phosphosilicate glass layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon,

(g) providing openings through both the first and second layers of phosphosilicate glass to expose a third portion of said substrate,

(h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and

(i) etching said first and second phosphosilicate glass layers to remove them completely, so that said first and second polysilicon layers become movable relative to each other.

32. The device resulting from the product of claim 31.

33. The device of claim 32 wherein the device is a coil spring.

34. The device of claim 32 wherein the device is a spring-restrained pin joint.

35. The device of claim 32 wherein the device is a beam-restrained pin joint.

36. The device of claim 32 wherein the device is a four-joint crank.

37. The device of claim 32 wherein the device is a crank-slot combination.

38. The device of claim 32 wherein the device is a rectangular slide structure with restraining flanges.

39. The device of claim 32 wherein the device is a gear-slide combination with a spring restraining member and gears that mesh with teeth on a sliding element.

40. A method for making a microminiature structure with a plurality of members measuring less than 1000 μ

m in any linear dimension and relatively movable to each other, comprising the steps of;

(a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate,

(b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate,

(c) providing additional sacrificial coatings successively over such exposed portions of substrate and a said structural layer, with openings through said sacrificial layers to expose other portions of the substrate,

(d) adding additional structural layers over each said sacrificial coating and defining it, and

(e) etching the sacrificial layers to remove them completely so that the plurality of structural layers become movable relative to each other.